TIDUF41A October   2023  – June 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TIOL112
      2. 2.3.2 MSPM0L1306
  9. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 TCD_PHYL_INTF_TRENHIGH and TCD_PHYL_INTF_TRENLOW
      2. 3.3.2 TCD_PHYL_INTF_UARTTRANSDELAY
      3. 3.3.3 TCD_PHYL_INTF_RESPONSETIME
      4. 3.3.4 TCD_PHYL_INTF_ISIRD
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author
  12. 6Revision History

Description

This reference design gives an example implementation of an IO-Link device interface. The design includes the IO-Link device physical layer (PHY) including a low-dropout (LDO) as well as a low-power microcontroller. This combination supports IO-Link COM3 transfer rate and a cycle time of 400 µs. The MSPM0 microcontroller integrates an internal oscillator, so the MCU is able to run this application without the need of an external crystal, saving cost and space.