TIDUF31B May   2023  – September 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 MSPM0G1507
      2. 2.3.2 UCC28881
      3. 2.3.3 UCC27712
      4. 2.3.4 TLV9064
      5. 2.3.5 TPS54202
  9. 3System Design Theory
    1. 3.1  High-Voltage Buck Auxiliary Power Supply
    2. 3.2  DC Bus Voltage Sensing
    3. 3.3  Motor Drive Stage
    4. 3.4  Bypass Capacitors
    5. 3.5  Phase Current Sensing With Two or Three Shunt Resistors
    6. 3.6  Phase Current Sensing With a Single Shunt Resistor
    7. 3.7  Hall-Effect Sensor or QEI Interface for Sensored Motor Control
    8. 3.8  DAC for Software Debug
    9. 3.9  Overcurrent Protection
    10. 3.10 Overtemperature Protection
    11. 3.11 Isolated UART port
    12. 3.12 Inverter Peak Power Capability
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
      1. 4.1.1 Hardware Board Overview
      2. 4.1.2 Test Equipment for Board Validation
    2. 4.2 Software Requirements
      1. 4.2.1 Getting Started MSPM0 Firmware
        1. 4.2.1.1 Download and Install Software Required for Board Test
        2. 4.2.1.2 Import the Project Into CCS
        3. 4.2.1.3 Compile the Project
        4. 4.2.1.4 Download Image and Spin Motor
    3. 4.3 Test Results
      1. 4.3.1 Test Setup
      2. 4.3.2 Auxiliary Power Supply Test
      3. 4.3.3 Current Open Loop Test
      4. 4.3.4 Overcurrent Protection Test
      5. 4.3.5 Motor Start-Up Sequence
      6. 4.3.6 Load Test
    4. 4.4 Migrate Firmware to a New Hardware Board
      1. 4.4.1 Configure the PWM, CMPSS, and ADC Modules
      2. 4.4.2 Motor and Control Parameters Tuning
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Tools
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author
  13. 7Revision History

4.3.6 Load Test

A load test was conducted to verify the overall thermal design. Figure 4-16 shows the board temperature rising with a 460W load. The heat sink temperature is only 32°C. Fuse and diode bridge are the hottest locations, but there is still enough margin, and the fuse cover can be removed to provide cooling.

TIDA-010250 Board Temperature RisingWith 460W LoadFigure 4-16 Board Temperature Rising
With 460W Load
TIDA-010250 Test Waveform With 460W LoadFigure 4-17 Test Waveform With 460W Load

Figure 4-17 shows the test waveform with a 460W load and the following channel assignments:

  • CH1(Blue): Observed rotor angle
  • CH2 (Cyan): AC input voltage
  • CH3 (Purple): DC bus voltage
  • CH4 (Green): Current of phase U

Figure 4-18 shows load test setup with a dynamometer.

TIDA-010250 Load Test Setup Figure 4-18 Load Test Setup