TIDUF77 June   2024 MSPM0G1507

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMS320F2800137
      2. 2.3.2 MSPM0G1507
      3. 2.3.3 DRV7308
      4. 2.3.4 UCC28911
      5. 2.3.5 TLV9062
      6. 2.3.6 TLV74033
      7. 2.3.7 ISO6721B
      8. 2.3.8 TMP6131
    4. 2.4 System Design Theory
      1. 2.4.1 Hardware Design
        1. 2.4.1.1 Modular Design
        2. 2.4.1.2 Auxiliary Flyback Power Supply
        3. 2.4.1.3 DC Link Voltage Sensing
        4. 2.4.1.4 Inrush Current Protection
        5. 2.4.1.5 Motor Phase Voltage Sensing
        6. 2.4.1.6 Motor Phase Current Sensing
        7. 2.4.1.7 Over Current Protection of DRV7308
        8. 2.4.1.8 Internal Overcurrent Protection for TMS320F2800F137
      2. 2.4.2 Three-Phase PMSM Drive
        1. 2.4.2.1 Field-Oriented Control of PM Synchronous Motor
          1. 2.4.2.1.1 Space Vector Definition and Projection
            1. 2.4.2.1.1.1 ( a ,   b ) ⇒ ( α , β ) Clarke Transformation
            2. 2.4.2.1.1.2 α , β ⇒ ( d ,   q ) Park Transformation
          2. 2.4.2.1.2 Basic Scheme of FOC for AC Motor
          3. 2.4.2.1.3 Rotor Flux Position
        2. 2.4.2.2 Sensorless Control of PM Synchronous Motor
          1. 2.4.2.2.1 Enhanced Sliding Mode Observer With Phase-Locked Loop
            1. 2.4.2.2.1.1 Mathematical Model and FOC Structure of an IPMSM
            2. 2.4.2.2.1.2 Design of ESMO for the IPMSM
            3. 2.4.2.2.1.3 Rotor Position and Speed Estimation With PLL
        3. 2.4.2.3 Field Weakening (FW) and Maximum Torque Per Ampere (MTPA) Control
        4. 2.4.2.4 Hardware Prerequisites for Motor Drive
          1. 2.4.2.4.1 Motor Current Feedback
            1. 2.4.2.4.1.1 Three-Shunt Current Sensing
            2. 2.4.2.4.1.2 Single-Shunt Current Sensing
          2. 2.4.2.4.2 Motor Voltage Feedback
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Getting Started Hardware
      1. 3.1.1 Hardware Board Overview
      2. 3.1.2 Test Conditions
      3. 3.1.3 Test Equipment Required for Board Validation
    2. 3.2 Getting Started GUI
      1. 3.2.1 Test Setup
      2. 3.2.2 Overview of GUI Software
      3. 3.2.3 Setup Serial Port
      4. 3.2.4 Motor Identification
      5. 3.2.5 Spin Motor
      6. 3.2.6 Motor Fault Status
      7. 3.2.7 Tune Control Parameters
      8. 3.2.8 Virtual Oscilloscope
    3. 3.3 Getting Started C2000 Firmware
      1. 3.3.1 Download and Install Software Required for Board Test
      2. 3.3.2 Opening Project Inside CCS
      3. 3.3.3 Project Structure
      4. 3.3.4 Test Procedure
        1. 3.3.4.1 Build Level 1: CPU and Board Setup
          1. 3.3.4.1.1 Start CCS and Open Project
          2. 3.3.4.1.2 Build and Load Project
          3. 3.3.4.1.3 Setup Debug Environment Windows
          4. 3.3.4.1.4 Run the Code
        2. 3.3.4.2 Build Level 2: Open-Loop Check With ADC Feedback
          1. 3.3.4.2.1 Start CCS and Open Project
          2. 3.3.4.2.2 Build and Load Project
          3. 3.3.4.2.3 Setup Debug Environment Windows
          4. 3.3.4.2.4 Run the Code
        3. 3.3.4.3 Build Level 3: Closed Current Loop Check
          1. 3.3.4.3.1 Start CCS and Open Project
          2. 3.3.4.3.2 Build and Load Project
          3. 3.3.4.3.3 Setup Debug Environment Windows
          4. 3.3.4.3.4 Run the Code
        4. 3.3.4.4 Build Level 4: Full Motor Drive Control
          1. 3.3.4.4.1 Start CCS and Open Project
          2. 3.3.4.4.2 Build and Load Project
          3. 3.3.4.4.3 Setup Debug Environment Windows
          4. 3.3.4.4.4 Run the Code
          5. 3.3.4.4.5 Tuning Motor Drive FOC Parameters
          6. 3.3.4.4.6 Tuning Field Weakening and MTPA Control Parameters
          7. 3.3.4.4.7 Tuning Current Sensing Parameters
    4. 3.4 Test Results
      1. 3.4.1  Fast and clean Rising/Falling Edge
      2. 3.4.2  Inrush Current Protection
      3. 3.4.3  Thermal performance under 300VDC
      4. 3.4.4  Thermal performance under 220VAC
      5. 3.4.5  Overcurrent Protection by Internal CMPSS
      6. 3.4.6  IPM Efficiency with External Bias Supply under 300VDC
      7. 3.4.7  Board Efficiency with Onboard Bias Supply under 300VDC
      8. 3.4.8  Board Efficiency with External Bias Supply under 220VAC
      9. 3.4.9  Board Efficiency with Onboard Bias Supply under 220VAC
      10. 3.4.10 iTHD Test of Motor Phase Current
      11. 3.4.11 Standby Power Test
    5. 3.5 Migrate Firmware to a New Hardware Board
      1. 3.5.1 Configure the PWM, CMPSS, and ADC Modules
      2. 3.5.2 Setup Hardware Board Parameters
      3. 3.5.3 Configure Faults Protection Parameters
      4. 3.5.4 Setup Motor Electrical Parameters
    6. 3.6 Getting Started MSPM0 Firmware
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 PCB Layout Recommendations
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
    2. 4.2 Software Files
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

