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  • LM5010A, LM5010A-Q1 High-Voltage 1-A Step-Down Switching Regulator

    • SNVS376F October   2005  – May 2016 LM5010A , LM5010A-Q1

      PRODUCTION DATA.  

  • CONTENTS
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  • LM5010A, LM5010A-Q1 High-Voltage 1-A Step-Down Switching Regulator
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM5010A
    3. 6.3 ESD Ratings: LM5010A-Q1, LM5010-Q0
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 Start-Up Regulator (VCC)
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 ON-Time Control
      6. 7.3.6 Soft Start
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Current Limit
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1  R1 and R2
          2. 8.2.2.1.2  RON, FS
          3. 8.2.2.1.3  L1
          4. 8.2.2.1.4  RCL
          5. 8.2.2.1.5  C1
          6. 8.2.2.1.6  C2 and R3
          7. 8.2.2.1.7  C3
          8. 8.2.2.1.8  C4
          9. 8.2.2.1.9  C5
          10. 8.2.2.1.10 C6
          11. 8.2.2.1.11 D1
        2. 8.2.2.2 Low Output Ripple Configurations
        3. 8.2.2.3 Increasing The Current Limit Threshold
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • PWP|14
    • MPDS370A
Thermal pad, mechanical data (Package|Pins)
  • PWP|14
    • PPTD287A
Orderable Information
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  • snvs376f_pm
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DATA SHEET

LM5010A, LM5010A-Q1 High-Voltage 1-A Step-Down Switching Regulator

1 Features

  • LM5010A-Q1 Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
    • Device Temperature Grade 0: –40°C to 150°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C5
  • Wide 6-V to 75-V Input Voltage Range
  • Valley Current Limit at 1.25 A
  • Programmable Switching Frequency Up To 1 MHz
  • Integrated 80-V N-Channel Buck Switch
  • Integrated High Voltage Bias Regulator
  • No Loop Compensation Required
  • Ultra-Fast Transient Response
  • Nearly Constant Operating Frequency With Line and Load Variations
  • Adjustable Output Voltage
  • 2.5-V, ±2% Feedback Reference
  • Programmable Soft-Start
  • Thermal Shutdown
  • Exposed Thermal Pad for Improved Heat Dissipation

2 Applications

  • Non-Isolated Telecommunications Regulators
  • Secondary Side Post Regulators
  • Automotive Electronics

3 Description

The LM5010Ax step-down switching regulator is an enhanced version of the LM5010 with the input operating range extended to 6-V minimum. The LM5010Ax features all the functions needed to implement a low-cost, efficient, buck regulator capable of supplying in excess of 1-A load current. This high-voltage regulator integrates an N-Channel Buck Switch, and is available in thermally enhanced 10-pin WSON and 14-pin HTSSOP packages. The constant ON-time regulation scheme requires no loop compensation resulting in fast load transient response and simplified circuit implementation. The operating frequency remains constant with line and load variations due to the inverse relationship between the input voltage and the ON-time. The valley current limit detection is set at 1.25 A. Additional features include: VCC undervoltage lockout, thermal shutdown, gate drive undervoltage lockout, and maximum duty cycle limiter.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
LM5010Ax WSON (10) 4.00 mm × 4.00 mm
HTSSOP (14) 4.40 mm × 5.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Basic Step-Down Regulator

LM5010A LM5010A-Q1 20153843.gif

4 Revision History

Changes from E Revision (February 2013) to F Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from D Revision (February 2013) to E Revision

  • Changed layout of National Data Sheet to TI formatGo

5 Pin Configuration and Functions

DPR Package
10-Pin WSON
Top View
PWP Package
14-Pin HTSSOP
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME WSON HTSSOP
BST 2 3 I Boost pin for bootstrap capacitor: Connect a capacitor from SW to the BST pin. The capacitor is charged from VCC through an internal diode during the buck switch OFF-time.
EP — — — Exposed pad
FB 6 9 I Voltage feedback input from the regulated output: Input to both the regulation and overvoltage comparators. The FB pin regulation level is 2.5 V.
ISEN 3 4 I Current sense: During the buck switch OFF-time, the inductor current flows through the internal sense resistor, and out of the ISEN pin to the free-wheeling diode. The current limit comparator keeps the buck switch off if the ISEN current exceeds 1.25 A (typical).
NC — 1, 7, 8, 14 — No connection. Can be connected to ground plane to improve heat dissipation.
RON/SD 8 11 I ON-time control and shutdown: An external resistor from VIN to this pin sets the buck switch ON-time. Grounding this pin shuts down the regulator.
RTN 5 6 — Circuit ground: Ground return for all internal circuitry other than the current sense resistor.
SGND 4 5 — Sense ground: Recirculating current flows into this pin to the current sense resistor.
SS 7 10 I Soft start: An internal 11.5-µA current source charges the SS pin capacitor to 2.5 V to softstart the reference input of the regulation comparator.
SW 1 2 O Switching node: Internally connected to the buck switch source. Connect to the inductor, free-wheeling diode, and bootstrap capacitor.
VCC 9 12 I Output of the bias regulator: The voltage at VCC is nominally equal to VIN for VIN < 8.9 V, and regulated at 7 V for VIN > 8.9 V. Connect a 0.47-µF, or larger capacitor from VCC to ground, as close as possible to the pins. An external voltage can be applied to this pin to reduce internal dissipation if VIN is greater than 8.9 V. MOSFET body diodes clamp VCC to VIN if VCC > VIN.
VIN 10 13 I Input supply: Nominal input range is 6 V to 75 V. Input bypass capacitors should be located as close as possible to the VIN pin and RTN pin.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN 6 75 V
VIN to RTN –0.3 76 V
BST to RTN –0.3 90 V
SW to RTN (steady state) –1.5 V
BST to VCC 76 V
BST to SW 14 V
VCC to RTN –0.3 14 V
SGND to RTN –0.3 0.3 V
SS to RTN –0.3 4 V
VIN to SW 76 V
All other inputs to RTN –0.3 7 V
Lead temperature (soldering, 4 sec)(2) 260 °C
Junction temperature (LM5010A, Q1,Q0) –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For detailed information on soldering plastic HTSSOP and WSON packages, see Mechanical, Packaging, and Orderable Information.

