SCES579J JUNE 2004 – September 2017 SN74AUP1G17
PRODUCTION DATA.
The AUP family of devices is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity).
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
SN74AUP1G17DBV | SOT-23 (5) | 1.60 mm × 2.90 mm |
SN74AUP1G17DCK | SC70 (5) | 1.25 mm × 2.00 mm |
SN74AUP1G17DRL | SOT-5X3 (5) | 1.60 mm × 1.20 mm |
SN74AUP1G17DRY | SON (6) | 1.00 mm × 1.45 mm |
SN74AUP1G17DSF | SON (6) | 1.00 mm × 1.00 mm |
SN74AUP1G17YFP | DSBGA (4) | 0.76 mm × 0.76 mm |
SN74AUP1G17YZP | DSBGA (5) | 0.89 mm × 1.39 mm |
SN74AUP1G17DPW | X2SON (5) | 0.80 mm × 0.80 mm |