Wolfspeed’s XM3 module is designed to simplify SiC power modules by creating an all new package that is both high-performance and easy to use. Wolfspeed has developed a high-performance next generation module that is easy to use and has been optimized in a manner that is intended to achieve the maximum performance out of all sizes of commercially available 650–1700 V Wolfspeed C3M™ SiC MOSFETs. It offers the capability to carry high currents (300 to >600 A) in a small footprint (53 x 80 mm) with a terminal arrangement that allows for straight-forward bussing and interconnection. A low-inductance, evenly matched layout results in high quality switching events, minimizing oscillations both internal and external to the module. The module has a stray inductance of only 6.7 nH. When coupled with the low-inductance bussing and capacitors in this reference design, a total loop inductance of 12 nH is obtained, which is lower than the internal stray inductance of many standard power module packages. The XM3 platform offers 40% of the volume and 45% of the footprint of a package that is typically used in the industry as shown in Figure 3-5 and therefore offers a more compact power module for high power density systems. Table 3-3 lists which variant of the XM3 module is included with each three-phase inverter reference design.

Figure 3-5 Size Comparison Between XM3 (Left), 62 mm (Center), and EconoDUAL™(Right)