UCCx8C5x Functional Safety FIT Rate, FMD and Pin FMA

1 Overview

This document contains information for - the UCC28C50, UCC28C51, UCC28C52, UCC28C53, UCC28C54, UCC28C55, UCC28C56H, UCC28C56L, UCC28C57H, UCC28C57L, UCC28C58, and UCC28C59, UCC38C50, UCC38C51, UCC38C52, UCC38C53, UCC38C54, UCC38C55 SOIC (8) and VSSOP (8) packages to aid in a functional safety system design. Information provided are:

Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of
industry reliability standards
Component failure modes and their distribution (FMD) based on the primary function of the device
Pin failure mode analysis (Pin FMA)

Figure 1-1shows the device functional block diagram for reference.

Note:

Toggle flip-flop used only in UCCx8C51, UCCx8C54, and UCCx8C55, UCC28C57H, UCC28C57L, and UCC28C59

Figure 1-1 Functional Block Diagram

UCCx8C5x was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

Table 1-1 Device Comparison Table

UVLO			MAXIMUM DUTY CYCLE	TEMPERATURE (T_A)
TURN ON AT 14.5 V TURN OFF AT 9 V SUITABLE FOR OFF-LINE APPLICATIONS	TURN ON AT 8.4 V TURN OFF AT 7.6 V SUITABLE FOR DC/DC APPLICATIONS	TURN ON AT 7 V TURN OFF AT 6.6 V SUITABLE FOR BATTERY APPLICATIONS	MAXIMUM DUTY CYCLE	TEMPERATURE (T_A)
UCC28C52	UCC28C53	UCC28C50	100%	–40°C to 125°C
UCC28C54	UCC28C55	UCC28C51	50%	–40°C to 125°C
UCC38C52	UCC38C53	UCC38C50	100%	0°C to 85°C
UCC38C54	UCC38C55	UCC38C51	50%	0°C to 85°C

UVLO			MAXIMUM DUTY CYCLE	TEMPERATURE (T_A)
TURN ON AT 18.8 V TURN OFF AT 15.5V Suitable for HV applications using GEN-I SiC MOSFET	TURN ON AT 18.8 V TURN OFF AT 14.5V Suitable for HV applications using GEN-II SiC MOSFET	TURN ON AT 16 V TURN OFF AT 12.5V Suitable for HV applications using GEN-III SiC MOSFET	MAXIMUM DUTY CYCLE	TEMPERATURE (T_A)
UCC28C56H	UCC28C56L	UCC28C58	100%	–40°C to 125°C
UCC28C57H	UCC28C57L	UCC28C59	50%	–40°C to 125°C

2 Functional Safety Failure In Time (FIT) Rates

2.1 SOIC (8) Package

This section provides Functional Safety Failure In Time (FIT) rates for SOIC (8) package of UCCx8C5x based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours)
Total Component FIT Rate (71.6 mW, 150 mW, 300 mW)	10, 11, 15
Die FIT Rate (71.6 mW, 150 mW, 300 mW)	3, 4, 7
Package FIT Rate (71.6 mW, 150 mW, 300 mW)	7, 7, 8

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission Profile: Motor Control from Table 11
Power dissipation: 71.6 mW, 150mW, 300mW
Climate type: World-wide Table 8
Package factor (lambda 3): Table 17b
Substrate Material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS Digital, analog / mixed	25 FIT	55°C

The Reference FIT Rate and Reference Virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.