OPAx350 High-Speed, Single-Supply, Rail-to-Rail Operational Amplifiers MicroAmplifier Series
- SBOS099D September 2000 – December 2015 OPA2350 , OPA350 , OPA4350
  
  PRODUCTION DATA.

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DATA SHEET

OPAx350 High-Speed, Single-Supply, Rail-to-Rail Operational Amplifiers MicroAmplifier Series

1 Features

Rail-to-Rail Input
Rail-to-Rail Output (Within 10 mV)
Wide Bandwidth: 38 MHz
High Slew Rate: 22 V/μs
Low Noise: 5 nV/√Hz
Low THD+Noise: 0.0006%
Unity-Gain Stable
MicroSize Packages
Single, Dual, and Quad

2 Applications

Cell Phone PA Control Loops
Driving A/D Converters
Video Processing
Data Acquisition
Process Controls
Audio Processing
Communications
Active Filters
Test Equipment

OPAx350 Harmonic Distortion

OPA350 OPA2350 OPA4350 sbos099_typchar_6.gif

3 Description

The OPA350 series of rail-to-rail CMOS operational amplifiers are optimized for low voltage, single-supply operation. Rail-to-rail input and output, low noise (5 nV/√Hz), and high speed operation (38 MHz, 22 V/μs) make the amplifiers ideal for driving sampling Analog-to-Digital (A/D) converters. They are also suited for cell phone PA control loops and video processing (75-Ω drive capability), as well as audio and general purpose applications. Single, dual, and quad versions have identical specifications for maximum design flexibility.

The OPA350 series operates on a single supply as low as 2.5 V, with an input common-mode voltage range that extends 300 mV below ground and 300 mV above the positive supply. Output voltage swing is to within 10 mV of the supply rails, with a 10-kΩ load. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction.

The single (OPA350) and dual (OPA2350) come in the miniature MSOP-8 surface mount, SO-8 surface mount, and DIP-8 packages. The quad (OPA4350) packages are in the space-saving SSOP-16 surface mount and SO-14 surface mount. All are specified from −40°C to 85°C and operate from −55°C to 150°C.

Device Information⁽¹⁾

PART NUMBER	PACKAGE	BODY SIZE (NOM)
OPA350	MSOP (8)	3.00 mm × 3.00 mm
	SOIC (8)	3.91 mm × 4.90 mm
	PDIP (8)	6.35 mm × 9.81 mm
OPA2350	MSOP (8)	3.00 mm × 3.00 mm
	SOIC (8)	3.91 mm × 4.90 mm
	PDIP (8)	6.35 mm × 9.81 mm
OPA4350	SSOP (16)	3.90 mm × 4.90 mm
OPA4350	SOIC (14)	3.91 mm × 8.65 mm

For all available packages, see the orderable addendum at the end of the data sheet.

4 Revision History

Changes from C Revision (January 2005) to D Revision

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go

5 Pin Configuration and Functions

OPA350: P, D, and DGK Packages

8-Pin PDIP, SOIC, and VSSOP

Top View

OPA2350: P, D, and DGK Packages

8-Pin PDIP, SOIC, and VSSOP

Top View

D Package

14-Pin SOIC

Top View

DBQ Package

16-Pin SSOP

Top View

Pin Functions

PIN					I/O	DESCRIPTION
NAME	OPA350 NO.	OPA2350 NO.	OPA4350 SO-14 NO.	OPA4350 SSOP NO.	I/O	DESCRIPTION
NC	1, 5, 8	—	—	8, 9	—	No internal connection
–In	2	—	—	—	I	Inverting input
+In	3	—	—	—	I	Noninverting input
V–	4	4	11	13	I	Negative power supply
Output	6	—	—	—	O	Output
V+	7	8	4	4	I	Positive power supply
Out A	—	1	1	1	O	Output channel A
–In A	—	2	2	2	I	Inverting input channel A
+In A	—	3	3	3	I	Noninverting input channel A
+In B	—	5	5	5	I	Noninverting input channel B
–In B	—	6	6	6	I	Inverting input channel B
Out B	—	7	7	7	O	Output channel B
Out C	—	—	8	10	O	Output channel C
–In C	—	—	9	11	I	Inverting input channel C
+In C	—	—	10	12	I	Noninverting input channel C
+In D	—	—	12	14	I	Noninverting input channel D
–In D	—	—	13	15	I	Inverting input channel D
Out D	—	—	14	16	O	Output channel D

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

			MIN	MAX	UNIT
	Supply voltage			7	V
	Signal input terminals⁽²⁾	Voltage	(V−) − 0.3	(V+) + 0.3	V
	Signal input terminals⁽²⁾	Current		10	mA
	Open short circuit current⁽³⁾		Continuous
	Operating temperature		–55	150	°C
	Lead temperature (soldering, 10 s)			300	°C
	Junction temperature			150	°C
T_stg	Storage temperature		–55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current-limited to 10 mA or less.

