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  • OPA167x Low-Distortion Audio Operational Amplifiers

    • SBOS855E January   2017  – December 2022 OPA1677 , OPA1678 , OPA1679

      PRODUCTION DATA  

  • CONTENTS
  • SEARCH
  • OPA167x Low-Distortion Audio Operational Amplifiers
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA1677
    5. 6.5 Thermal Information: OPA1678
    6. 6.6 Thermal Information: OPA1679
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Electrical Overstress
      3. 7.3.3 EMI Rejection Ratio (EMIRR)
        1. 7.3.3.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Phantom-Powered Preamplifier for Piezo Contact Microphones
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply
          2. 8.2.1.2.2 Input Network
          3. 8.2.1.2.3 Gain
          4. 8.2.1.2.4 Output Network
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Phono Preamplifier for Moving Magnet Cartridges
      3. 8.2.3 Single-Supply Electret Microphone Preamplifier
      4. 8.2.4 Composite Headphone Amplifier
      5. 8.2.5 Differential Line Receiver With AC-Coupled Outputs
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI Reference Designs
        6. 9.1.1.6 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
  11. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • D|8
    • MSOI002K
  • DRG|8
    • MPDS151B
  • DGK|8
    • MPDS028E
Thermal pad, mechanical data (Package|Pins)
  • DRG|8
    • QFND084H
Orderable Information
  • sbos855e_oa
  • sbos855e_pm
search No matches found.
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    • Expanded reading width
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DATA SHEET

OPA167x Low-Distortion Audio Operational Amplifiers

1 Features

  • Low noise: 4.5 nV/√Hz at 1 kHz
  • Low distortion: 0.0001% at 1 kHz
  • High open-loop gain: 114 dB
  • High common-mode rejection: 110 dB
  • Low quiescent current:
    • 2 mA per channel
  • Low input bias current: 10 pA (typical)
  • Slew rate: 9 V/μs
  • Wide gain bandwidth: 16 MHz (G = 1)
  • Unity-gain stable
  • Rail-to-rail output
  • Wide supply range:
    • ±2.25 V to ±18 V, or 4.5 V to 36 V
  • Single, dual, and quad-channel versions
  • Available packages:
    • Single: SOIC-8, SOT-23
    • Dual: SOIC-8, small SON-8, VSSOP-8
    • Quad: Small QFN-16, SO-14, TSSOP-14
  • Temperature range: –40°C to +85°C

2 Applications

  • Professional microphones and wireless systems
  • Professional audio mixer/control surface
  • Guitar amplifier and other music instrument amplifier
  • A/V receiver
  • Automotive external amplifier

3 Description

The single-channel OPA1677, dual-channel OPA1678, and quad-channel OPA1679 (OPA167x) op amps offer higher system-level performance over legacy op amps commonly used in audio circuitry.

The OPA167x amplifiers achieve a low 4.5-nV/√Hz noise density and low distortion of 0.0001% at 1 kHz, which improves audio signal fidelity. These devices also offer rail-to-rail output swing to within 800 mV with a 2-kΩ load, which increases headroom and maximizes dynamic range.

To accommodate the power-supply constraints of many types of audio products, the OPA167x operate over a very-wide supply range of ±2.25 V to ±18 V (or 4.5 V to 36 V) on only 2 mA of supply current. These op amps are unity-gain stable and have excellent dynamic behavior over a wide range of load conditions, allowing the OPA167x to be used in many audio circuits.

The OPA167x amplifiers use completely independent internal circuitry for lowest crosstalk and freedom from interactions between channels, even when overdriven or overloaded.

Device Information
PART NUMBER CHANNELS PACKAGE(1)
OPA1677 Single SOIC (8)
SOT-23 (5)
OPA1678 Dual SOIC (8)
VSSOP (8)
SON (8)
OPA1679 Quad SOIC (14)
TSSOP (14)
QFN (16)
(1) For all available packages, see the package option addendum at the end of the data sheet.