Key System Specifications

The TIDA-010273 specifications are listed in Table 1-1.

Table 1-1 Key System Specifications
ParametersTEST CONDITIONSMINNOMMAXUNIT
SYSTEM INPUT CHARACTERISTICS
Input Voltage (VINAC)165230265VAC
Input Frequency (fLINE)475063Hz
No Load Standby Power (PNL)VINAC = 230V, Iout = 0A0.12W
Input Current (IIN)VINAC = 230V, Iout

= IMAX

3A
MOTOR INVERTER CHARACTERSITICS
PWM switching frequency (fSW)1530kHz
Rated output power (POUT)VINAC = nom250W
Output current (IRMS)VINAC = nom3A
Inverter efficiency (Ƞ)VINAC = nom, POUT

= nom

99%
Motor electrical frequency (f)VINAC = min to max20200500Hz
Fault protectionsOvercurrent, stall with recovery, undervoltage, overvoltage
Drive control method and featuresSensorless-FOC with three or single shunt resistors for current sensing
SYSTEM CHARACTERISTICS
Built-in auxiliary power supplyVINAC = min to max15V ±10%, 100mA , 3.3V ±10%, 300mA
Operating ambientOpen frame–102555°C
Board sizeLength × width × height85mm × 55mm × 60mmmm3
WARNING:

TI intends this reference design to be operated in a lab environment only and does not consider the device to be a finished product for general consumer use.

TI Intends this reference design to be used only by qualified engineers and technicians familiar with risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

High voltage! There are accessible high voltages present on the board. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled or applied. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property.

Hot surface! Contact can cause burns. Do not touch! Some components can reach high temperatures > 55°C when the board is powered on. The user must not touch the board at any point during operation or immediately after operating, as high temperatures can be present.

CAUTION: Do not leave the design powered when unattended.