TIDUF78 May   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   Design Images
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
  9. 3System Design Theory
    1. 3.1 Hardware Design
    2. 3.2 Software Design
      1. 3.2.1 TMAG5170 SPI Frame
        1. 3.2.1.1 Serial Data In 32-Bit Frame
        2. 3.2.1.2 Serial Data Out 32-Bit Frame
      2. 3.2.2 TMAG5170 Register Configuration
      3. 3.2.3 SPI and Start-of-Conversion Timing
      4. 3.2.4 Linear Position Calculation
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware
      1. 4.1.1 PCB Overview
      2. 4.1.2 MCU Interface Connector
    2. 4.2 Test Setup
    3. 4.3 Test Results
      1. 4.3.1 Magnetic Z and X Field Measurement
      2. 4.3.2 Linear Position Measurement
      3. 4.3.3 SPI Signal Measurement
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout
        1. 5.1.3.1 Layout Prints
        2. 5.1.3.2 Layout Guidelines
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author

Features

  • Single-chip 3D Hall-effect sensor with integrated ADC and SPI interface reduce BOM and PCB size.
  • Linear position accuracy typically ±0.15mm over 100mm range help achieve more precise linear motor transport systems.
  • 3D Hall-effect sensors with configurable sensitivity ±25mT to ±100mT and ±75mT to ±300mT to help optimize measurement range and accuracy.
  • Sample rates up to 8 kHz at low latency of 57.5us and 10MHz SPI enable higher speed position control.
  • Dedicated ALERT pin enables simultaneous start-of-conversion of X,Y,Z axis across multiple 3D Hall-effect sensors.
  • 3D Hall-effect sensors diagnostics features help detect and report both system and device-level failures.