This document contains information for UCC28700-Q1 (SOT-23 (6) package) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference.
UCC28700-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides Functional Safety Failure In Time (FIT) rates for UCC28700-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate (50 mW, 100 mW, 150 mW) | 5, 6, 8 |
Die FIT Rate (50 mW, 100 mW, 150 mW) | 3, 4, 6 |
Package FIT Rate (50 mW, 100 mW, 150 mW) | 2, 2, 2 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog / mixed | 25 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
The failure mode distribution estimation for UCC28700-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
Incorrect Vout Regulation | 30 |
DRV stuck low | 26 |
DRV stuck high | 22 |
No effect | 22 |