6.2 ESD Ratings: LM5010A

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM5010A-Q1, LM5010-Q0

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1)(2) ±2000 V
Charged-device model (CDM), per AEC Q100-011(3) ±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 6 75 V
IO Output current 1 A
Ext-VCC External bias voltage(1) 8 13 V
TJ Operating junction temperature LM5010A –40 125 °C
LM5010A-Q1, LM5010-Q0 –40 150 °C
(1) VCC provides bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.

6.5 Thermal Information

THERMAL METRIC(1) LM5010A, LM5010A-Q1 UNIT
DPR (WSON) PWP (HTSSOP)
10 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 36 41.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.9 26.5 °C/W
RθJB Junction-to-board thermal resistance 13.2 22.5 °C/W
ψJT Junction-to-top characterization parameter 0.3 0.7 °C/W
ψJB Junction-to-board characterization parameter 13.5 22.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3 3.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.6 Electrical Characteristics

Typical values correspond to TJ = 25°C, minimum and maximum limits apply over TJ = –40°C to 125°C, VIN = 48 V, and
RON = 200 kΩ (unless otherwise noted).(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC REGULATOR
VCCReg VCC regulated output 6.6 7 7.4 V
VIN - VCC ICC = 0 mA, FS < 200 kHz,
6 V ≤ VIN ≤ 8.5 V		 100 mV
VCC Bypass threshold VIN increasing 8.9 V
VCC Bypass hysteresis VIN decreasing 260 mV
VCC Output impedance
(0 mA ≤ ICC ≤ 5 mA)		 VIN = 6 V 55 Ω
VIN = 8 V 50
VIN = 48 V 0.21
VCC Current limit VIN = 48 V, VCC = 0 V 15 mA
UVLOVCC VCC undervoltage lockout threshold VCC increasing 5.25 V
UVLOVCC hysteresis VCC decreasing 180 mV
UVLOVCC filter delay 100 mV overdrive 3 µs
IIN Operating current Non-switching, FB = 3 V 675 950 µA
IIN Shutdown current RON/SD = 0 V 100 200 µA
SOFT-START PIN
ISS Internal current source 8 11.5 15 µA
CURRENT LIMIT
ILIM Threshold Current out of ISEN 1 1.25 1.5 A
Resistance from ISEN to SGND 130 mΩ
Response time 150 ns
ON TIMER, RON/SD PIN
Shutdown threshold Voltage at RON/SD rising 0.3 0.7 1.05 V
Threshold hysteresis 40 mV
REGULATION AND OVER-VOLTAGE COMPARATORS (FB PIN)
VREF FB regulation threshold TJ ≤ 125°C 2.445 2.5 2.55 V
TJ ≤ 150°C,
over full operating junction temperature range		 2.435
2.44
FB overvoltage threshold 2.9 V
FB bias current 1 nA
THERMAL SHUTDOWN
TSD Thermal shutdown temperature 175 °C
Thermal shutdown hysteresis 20 °C
(1) All minimum and maximum limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.

6.7 Switching Characteristics

Typical values correspond to TJ = 25°C, minimum and maximum limits apply over TJ = –40°C to 125°C, and VIN = 48 V (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RDS(ON) Buck switch ISW = 200 mA TJ ≤ 125°C 0.35 0.8 Ω
TJ ≤ 150°C,
over full operating junction temperature range		 0.85
UVLOGD Gate drive UVLO VBST - VSW increasing 1.7 3 4 V
UVLOGD Hysteresis 400 mV
OFF TIMER
tOFF Minimum OFF-time 260 ns
ON TIMER
tON - 1 ON-time VIN = 10 V, RON = 200 kΩ 2.1 2.75 3.4 µs
tON - 2 ON-time VIN = 75 V, RON = 200 kΩ 290 390 496 ns
(1) All minimum and maximum limits are specified by correlating the electrical characteristics to process and temperature variations while applying statistical process control.
LM5010A LM5010A-Q1 20153811.gif Figure 1. Start-Up Sequence

6.8 Typical Characteristics

at TA = 25°C (unless otherwise noted)
LM5010A LM5010A-Q1 20153804.gif Figure 2. VCC vs VIN
LM5010A LM5010A-Q1 20153806.gif Figure 4. ICC vs Externally Applied VCC
LM5010A LM5010A-Q1 20153808.gif Figure 6. Voltage at RON/SD Pin
LM5010A LM5010A-Q1 20153805.gif Figure 3. VCC vs ICC
LM5010A LM5010A-Q1 20153807.gif Figure 5. ON-Time vs VIN and RON
LM5010A LM5010A-Q1 20153810.gif Figure 7. IIN vs VIN

 
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