TIDUF60 December   2023

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMS320F2800137
      2. 2.3.2 MSPM0G1507
      3. 2.3.3 TMP6131
      4. 2.3.4 UCC28881
      5. 2.3.5 TPS54202
      6. 2.3.6 TLV9062
      7. 2.3.7 TLV74033
    4. 2.4 System Design Theory
      1. 2.4.1 Hardware Design
        1. 2.4.1.1 Modular Design
        2. 2.4.1.2 High-Voltage Buck Auxiliary Power Supply
        3. 2.4.1.3 DC Link Voltage Sensing
        4. 2.4.1.4 Motor Phase Voltage Sensing
        5. 2.4.1.5 Motor Phase Current Sensing
        6. 2.4.1.6 External Overcurrent Protection
        7. 2.4.1.7 Internal Overcurrent Protection for TMS320F2800F137
      2. 2.4.2 Three-Phase PMSM Drive
        1. 2.4.2.1 Field-Oriented Control of PM Synchronous Motor
          1. 2.4.2.1.1 Space Vector Definition and Projection
            1. 2.4.2.1.1.1 ( a ,   b ) ⇒ ( α , β ) Clarke Transformation
            2. 2.4.2.1.1.2 α , β ⇒ ( d ,   q ) Park Transformation
          2. 2.4.2.1.2 Basic Scheme of FOC for AC Motor
          3. 2.4.2.1.3 Rotor Flux Position
        2. 2.4.2.2 Sensorless Control of PM Synchronous Motor
          1. 2.4.2.2.1 Enhanced Sliding Mode Observer With Phase-Locked Loop
            1. 2.4.2.2.1.1 Mathematical Model and FOC Structure of an IPMSM
            2. 2.4.2.2.1.2 Design of ESMO for the IPMSM
            3. 2.4.2.2.1.3 Rotor Position and Speed Estimation With PLL
        3. 2.4.2.3 Field Weakening (FW) and Maximum Torque Per Ampere (MTPA) Control
        4. 2.4.2.4 Hardware Prerequisites for Motor Drive
          1. 2.4.2.4.1 Motor Current Feedback
            1. 2.4.2.4.1.1 Three-Shunt Current Sensing
            2. 2.4.2.4.1.2 Single-Shunt Current Sensing
          2. 2.4.2.4.2 Motor Voltage Feedback
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Getting Started Hardware
      1. 3.1.1 Hardware Board Overview
      2. 3.1.2 Test Conditions
      3. 3.1.3 Test Equipment Required for Board Validation
    2. 3.2 Getting Started GUI
      1. 3.2.1 Test Setup
      2. 3.2.2 Overview of GUI Software
      3. 3.2.3 Setup Serial Port
      4. 3.2.4 Motor Identification
      5. 3.2.5 Spin Motor
      6. 3.2.6 Motor Fault Status
      7. 3.2.7 Tune Control Parameters
      8. 3.2.8 Virtual Oscilloscope
    3. 3.3 Getting Started C2000 Firmware
      1. 3.3.1 Download and Install Software Required for Board Test
      2. 3.3.2 Opening Project Inside CCS
      3. 3.3.3 Project Structure
      4. 3.3.4 Test Procedure
        1. 3.3.4.1 Build Level 1: CPU and Board Setup
          1. 3.3.4.1.1 Start CCS and Open Project
          2. 3.3.4.1.2 Build and Load Project
          3. 3.3.4.1.3 Setup Debug Environment Windows
          4. 3.3.4.1.4 Run the Code
        2. 3.3.4.2 Build Level 2: Open-Loop Check With ADC Feedback
          1. 3.3.4.2.1 Start CCS and Open Project
          2. 3.3.4.2.2 Build and Load Project
          3. 3.3.4.2.3 Setup Debug Environment Windows
          4. 3.3.4.2.4 Run the Code
        3. 3.3.4.3 Build Level 3: Closed Current Loop Check
          1. 3.3.4.3.1 Start CCS and Open Project
          2. 3.3.4.3.2 Build and Load Project
          3. 3.3.4.3.3 Setup Debug Environment Windows
          4. 3.3.4.3.4 Run the Code
        4. 3.3.4.4 Build Level 4: Full Motor Drive Control
          1. 3.3.4.4.1 Start CCS and Open Project
          2. 3.3.4.4.2 Build and Load Project
          3. 3.3.4.4.3 Setup Debug Environment Windows
          4. 3.3.4.4.4 Run the Code
          5. 3.3.4.4.5 Tuning Motor Drive FOC Parameters
          6. 3.3.4.4.6 Tuning Field Weakening and MTPA Control Parameters
          7. 3.3.4.4.7 Tuning Current Sensing Parameters
    4. 3.4 Test Results
      1. 3.4.1 Load and Thermal Test
      2. 3.4.2 Overcurrent Protection by External Comparator
      3. 3.4.3 Overcurrent Protection by Internal CMPSS
    5. 3.5 Migrate Firmware to a New Hardware Board
      1. 3.5.1 Configure the PWM, CMPSS, and ADC Modules
      2. 3.5.2 Setup Hardware Board Parameters
      3. 3.5.3 Configure Faults Protection Parameters
      4. 3.5.4 Setup Motor Electrical Parameters
    6. 3.6 Getting Started MSPM0 Firmware
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 PCB Layout Recommendations
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
    2. 4.2 Software Files
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

2.3.2 MSPM0G1507

The MSPM0G150x microcontrollers (MCUs) are part of the highly-integrated, ultra-low-power, 32-bit MCU family from mixed-signal processing (MSP) based on the enhanced Arm® Cortex®-M0+ 32-bit core platform operating at up to 80-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from –40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V. The MSPM0G150x devices provide up to 128-KB embedded Flash program memory with built-in error correction code (ECC) and up to 32-KB SRAM with hardware parity option. The devices also incorporate a memory protection unit, seven-channel DMA, math accelerator, and a variety of high-performance analog peripherals such as two 12-bit 4-MSPS ADCs, configurable internal shared voltage reference, one 12-bit 1-MSPS DAC, three high-speed comparators with built-in reference digital-to-analog converters (DACs), two zero-drift, zero-crossover op amps with programmable gain, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as three 16-bit advanced control timers, three 16-bit general purpose timers, one 24-bit high-resolution timer, two windowed-watchdog timers, and one RTC with alarm and calendar mode. These devices provide data integrity and encryption peripherals and enhanced communication interfaces (four UARTs, two I2Cs, two serial-peripheral interfaces (SPIs)).