TIDUFA8 November   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 IWRL6432
    3. 2.3 Design Considerations
      1. 2.3.1 Reference Design Features
    4. 2.4 IWRL6432 Reference Design Architecture
      1. 2.4.1 IWRL6432: BOM Optimized Design
        1. 2.4.1.1 Device Power Topology
      2. 2.4.2 Power Distribution Network
      3. 2.4.3 Internal LDOs
        1. 2.4.3.1 Enabling and Disabling Low Power Mode
        2. 2.4.3.2 1.4V Power Supplies: APLL and Synthesizer
          1. 2.4.3.2.1 APLL 1.4V
          2. 2.4.3.2.2 SYNTHESIZER 1.4V
        3. 2.4.3.3 1.2V Power Supplies
          1. 2.4.3.3.1 RF 1.2V Supply
        4. 2.4.3.4 RF 1.0V Power Supply
      4. 2.4.4 Component Selection
        1. 2.4.4.1 1.8V DC-DC Regulator
          1. 2.4.4.1.1 Need for Forced PWM Mode Switching
          2. 2.4.4.1.2 Importance of Spread Spectrum Clocking
        2. 2.4.4.2 3.3V Low Dropout Regulator
        3. 2.4.4.3 FLASH Memory
        4. 2.4.4.4 Crystal
  9. 3System Design Theory
    1. 3.1 Antenna Specification
      1. 3.1.1 Antenna Requirements
      2. 3.1.2 Antenna Orientation
      3. 3.1.3 Bandwidth and Return Loss
      4. 3.1.4 Antenna Gain Plots
    2. 3.2 Antenna Array
      1. 3.2.1 2D Antenna Array With 3D Detection Capability
      2. 3.2.2 1D Antenna Array With 2D Detection Capability
    3. 3.3 PCB
      1. 3.3.1 Via-in-Pad Elimination
      2. 3.3.2 Micro-Via Process Elimination
    4. 3.4 Configuration Parameters
      1. 3.4.1 Antenna Geometry
      2. 3.4.2 Range and Phase Compensation
      3. 3.4.3 Chirp Configuration
    5. 3.5 Schematic and Layout Design Conditions
      1. 3.5.1 Internal LDO Output Decoupling Capacitor and Layout Conditions for BOM Optimized Topology
        1. 3.5.1.1 Single-Capacitor Rail
          1. 3.5.1.1.1 1.2V Digital LDO
        2. 3.5.1.2 Two-Capacitor Rail
          1. 3.5.1.2.1 1.2V RF LDO
        3. 3.5.1.3 1.2V SRAM LDO
        4. 3.5.1.4 1.0V RF LDO
      2. 3.5.2 Best and non-Best Layout Practices
        1. 3.5.2.1 Decoupling Capacitor Placement
        2. 3.5.2.2 Ground Return Path
        3. 3.5.2.3 Trace Width of High Current Carrying Traces
        4. 3.5.2.4 Ground Plane Split
  10. 4Link Budget
  11. 5Hardware, Software, Testing Requirements and Test Results
    1. 5.1 Hardware Requirements
      1. 5.1.1 Connection to the USB to UART Bridges
      2. 5.1.2 USB Cable to Connect to Host PC
      3. 5.1.3 The Rx-Tx Attribution of RS232
    2. 5.2 Software Requirements
    3. 5.3 Test Scenarios
    4. 5.4 Test Results
      1. 5.4.1 Human Detection at 15 Meters in Boresight
      2. 5.4.2 Antenna Radiation Plots
      3. 5.4.3 Angle Estimation Accuracy in Azimuth Plane
      4. 5.4.4 Angle Resolution
  12. 6Design and Documentation Support
    1. 6.1 Design Files
      1. 6.1.1 Schematics
      2. 6.1.2 BOM
      3. 6.1.3 PCB Layout Recommendations
        1. 6.1.3.1 Layout Prints
    2. 6.2 Tools and Software
    3. 6.3 Documentation Support
    4. 6.4 Support Resources
    5. 6.5 Trademarks
  13. 7About the Authors

3.3 PCB

The reference design uses a 4-layer stack-up for the PCB. The stack-up is extremely critical for antenna performance. This section elaborates on the existing stack up and a couple of layout related cost reduction techniques implied.

Figure 3-22 shows the stack-up details of the PCB.


TIDEP-01033 PCB Stack-Up

Figure 3-22 PCB Stack-Up

The antenna resides on the top layer (Lyr 1) of the PCB. This layer has FR408HR dielectric material. Below are a few critical properties of the dielectric:

  1. The dielectric has 2 x 1067 (dual ply) spread glass construction. This structure helps reducing the glass weave effect that helps reducing losses.
  2. Thickness of the dielectric is 5mils (127um). This thickness value is adjusted for impedance matching.
  3. The Dk value of the dielectric is 3.3
  4. This is core material.
Note:
  • The dielectric thickness must not be altered as this can cause impedance mismatch and more reflection of the radiated power.
  • Pre-preg material must not be used for the antenna layer. For the layers in between other than antenna, pre-preg can be used.

Grounded coplanar waveguide (GCPW) transmission lines have been used to carry the RF signals to the antenna. Below are some critical considerations for the antenna layer and the ground layer followed by the same:

  1. Finished copper thickness on the antenna layer is 40um.
  2. Ground plane (below the antenna plane, Layer 2) thickness is 1oz (0.5oz can also be used if 1oz is not available).
  3. PCB surface finish is OSP or immersion silver.
    Note: ENIG surface finish is NOT recommended as this can potentially cause higher insertion losses for the mmWave frequency range.

The overall PCB thickness of the reference design is 1.6mm.

Note: We recommend using the TI stack-up as is. If a different stack-up is desired, 3D EM solvers are recommended and antenna optimization needs to be done.

Following are some of the techniques implied to reduce the cost of PCB design: