TIDUF68 February   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG2100
      2. 2.3.2 INA241A
      3. 2.3.3 LMR38010
  9. 3System Design Theory
    1. 3.1 Three-Phase GaN Inverter Power Stage
      1. 3.1.1 LMG2100 GaN Half-Bridge Power Stage
    2. 3.2 Inline Shunt Precision-Phase Current Sensing With INA241A
    3. 3.3 Phase Voltage and DC Input Voltage Sensing
    4. 3.4 Power-Stage PCB Temperature Monitor
    5. 3.5 Power Management
      1. 3.5.1 48V to 5V DC/DC Converter
      2. 3.5.2 5V to 3.3V Rail
    6. 3.6 Interface to Host MCU
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
      1. 4.1.1 TIDA-010936 PCB Overview
      2. 4.1.2 TIDA-010936 Jumper Settings
      3. 4.1.3 Interface to C2000™ MCU LaunchPad™ Development Kit
    2. 4.2 Software Requirements
    3. 4.3 Test Setup
    4. 4.4 Test Results
      1. 4.4.1 Power Management and System Power Up and Power Down
    5. 4.5 GaN Inverter Half-Bridge Module Switch Node Voltage
      1. 4.5.1 Switch Node Voltage Transient Response at 48V DC Bus
        1. 4.5.1.1 Output Current at ±1A
        2. 4.5.1.2 Output Current at ±10A
      2. 4.5.2 Impact of PWM Frequency to DC-Bus Voltage Ripple
      3. 4.5.3 Efficiency Measurements
      4. 4.5.4 Thermal Analysis
      5. 4.5.5 No Load Loss Test (COSS Losses)
  11. 5Design and Documentation Support
    1. 5.1 Design Files [Required Topic]
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Layout Prints
      4. 5.1.4 Altium Project
      5. 5.1.5 Gerber Files
      6. 5.1.6 Assembly Drawings
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author
  13. 7Recognition

3.4 Power-Stage PCB Temperature Monitor

To sense the temperature of the PCB power stage, the TMP61 family of thermistors is selected because these devices offer ±1% from 0°C to +70°C with 0402 and 0603 package options. The TMP6131 device is placed close to the LMG2100 half-bridge module. Based on the design tool, select a 10kΩ resistor as the pullup resistor. The analog output signal of the TMP6131 is low-pass filtered with R57 (20Ω) and C68 (2.2nF) and routed to connector J1-18 to connect to the C2000 MCU integrated ADC. The signal can be used for real-time PCB temperature sensing and overtemperature protection through the C2000 MCU.


GUID-20240220-SS0I-Q18B-DNCD-HGZSVL6JKD3T-low.svg

Figure 3-5 PCB Temperature Sense Through Thermistor