TIDUFB8 December   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
    2. 1.2 End Equipment
    3. 1.3 Electricity Meter
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Voltage Measurement – Analog Front End
      2. 2.2.2 Current Measurement Analog Front End
      3. 2.2.3 Input Voltage
      4. 2.2.4 Clock
    3. 2.3 Highlighted Products
      1. 2.3.1 AMC130M02
      2. 2.3.2 MSPM0G1106
      3. 2.3.3 LMK6C
      4. 2.3.4 TLV76133
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software Requirements
      1. 3.2.1 Formulas
      2. 3.2.2 Metrology Software Process
        1. 3.2.2.1 UART for PC GUI Communication
        2. 3.2.2.2 Direct Memory Access (DMA)
        3. 3.2.2.3 ADC Setup
        4. 3.2.2.4 Foreground Process
        5. 3.2.2.5 Background Process
        6. 3.2.2.6 Software Function per_sample_dsp ()
        7. 3.2.2.7 Frequency Measurement and Cycle Tracking
        8. 3.2.2.8 LED Pulse Generation
    3. 3.3 Test Setup
      1. 3.3.1 Power Supply and Jumper Settings
      2. 3.3.2 Viewing Metrology Readings and Calibration
      3. 3.3.3 Calibration
        1. 3.3.3.1 Voltage and Current Offset Calibration
        2. 3.3.3.2 Voltage and Current Gain Calibration
        3. 3.3.3.3 Active Power Gain Calibration
        4. 3.3.3.4 Offset Calibration
        5. 3.3.3.5 Phase Calibration
    4. 3.4 Test Results
      1. 3.4.1 Electricity Meter Metrology Accuracy Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
      6. 4.1.6 Assembly Drawings
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

4.1.3 PCB Layout Recommendations

For this design, follow these general guidelines:

  • Place decoupling capacitors close to the associated pins.
  • Use ground planes instead of ground traces and minimize the cuts in the ground plane, especially near the AMC130M02. In this design, there is a ground plane on both the top and bottom layer for the HGND (high-voltage side). Make sure that there is good stitching between the planes through the liberal use of vias.
  • Keep the two traces to the inputs of each ADC channel symmetrical and as close as possible to each other.
  • Crosstalk from the voltage to current channels can reduce accuracy at lower currents if power offset is not performed.
  • For AMC130M02 devices, place the 0.1μF capacitor closer to the AVDD pin than the 1μF capacitor. Do the same thing for the 0.1μF and 1μF capacitors connected to DVDD.
  • For the oscillator, there must be clean ground underneath and avoid placing any traces. Also, keep high-frequency signals away from the crystal.
  • Use wide traces for power-supply connections.
  • Make sure of the clearance and creepage spacing