(3) Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

			VALUE	UNIT
OPA350, OPA2350, OPA4350 (ALL PACKAGE TYPES)
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±1000	V
OPA350, OPA2350, OPA4350 (SOIC PACKAGES ONLY)
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

	MIN	NOM	MAX	UNIT
Power supply voltage, (V+)-(V-)	2.7 (±1.35)	5 (±2.5)	5.5 (±2.75)	V
Specified temperature	–40	25	85	°C
Operating temperature	–55	25	150	°C

6.4 Thermal Information: OPA350 and OPA2350

THERMAL METRIC⁽¹⁾		OPA350, OPA2350			UNIT
		DGK (VSSOP)	P (PDIP)	D (SOIC)
		8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	169.2	53.1	140.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	62.8	42.5	89.8	°C/W
R_θJB	Junction-to-board thermal resistance	89.8	30.3	80.6	°C/W
ψ_JT	Junction-to-top characterization parameter	7.5	19.7	28.7	°C/W
ψ_JB	Junction-to-board characterization parameter	88.2	30.2	80.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Thermal Information: OPA4350

THERMAL METRIC⁽¹⁾		OPA4350		UNIT
		D (SOIC)	DBQ (SSOP)
		14 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	83.8	115.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	70.7	67	°C/W
R_θJB	Junction-to-board thermal resistance	59.5	58.3	°C/W
ψ_JT	Junction-to-top characterization parameter	11.6	19.9	°C/W
ψ_JB	Junction-to-board characterization parameter	37.7	57.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.6 Electrical Characteristics

V_S = 2.7 V to 5.5 V; All specifications at T_A = 25°C, R_L = 1 kΩ connected to V_S/2 and V_OUT = V_S/2, unless otherwise noted.

PARAMETER			TEST CONDITIONS	MIN	TYP⁽¹⁾	MAX	UNIT
OFFSET VOLTAGE
V_OS	Input offset voltage		V_S = 5 V		±150	±500	µV
		T_A = −40°C to 85°C				±1	mV
		vs Temperature	T_A = –40°C to 85°C		±4		μV/°C
PSRR	vs Power-supply rejection ratio		V_S = 2.7 V to 5.5 V, V_CM = 0 V		40	150	µV/V
PSRR	vs Power-supply rejection ratio		V_S = 2.7 V to 5.5 V, V_CM = 0 V			175	µV/V
	Channel separation (dual, quad)		DC		0.15		µV/V
INPUT BIAS CURRENT
I_B	Input bias current				±0.5	±10	pA
I_B	Input bias current	vs Temperature		See Typical Characteristics			pA
I_OS	Input offset current				±0.5	±10	pA
NOISE
	Input voltage noise, f = 100 Hz to 400 kHz				4		μVrms
e_n	Input voltage noise density, f = 10 kHz				7		nV/√Hz
	Input current noise density, f = 100 kHz				5		nV/√Hz
i_n	Current noise density, f = 10 kHz				4		fA/√Hz
INPUT VOLTAGE RANGE
V_CM	Common-mode voltage range		T_A = −40°C to 85°C	–0.1		(V+) + 0.1	V
CMRR	Common-mode rejection ratio		V_S = 2.7 V, −0.1 V < V_CM < 2.8 V	66	84		dB
			V_S = 5.5 V, −0.1 V < V_CM < 5.6 V	74	90
			T_A = −40°C to 85°C, V_S = 5.5 V, −0.1 V < V_CM < 5.6 V	74
INPUT IMPEDANCE
	Differential				10¹³ \|\| 2.5		Ω \|\| pF
	Common-mode				10¹³ \|\| 6.5		Ω \|\| pF
OPEN-LOOP GAIN
A_OL	Open-loop voltage gain		R_L = 10 kΩ, 50 mV < V_O < (V+) –50 mV	100	122		dB
		T_A = –40°C to 85°C	R_L = 10 kΩ, 50 mV < V_O < (V+) –50 mV	100
			R_L = 1 kΩ, 200 mV < V_O < (V+) –200 mV	100	120
			R_L = 1 kΩ, 200 mV < V_O < (V+) –200 mV	100
FREQUENCY RESPONSE (C_L = 100 pF)
GBW	Gain-bandwidth product		G = 1		38		MHz
SR	Slew rate		G = 1		22		V/µs
	Settling time	0.1%	G = ±1, 2-V Step		0.22		µs
	Settling time	0.01%	G = ±1, 2-V Step		0.5		µs
	Overload recovery time		V_IN × G = V_S		0.1		µs
THD+N	Total harmonic distortion + noise		R_L = 600 Ω, V_O = 2.5 V_PP⁽²⁾, G = 1, f = 1 kHz		0.0006%
	Differential gain error		G = 2, R_L = 600 Ω, V_O = 1.4 V⁽³⁾		0.17%
	Differential phase error		G = 2, R_L = 600 Ω, V_O = 1.4 V⁽³⁾		0.17		°
OUTPUT
V_OUT	Voltage output swing from rail⁽⁴⁾		R_L = 10 kΩ, A_OL ≥ 100 dB		10	50	mV
		T_A = –40°C to 85°C	R_L = 10 kΩ, A_OL ≥ 100 dB			50
		T_A = –40°C to 85°C	R_L = 1 kΩ, A_OL ≥ 100 dB		25	200
I_OUT	Output current				±40⁽⁵⁾		mA
I_SC	short circuit current				±80		mA
C_LOAD	Capacitive load drive			See Typical Characteristics
POWER SUPPLY
V_S	Operating voltage range		T_A = −40°C to 85°C	2.7		5.5	V
	Minimum operating voltage				2.5		V
I_Q	Quiescent current (per amplifier)		I_O = 0		5.2	7.5	mA
I_Q	Quiescent current (per amplifier)	T_A = –40°C to 85°C	I_O = 0			8.5	mA
TEMPERATURE RANGE
	Specified range			–40		85	°C
	Operating range			–55		150	°C