This document contains information for the UCC28C40, UCC28C41, UCC28C42, UCC28C43, UCC28C44, and UCC28C45, UCC38C40, UCC38C41, UCC38C42, UCC38C43, UCC38C44, and UCC38C45 SOIC (8), PDIP (8), and VSSOP (8) packages, to aid in a functional safety system design. Information provided are:
Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of
industry reliability standards
Figure 1-1shows the device functional block diagram for reference.
Toggle flip-flop used only in UCCx8C41-Q1, UCCx8C44-Q1, and UCCx8C45-Q1
UCCx8C4x was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
UVLO | MAXIMUM DUTY CYCLE | TEMPERATURE (TA) | ||
---|---|---|---|---|
TURN ON AT 14.5 V TURN OFF AT 9 V SUITABLE FOR OFF-LINE APPLICATIONS | TURN ON AT 8.4 V TURN OFF AT 7.6 V SUITABLE FOR DC/DC APPLICATIONS | TURN ON AT 7 V TURN OFF AT 6.6 V SUITABLE FOR BATTERY APPLICATIONS | ||
UCC28C42 | UCC28C43 | UCC28C40 | 100% | –40°C to 105°C |
UCC38C42 | UCC38C43 | UCC38C40 | 0°C to 70°C | |
UCC28C44 | UCC28C45 | UCC28C41 | 50% | –40°C to 105°C |
UCC38C44 | UCC38C45 | UCC38C41 | 0°C to 70°C |
This section provides Functional Safety Failure In Time (FIT) rates for SOIC (8) package of UCCx8C4x based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate (71.6 mW, 150 mW, 300 mW) | 10, 11, 15 |
Die FIT Rate (71.6 mW, 150 mW, 300 mW) | 3, 4, 7 |
Package FIT Rate (71.6 mW, 150 mW, 300 mW) | 7, 7, 8 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog / mixed | 25 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
This section provides Functional Safety Failure In Time (FIT) rates for PDIP (8) package of UCCx8C4x based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate (71.6 mW, 150 mW, 300 mW) | 22, 22, 25 |
Die FIT Rate (71.6 mW, 150 mW, 300 mW) | 3, 3, 5 |
Package FIT Rate (71.6 mW, 150 mW, 300 mW) | 19, 19, 20 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog / mixed | 20 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
This section provides Functional Safety Failure In Time (FIT) rates for VSSOP (8) package of UCCx8C4x based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate (71.6 mW, 150 mW, 300 mW) | 8, 9, 15 |
Die FIT Rate (71.6 mW, 150 mW, 300 mW) | 4, 5, 11 |
Package FIT Rate (71.6 mW, 150 mW, 300 mW) | 4, 4, 4 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog / mixed | 20 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.