Refer to the PDF data sheet for device specific package drawings
AEC-Q100 qualified for automotive applications:
Device temperature grade 1: -40°C to +125°C
Device HBM ESD classification level 2
Device CDM ESD classification level C4B
Available in wettable flanks QFN (WBQA) package
This device contains three independent 3-input AND gates. Each gate performs the Boolean function Y = A × B × C in positive logic.
PART NUMBER | PACKAGE(1) | PACKAGE SIZE(2) | BODY SIZE(3) |
---|---|---|---|
SN74LVC11A-Q1 | D (SOIC, 14) | 8.65mm × 6mm | 8.65mm × 3.9mm |
BQA (WQFN, 14) | 3mm × 2.5mm | 3mm × 2.5mm | |
PW (TSSOP,14) | 5mm × 6.4mm | 5mm × 4.4mm |
PIN | TYPE(1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
1A | 1 | I | Channel 1, Input A |
1B | 2 | I | Channel 1, Input B |
2A | 3 | I | Channel 2, Input A |
2B | 4 | I | Channel 2, Input B |
2C | 5 | I | Channel 2, Input C |
2Y | 6 | O | Channel 2, Output Y |
GND | 7 | — | Ground |
3Y | 8 | O | Channel 3, Output Y |
3A | 9 | I | Channel 3, Input A |
3B | 10 | I | Channel 3, Input B |
3C | 11 | I | Channel 3, Input C |
1Y | 12 | O | Channel 1, Output Y |
1C | 13 | I | Channel 1, Input C |
VCC | 14 | — | Positive Supply |
Thermal Pad(2) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. |