TIDUF28 November 2023
This reference design is a non-isolated hot-side MCU controlled 3-phase power stage with functional isolation for the top-side GaN-FET drivers only and operates from a supply voltage up to 400 VDC (MAX). Therefore, the PCB is exposed to voltages above 60-VDC and 25-VAC and hence extreme care must be exercised while testing.
This reference design is meant for exploring TI’s GaN-FET technology in a lab space only and to be used by professional engineers, who are qualified to work with high voltage. A high-voltage warning symbol is added to the PCB top and bottom side. Users must make sure proper high-voltage safety precautions are observed before and while testing. Do not directly handle exposed terminals (high voltage or otherwise) while power is turned on. All connections must be done while the reference design is de-energized and not powered-up. Even during operation at room temperature around 25°C, some components and parts of the PCB surface can reach temperatures higher than 100°C. A high temperature warning symbol is added to the PCB top and bottom side. Do not touch the PCB as contact can cause burns.
After removing power from the PCB, let the PCB cool down for some time and make sure the DC-link capacitor is discharged to 0 V before handling the PCB again.
Danger! High Voltage. Electric shock is possible when connecting board to live wire. Board must be handled with care only by a professional person, qualified to work with high voltage. For safety, use of isolated test equipment with overvoltage and overcurrent protection is highly recommended.
Hot surface! Contact can cause burns. Do not touch!
Do not leave the board powered when unattended.