SSZT096 february   2022 TPS22964C , TPS22975 , TPS22992 , TPS22998

 

  1.   1
  2.   2
    1.     3
    2.     Wafer Chip-scale Packaging (WCSP)
    3.     Plastic Packaging with Wire-bond Technology
    4.     Plastic HotRod™ Package
    5.     Conclusion
    6.     Additional Resources
Technical Article

How Innovative Packaging Can Drive Higher Power Density in Load Switches