SFFS807 June 2024 TCAN3403-Q1 , TCAN3404-Q1
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This document contains information for the TCAN340x-Q1, which are 3.3V controller area network (CAN) transceivers. The TCAN340x-Q1 comes in the SOIC (D), VSON (DRB), and SOT (DDF) packages to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference. TCAN3403-Q1 has the low voltage I/O support at pin 5, while TCAN3404-Q1 has the ultra-low power shutdown mode at pin 5.
The TCAN340x-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides functional safety failure in time (FIT) rates for the TCAN340x-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) 8-pin SOIC (D) | FIT (Failures Per 109 Hours) 8-pin SOT (DDF) | FIT (Failures Per 109 Hours) 8-pin VSON (DRB) |
---|---|---|---|
Total component FIT rate | 9 | 4 | 6 |
Die FIT rate | 2 | 2 | 2 |
Package FIT rate | 7 | 2 | 4 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS/BICMOS ASICs analog and mixed = < 50V supply | 25 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
The failure mode distribution estimation for TCAN340x-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
Transmitter Fail | 62 |
Receiver Fail | 16 |
Power management or state control fail | 10 |
Input/output buffer fail | 12 |