TIDUF41A October   2023  – June 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TIOL112
      2. 2.3.2 MSPM0L1306
  9. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 TCD_PHYL_INTF_TRENHIGH and TCD_PHYL_INTF_TRENLOW
      2. 3.3.2 TCD_PHYL_INTF_UARTTRANSDELAY
      3. 3.3.3 TCD_PHYL_INTF_RESPONSETIME
      4. 3.3.4 TCD_PHYL_INTF_ISIRD
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author
  12. 6Revision History

Features

  • Crystal-less operation with internal 32MHz oscillator, supporting COM3 and 400µs cycle time
  • Low-power Arm® Cortex® M0+ microcontroller, running IO-Link device stack developed by TEConcept
  • Two-chip design with PHY internal 20mA LDO
  • Device transceiver with integrated EMC protection according to IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT), and IEC 61000-4-5 (Surge)
  • Limited output driver rise time and fall time to minimize overshoots and EMI