 

 

Simplified Internal Schematic
GUID-60139F4F-FEB3-4810-8C0D-9B30FDAA312B-low.pngTHD+N vs Frequency (2-kΩ Load)

4 Revision History

Changes from Revision D (December 2021) to Revision E (December 2022)

  • Change OPA1677 D (SOIC, 8) package from preview to production data (active)Go

Changes from Revision C (April 2019) to Revision D (December 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added OPA1677 production data (active) device and associated contentGo

Changes from Revision B (June 2018) to Revision C (April 2019)

  • Changed status of OPA1679 QFN package to production dataGo
  • Changed GPN BUF634A in Figure 8-6, Composite Headphone Amplifier (Single-Channel Shown) Go

Changes from Revision A (May 2018) to Revision B (June 2018)

  • Added content re: preview QFN (RUM) packageGo

Changes from Revision * (February 2017) to Revision A (May 2018)

  • Added DRG (SON) 8-pin package to Device Information tableGo
  • Added SON-8 package to Features listGo
  • Added DRG (SON) 8-pin pinout drawing to Pin Configuration and Functions sectionGo
  • Added thermal pad information to Pin Functions: OPA1678 tableGo

5 Pin Configuration and Functions

Figure 5-1 OPA1677: D Package, 8-Pin SOIC (Top View)
GUID-94080CA9-28F9-4D96-8719-BC1CB4178FF2-low.gif Figure 5-2 OPA1677: DBV Package, 5-Pin SOT-23 (Top View)
Pin Functions: OPA1677
PIN TYPE DESCRIPTION
NAME NO.
D
(SOIC)		 DBV (SOT-23)
–IN 2 4 Input Inverting input
+IN 3 3 Input Noninverting input
OUT 6 1 Output Output
V– 4 2 Power Negative (lowest) power supply
V+ 7 5 Power Positive (highest) power supply
GUID-B475DB0F-B79E-44F0-A3F1-10E402582FFA-low.gif Figure 5-3 OPA1678: D Package, 8-Pin SOIC and DGK Package, 8-Pin VSSOP (Top View)
GUID-8CC6B519-47A1-422A-813E-E36B7A9DC330-low.gif Figure 5-4 OPA1678: DRG Package, 8-Pin SON With Exposed Thermal Pad (Top View)
Pin Functions: OPA1678
PIN TYPE DESCRIPTION
NAME NO.
–IN A 2 Input Inverting input, channel A
+IN A 3 Input Noninverting input, channel A
–IN B 6 Input Inverting input, channel B
+IN B 5 Input Noninverting input, channel B
OUT A 1 Output Output, channel A
OUT B 7 Output Output, channel B
V– 4 Power Negative (lowest) power supply
V+ 8 Power Positive (highest) power supply
Thermal Pad Thermal pad — For DRG (SON-8) package. Exposed thermal die pad on underside. Connect thermal die pad to V–. Solder the thermal pad to improve heat dissipation and provide specified performance.
GUID-765896E2-755C-46E9-9DE1-BED94F3DF093-low.gifFigure 5-5 OPA1679: D Package, 14-Pin SOIC and
PW Package, 14-Pin TSSOP (Top View)
Figure 5-6 OPA1679: RUM Package, 16-Pin QFN With Exposed Thermal Pad (Top View)
Pin Functions: OPA1679
PIN TYPE DESCRIPTION
NAME NO.
D (SOIC)
PW (TSSOP)		 RUM (QFN)
–IN A 2 1 Input Inverting input, channel A
+IN A 3 2 Input Noninverting input, channel A
–IN B 6 5 Input Inverting input, channel B
+IN B 5 4 Input Noninverting input, channel B
–IN C 9 8 Input Inverting input, channel C
+IN C 10 9 Input Noninverting input, channel C
–IN D 13 12 Input Inverting input, channel D
+IN D 12 11 Input Noninverting input, channel D
NC — 13 — No connect
NC — 16 — No connect
OUT A 1 15 Output Output, channel A
OUT B 7 6 Output Output, channel B
OUT C 8 7 Output Output, channel C
OUT D 14 14 Output Output, channel D
V+ 4 3 Power Positive (highest) power supply
V– 11 10 Power Negative (lowest) power supply
Thermal Pad — Thermal pad — Exposed thermal die pad on underside. Connect thermal die pad to V–. Solder the thermal pad to improve heat dissipation and provide specified performance.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage Supply voltage, VS = (V+) – (V–) 40 V
Input voltage (V–) – 0.5 (V+) + 0.5 V
Current Input current (all pins except power-supply pins) –10 10 mA
Output short-circuit current(2) Continuous
TA Operating temperature –55 125 °C
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Short-circuit to VS / 2 (ground in symmetrical dual-supply setups), one amplifier per package.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine model (MM)(3) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) Machine Model was not tested on OPA1679IRUM.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VS Supply voltage Single supply 4.5 36 V
Dual supply ±2.25 ±18
TA Operating temperature –40 125 °C

 
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