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This document contains information for the TPSI310x-Q1, TPSI311x-Q1, TPSI312x-Q1, and TPSI3133-Q1 family and the TPSI310x, TPSI311x, TPSI312x, and TPSI3133 family (SSOP package) to aid in a functional safety system design. Information provided are:
Functional Block Diagram shows the device functional block diagram for reference.
The device family was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides functional safety failure in time (FIT) rates for the TPSI310x-Q1, TPSI311x-Q1, TPSI312x-Q1, and TPSI3133-Q1 family and the TPSI310x, TPSI311x, TPSI312x, and TPSI3133 family based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total component FIT rate | 19 |
Die FIT rate | 3 |
Package FIT rate | 16 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS/BICMOS ASICs Analog and Mixed = < 50-V supply | 25 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.