TIDUF84 June   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 UCC28810
      2. 2.3.2 MCF8315
      3. 2.3.3 MSPM0L
      4. 2.3.4 MSPM0C
  9. 3System Design Theory
    1. 3.1 MCF8315 Design
      1. 3.1.1 Power section
      2. 3.1.2 GPIO section
    2. 3.2 ACDC Design: Single Stage PFC
    3. 3.3 Host MCU Design
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
      1. 4.1.1 Hardware Overview
      2. 4.1.2 TIDA-010951 PCB
    2. 4.2 Software Requirements
    3. 4.3 Testing requirements
    4. 4.4 Test Setup
    5. 4.5 Test Results
      1. 4.5.1 Power Management in TIDA-010951
      2. 4.5.2 UCC28810 Based Single Stage PFC
      3. 4.5.3 BLDC Residential Fan Operation Using MCF8315C
        1. 4.5.3.1 Power-Up Sequence
        2. 4.5.3.2 Forward Windmilling (ISD Forward Resync)
        3. 4.5.3.3 Reverse Windmilling (ISD Reverse Resync)
        4. 4.5.3.4 Direction Reversal
        5. 4.5.3.5 Fan Acceleration/Deceleration
      4. 4.5.4 Thermal Performance
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author
  13. 7Recognition

1.1 Key System Specifications

Parameter

Value

Comment
1-phase AC input voltage (RMS) 85-265V, 230V(typ.) Designed for 230V RMS, 50Hz 1pH AC input systems
Max. output power from 24V 50W
Input current THD (at 230V, 35W fly-back output power) <10%
Power factor (at 230V, 35W fly-back output power) 0.95
Input current THD at (140-265V), 35W fly-back output power) <12.5% THD across operating input voltage range at full load
Power factor at (140-265V), 35W fly-back output power)

> 0.92

 Power factor across operating input voltage range at full load
PCB layer stack 2-Layer
PCB size Ø85mm
Non-isolated MCU (MSPM0L) interface to host processor 3.3V I/O
WARNING:

TI intends this reference design to be operated in a lab environment only and does not consider the device to be a finished product for general consumer use.

TI Intends this reference design to be used only by qualified engineers and technicians familiar with risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

High voltage! There are accessible high voltages present on the board. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled or applied. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property.

Hot surface! Contact can cause burns. Do not touch! Some components can reach high temperatures > 55°C when the board is powered on. The user must not touch the board at any point during operation or immediately after operating, as high temperatures can be present.

CAUTION:

Do not leave the design powered when unattended.