1 Features

• TX7332 supports:
  • 32-channel three-level pulser and active transmit/receive (T/R) switch
  • Very low power on-chip beamforming mode:
    • In receive-only mode: 0.45 mW/ch
    • In transmit-receive mode: 16.4 mW/ch
    • In CW mode: 160 mW/ch
    • In global power-down mode: 0.1 mW/ch
• Three-level pulser:
  • Maximum output voltage: ±100 V
  • Minimum output voltage: ±1 V
  • Maximum output current: 1.2 A to 0.3 A
  • Maximum clamp current: 0.5 A to 0.12 A
  • Second harmonic : –45 dBc at 5 MHz
  • CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
  • CW mode close-in phase noise: -154 dBc/Hz at 1 kHz offset for 5-MHz signal
  • –3-dB bandwidth with 2-kΩ || 120-pF load
    • 20 MHz (for ±100-V supply)
    • 25 MHz (for ±70-V supply)
• Active T/R switch with:
  • ON, OFF control signals
  • Bandwidth: 50 MHz
  • HD2: –50 dBc
  • Turnon resistance: 24 Ω
  • Turnon time: 0.5 µs
  • Turnoff time: 1.75 µs
  • Transient glitch: 50 mV_PP
• Off-chip beamformer with:
  • Jitter cleaning using synchronization feature
  • Maximum synchronization clock frequency: 200 MHz
• On-chip beamformer with:
  • Delay resolution: one beamformer clock period
  • Maximum delay: 2¹³ beamformer clock period
  • Maximum beamformer clock speed: 200 MHz
  • On-chip RAM to store
    • 16 delay profiles
    • 32 pattern profiles
• High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
• Automatic thermal shutdown
• No specific power sequencing requirement
• Small package: 260-pin NFBGA (17 mm × 11 mm) with 0.8-mm pitch