The TPS22975 product family consists of two devices: TPS22975 and TPS22975N. Each device is a single-channel load switch that provides a configurable rise time to minimize inrush current. The device contains an N-channel MOSFET that can operate over an input voltage range of 0.6 V to 5.7 V and can support a maximum continuous current of 6 A. The switch is controlled by an on and off input (ON), which is capable of interfacing directly with low-voltage control signals. TPS22975 has an optional 230-Ω on-chip load resistor for quick output discharge when switch is turned off.
The TPS22975 is available in a small, space-saving 2-mm × 2-mm 8-pin SON package (DSG) with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –40°C to +105°C.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS22975 TPS22975N |
WSON (8) | 2.00 mm × 2.00 mm |
Changes from A Revision (June 2016) to B Revision
Changes from * Revision (May 2016) to A Revision
DEVICE | RON AT VIN = VBIAS = 5 V (TYPICAL) | QUICK-OUTPUT DISCHARGE | MAXIMUM OUTPUT CURRENT | ENABLE |
---|---|---|---|---|
TPS22975 | 16 mΩ | Yes | 6 A | Active high |
TPS22975N | 16 mΩ | No | 6 A | Active high |
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1 | VIN | I | Switch input. Input bypass capacitor recommended for minimizing VIN dip. Must be connected to Pin 1 and Pin 2. See the Application and Implementation section for more information |
2 | |||
3 | ON | I | Active high switch control input. Do not leave floating |
4 | VBIAS | I | Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5 V to 5.7 V. See the Application and Implementation section for more information |
5 | GND | — | Device ground |
6 | CT | O | Switch slew rate control. Can be left floating. See the Adjustable Rise Time section under Feature Description for more information |
7 | VOUT | O | Switch output |
8 | |||
— | Thermal Pad | — | Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See the Layout Example section for layout guidelines |