DATA SHEET
LM3414/HV 1-A, 60-W Common Anode-Capable Constant Current Buck LED Driver Requires No External Current Sensing Resistor
1 Features
- Supports LED Power up to 60 W (1): 18x 3-W HBLEDs
- Requires No External Current Sensing Resistor
- ±3% LED Current Accuracy
- Up to 96% Efficiency
- High Contrast Ratio (Minimum Dimming Current Pulse Width <10 µS)
- Integrated Low-Side N-Channel MOSFET
- Adjustable Constant LED Current From 350 mA to 1000 mA
- Support Analog Dimming and Thermal Fold-Back
- Wide Input Voltage Range:
- 4.5 V to 42 V (LM3414)
- 4.5 V to 65 V (LM3414HV)
- Constant Switching Frequency Adjustable from 250 kHz to 1000 kHz
- Thermal Shutdown Protection
- Power Enhanced SOIC-8 or 3 mm × 3 mm WSON-8 Package
2 Applications
- High Power LED Drivers
- Architectural Lighting, Office Troffers
- Automotive Lighting
- MR-16 LED Lamps
3 Description
The LM3414 and LM3414HV are 1-A 60-W(1) common anode-capable constant current buck LED drivers. They are suitable for driving single string of 3-W HBLED with up to 96% efficiency. They accept input voltages from 4.5 VDC to 65 VDC and deliver up to 1-A average LED current with ±3% accuracy. The integrated low-side N-channel power MOSFET and current sensing element realize simple and low component count circuitry, as no bootstrapping capacitor and external current-sensing resistor are required. An external small-signal resistor to ground provides very fine LED current adjustment, analog dimming, and thermal fold-back functions.
Constant switching frequency operation eases EMI. No external loop compensation network is needed. The proprietary Pulse-Level-Modulation (PLM) control method benefits in high conversion efficiency and true average LED current regulation. Fast response time realizes fine LED current pulse fulfilling the 240 Hz 256-step dimming resolution requirement for general lighting.
The LM3414 and LM3414HV are available in SOIC-8 and 3 mm × 3 mm WSON-8 packages.
Device Information(2)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| LM3414, LM3414HV |
WSON (8) | 3.00 mm × 3.00 mm |
| SOIC (8) | 3.90 mm × 4.89 mm |
- Thermal derating applies according to actual operation conditions.
- For all available packages, see the orderable addendum at the end of the data sheet.
Simplified Application Schematic
4 Revision History
Changes from E Revision (May 2013) to F Revision
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
- Removed soldering information.Go
Changes from D Revision (April 2013) to E Revision
- Changed layout of National Data Sheet to TI formatGo
5 Pin Configuration and Functions
DDA Package
8-Pin SOIC
Top View
NGQ Package
8-Pin WSON
Top View
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| VCC | 1 | O | Internal Regulator Output Pin. This pin should be bypassed to ground by a ceramic capacitor with a minimum value of 1 µF. |
| PGND | 2 | — | Power Ground Pin. Ground for power circuitry. Reference point for all stated voltages. Must be externally connected to EP and GND. |
| IADJ | 3 | I | Average Output Current Adjustment Pin. Connect resistor RIADJ from this pin to ground to adjust the average output current. |
| GND | 4 | — | Analog Ground Pin. Analog ground connection for internal circuitry, must be connected to PGND external to the package. |
| FS | 5 | I | Switching Frequency Setting Pin. Connect resistor RFS from this pin to ground to set the switching frequency. |
| DIM | 6 | I | PWM Dimming Control Pin. Apply logic level PWM signal to this pin controls the intend brightness of the LED string. |
| LX | 7 | O | Drain of N-MOSFET Switch. Connect this pin to the output inductor and anode of the schottky diode. |
| VIN | 8 | I | Input Voltage Pin. The input voltage should be in the range of 4.5 V to 42 V (LM3414) or 4.5 V to 65 V (LM3414HV). |
| EP | EP | — | Thermal Pad (Power Ground). Used to dissipate heat from the package during operation. Must be electrically connected to PGND external to the package. |
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VIN to GND | LM3414 | –0.3 | 42 | V |
