TIDUF60 December   2023

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMS320F2800137
      2. 2.3.2 MSPM0G1507
      3. 2.3.3 TMP6131
      4. 2.3.4 UCC28881
      5. 2.3.5 TPS54202
      6. 2.3.6 TLV9062
      7. 2.3.7 TLV74033
    4. 2.4 System Design Theory
      1. 2.4.1 Hardware Design
        1. 2.4.1.1 Modular Design
        2. 2.4.1.2 High-Voltage Buck Auxiliary Power Supply
        3. 2.4.1.3 DC Link Voltage Sensing
        4. 2.4.1.4 Motor Phase Voltage Sensing
        5. 2.4.1.5 Motor Phase Current Sensing
        6. 2.4.1.6 External Overcurrent Protection
        7. 2.4.1.7 Internal Overcurrent Protection for TMS320F2800F137
      2. 2.4.2 Three-Phase PMSM Drive
        1. 2.4.2.1 Field-Oriented Control of PM Synchronous Motor
          1. 2.4.2.1.1 Space Vector Definition and Projection
            1. 2.4.2.1.1.1 ( a ,   b ) ⇒ ( α , β ) Clarke Transformation
            2. 2.4.2.1.1.2 α , β ⇒ ( d ,   q ) Park Transformation
          2. 2.4.2.1.2 Basic Scheme of FOC for AC Motor
          3. 2.4.2.1.3 Rotor Flux Position
        2. 2.4.2.2 Sensorless Control of PM Synchronous Motor
          1. 2.4.2.2.1 Enhanced Sliding Mode Observer With Phase-Locked Loop
            1. 2.4.2.2.1.1 Mathematical Model and FOC Structure of an IPMSM
            2. 2.4.2.2.1.2 Design of ESMO for the IPMSM
            3. 2.4.2.2.1.3 Rotor Position and Speed Estimation With PLL
        3. 2.4.2.3 Field Weakening (FW) and Maximum Torque Per Ampere (MTPA) Control
        4. 2.4.2.4 Hardware Prerequisites for Motor Drive
          1. 2.4.2.4.1 Motor Current Feedback
            1. 2.4.2.4.1.1 Three-Shunt Current Sensing
            2. 2.4.2.4.1.2 Single-Shunt Current Sensing
          2. 2.4.2.4.2 Motor Voltage Feedback
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Getting Started Hardware
      1. 3.1.1 Hardware Board Overview
      2. 3.1.2 Test Conditions
      3. 3.1.3 Test Equipment Required for Board Validation
    2. 3.2 Getting Started GUI
      1. 3.2.1 Test Setup
      2. 3.2.2 Overview of GUI Software
      3. 3.2.3 Setup Serial Port
      4. 3.2.4 Motor Identification
      5. 3.2.5 Spin Motor
      6. 3.2.6 Motor Fault Status
      7. 3.2.7 Tune Control Parameters
      8. 3.2.8 Virtual Oscilloscope
    3. 3.3 Getting Started C2000 Firmware
      1. 3.3.1 Download and Install Software Required for Board Test
      2. 3.3.2 Opening Project Inside CCS
      3. 3.3.3 Project Structure
      4. 3.3.4 Test Procedure
        1. 3.3.4.1 Build Level 1: CPU and Board Setup
          1. 3.3.4.1.1 Start CCS and Open Project
          2. 3.3.4.1.2 Build and Load Project
          3. 3.3.4.1.3 Setup Debug Environment Windows
          4. 3.3.4.1.4 Run the Code
        2. 3.3.4.2 Build Level 2: Open-Loop Check With ADC Feedback
          1. 3.3.4.2.1 Start CCS and Open Project
          2. 3.3.4.2.2 Build and Load Project
          3. 3.3.4.2.3 Setup Debug Environment Windows
          4. 3.3.4.2.4 Run the Code
        3. 3.3.4.3 Build Level 3: Closed Current Loop Check
          1. 3.3.4.3.1 Start CCS and Open Project
          2. 3.3.4.3.2 Build and Load Project
          3. 3.3.4.3.3 Setup Debug Environment Windows
          4. 3.3.4.3.4 Run the Code
        4. 3.3.4.4 Build Level 4: Full Motor Drive Control
          1. 3.3.4.4.1 Start CCS and Open Project
          2. 3.3.4.4.2 Build and Load Project
          3. 3.3.4.4.3 Setup Debug Environment Windows
          4. 3.3.4.4.4 Run the Code
          5. 3.3.4.4.5 Tuning Motor Drive FOC Parameters
          6. 3.3.4.4.6 Tuning Field Weakening and MTPA Control Parameters
          7. 3.3.4.4.7 Tuning Current Sensing Parameters
    4. 3.4 Test Results
      1. 3.4.1 Load and Thermal Test
      2. 3.4.2 Overcurrent Protection by External Comparator
      3. 3.4.3 Overcurrent Protection by Internal CMPSS
    5. 3.5 Migrate Firmware to a New Hardware Board
      1. 3.5.1 Configure the PWM, CMPSS, and ADC Modules
      2. 3.5.2 Setup Hardware Board Parameters
      3. 3.5.3 Configure Faults Protection Parameters
      4. 3.5.4 Setup Motor Electrical Parameters
    6. 3.6 Getting Started MSPM0 Firmware
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 PCB Layout Recommendations
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
    2. 4.2 Software Files
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

4.1.3 PCB Layout Recommendations

This reference design is implemented using a PCB with two-layer, 2-oz copper with the bottom-side SMD component placement to save cost and board area. There are several important aspects to remember while designing the PCB. In the following bullets, system-level placement and layout of each block is explained.

  • Separate components (or singles) into high and low voltage, high and low current, high and low independence groups. Place and route low-voltage and high-impedance components and signals together, such as microcontroller-related signals and the input side of IPM. Use a whole copper pour to provide an integrated GND plane for these area. AC input, filter, and rectifiers and IPM output sides are high-voltage, high-current and low-impedance parts and signals, route them with wider traces or copper pours to provide high-current paths, and also separate them from above low voltage and high-impedance signals to reduce interference.
  • Components in the high power path are kept on the outer edges of the PCB with the minimum distance possible. The microcontroller is placed at the center considering the optimum distance from all the power blocks that need to be controlled. Pin assignment is set to minimize the control signal or feedback signal trace distance and the crossing between analog and digital signals.
  • AC Line Protection and EMI Filter
    • AC line protection components are closely placed within the minimum distance to the connection path. Earth connection guarding is provided around protection and EMI filter circuit.
  • Motor Drive
    • For the high ripple requirement, the motor drive is placed as close as possible to the film capacitor and DC bus capacitor bank.
    • The low-side shunt resistor method with four-wire sensing is implemented for current sensing. A differential pair with impedance matching resistor is used to connect the sensing signal from the shunt resistors to the op-amp circuit. Shunt resistors are placed near the module with an immediate ground copper plane connection.
  • Auxiliary Power Supply
    • The GND of the auxiliary power supply connects the DC bus capacitor bank directly and independently to separate low current from high current and high frequency GND trace for the inverter.