TIDUF41A October   2023  – June 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TIOL112
      2. 2.3.2 MSPM0L1306
  9. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 TCD_PHYL_INTF_TRENHIGH and TCD_PHYL_INTF_TRENLOW
      2. 3.3.2 TCD_PHYL_INTF_UARTTRANSDELAY
      3. 3.3.3 TCD_PHYL_INTF_RESPONSETIME
      4. 3.3.4 TCD_PHYL_INTF_ISIRD
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author
  12. 6Revision History

1 System Description

This reference design gives an example implementation of the digital communication interface for sensors or actuators acting as an IO-Link device. The design includes the IO-Link device transceiver (PHY) as well as a microcontroller.

The TIOL112 IO-Link PHY includes a protection circuit according to IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT), and IEC 61000-4-5 (Surge) as well as a 20mA LDO. This allows designers to build simple systems without the need for external protection devices or additional power supplies.

With a MSPM0L1306 microcontroller, it is possible to power the MCU directly from the LDO output of the PHY and have enough headroom left to also connect additional sensors or ADCs.

Besides the power connection between PHY and MCU, the PHY is also connected to an UART peripheral of the microcontroller. The software running on the MCU has to make sure to control the timing accordingly. The internal oscillator with an external timing resistor provides the needed precision to run in COM3 mode and meeting the requirements by the IO-Link standard. This helps to build small systems, because no external crystal is needed.

The overall combination of the TIOL112 EVM in the form of a BoosterPack™ Plug-in Module, together with an MSPM0L1306 LaunchPad™ Development Kit and the IO-Link stack from TEConcept gives an excellent evaluation platform, because all free interfaces are exposed on the BoosterPack™ Plug-in Module headers, allowing the addition of more sensors, ADCs, or other peripherals.