| LM3414HV | –0.3 | 65 | ||
| VIN to GND (Transient) | LM3414 | 45 (500 ms) | V | |
| LM3414HV | 67 (500 ms) | |||
| LX to PGND | LM3414 | –0.3 | 42 | V |
| LM3414HV | –0.3 | 65 | ||
| LX to PGND (Transient) | LM3414 | –3 (2 ns) | 45 (500 ms) | V |
| LM3414HV | –3 (2 ns) | 67 (500 ms) | ||
| FS, IADJ to GND | –0.3 | 5 | V | |
| DIM to GND | –0.3 | 6 | V | |
| Storage Temperature | –65 | 125 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| WSON PACKAGE | ||||
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±750 | |||
| SOIC PACKAGE | ||||
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±750 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | LM3414 | 4.5 | 42 | V | |
| LM3414HV | 4.5 | 65 | |||
| Junction temperature | –40 | 125 | °C | ||
6.4 Thermal Information
| THERMAL METRIC(1) | LM3414, LM3414HV | UNIT | ||
|---|---|---|---|---|
| NGQ (WSON) | DDA (SOIC-8) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 47.7 | 50.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 43.1 | 55.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 22.3 | 28.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | 9.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 22.5 | 28.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4 | 3.2 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
MIN and MAX limits apply for TJ = –40°C to 125°C unless specified otherwise. VIN = 24 V unless otherwise indicated.| PARAMETER | TEST CONDITIONS | MIN(1) | TYP(2) | MAX(1) | UNIT | |
|---|---|---|---|---|---|---|
| SYSTEM PARAMETERS - LM3414 | ||||||
| IIN-DIM-HIGH | Operating Current | 4.5 V ≤ Vin ≤ 42 V RIADJ = 3.125 kΩ VDIM = High |
2.2 | 3.2 | 3.5 | mA |
| IIN-DIM-LOW | Standby Current | 4.5 V ≤ Vin ≤ 42 V RIADJ = 3.125 kΩ VDIM = Low |
0.8 | 1.15 | 1.4 | mA |
| ILX-OFF | LX Pin Current | Main Switch Turned OFF VLX = VIN = 42 V |
6 | µA | ||
| SYSTEM PARAMETERS - LM3414HV | ||||||
| IIN-DIM-HIGH | Operating Current | 4.5 V ≤ Vin ≤ 65 V RIADJ = 3.125 kΩ VDIM = High |
2.2 | 3.3 | 3.6 | mA |
| IIN-DIM-LOW | Standby Current | 4.5 V ≤ Vin ≤ 65 V RIADJ = 3.125 kΩ VDIM = Low |
0.8 | 1.2 | 1.45 | mA |
| ILX-OFF | LX Pin Current | Main Switch Turned OFF VLX = VIN= 65 V |
6.5 | µA | ||
| SYSTEM PARAMETERS - LM3414/3414HV | ||||||
| ILED | Average LED Current | RIADJ = 3.125 kΩ TA = 25°C |
0.97 | 1 | 1.03 | A |
| RIADJ = 3.125 kΩ TA = –40°C to 125°C |
0.95 | 1 | 1.05 | A | ||
| VCC-UVLO | Vcc UVLO Threshold | VCC Decreasing, TA = 25°C | 3.6 | 3.75 | 3.9 | V |
| VCC-UVLO-HYS | Vcc UVLO Hysteresis | 300 | mV | |||
| VIADJ | IADJ Pin voltage | 1.23 | 1.255 | 1.280 | V | |
| VDIM | DIM Pin Threshold | VDIM Increasing | 1 | 1.2 | V | |
| VDIM-HYS | DIM Pin Hysteresis | 100 | mV | |||
| fSW | Switching frequency | 250 | 500 | 1000 | kHz | |
| fSW-TOL | Switching frequency tolerance | RFS = 40 kΩ | 420 | 500 | 580 | kHz |
| tON-MIN | Minimum on-time | 400 | ns | |||
| INTERNAL VOLTAGE REGULATOR | ||||||
| VCC | VCC regulator output voltage(3) | CVCC = 1 µF, No Load to IVCC = 2 mA | 4.7 | 5.4 | 6 | V |
| VIN = 4.5 V, 2-mA Load | 3.8 | 4.2 | V | |||
| MAIN SWITCH | ||||||
| RLX | Resistance across LX and GND | Main Switch Turned ON | 1.8 | Ω | ||
| THERMAL PROTECTION | ||||||
| TSD | Thermal shutdown temperature | TJ Rising | 170 | °C | ||
| TSD-HYS | Thermal shutdown temperature hysteresis | TJ Falling | 10 | °C | ||
(1) All limits specified at room temperature (TYP) and at temperature extremes (MIN/MAX). All room temperature limits are 100% production tested. All limits at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical specification represent the most likely parametric norm at 25°C operation.
(3) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading to the pin.
6.6 Typical Characteristics
All curves taken at VIN = 48 V with configuration in typical application for driving twelve power LEDs with ILED = 1 A shown in this data sheet. TA = 25°C, unless otherwise specified.
(6 LED, VIN = 24 V), LM3414HV
(12 LED, VIN = 48 V), LM3414HV
