SCES538G January   2004  – February 2020 SN74LVC1G38

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Logic Diagram (Positive Logic)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 15 pF
    7. 6.7  Switching Characteristics, CL = 30 pF or 50 pF, –40°C to +85°C
    8. 6.8  Switching Characteristics, CL = 30 pF or 50 pF, –40°C to +125°C
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     (Open Drain)
    2.     (Open Drain)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High-Drive Open-Drain Output
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-Voltage Tolerant Inputs
      6. 8.3.6 Up Translation and Down Translation Capable Outputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Latch-up performance exceeds 100 mA Per JESD 78, Class II
  • ESD protection exceeds JESD 22
    • 2000-V Human-body model (A114-A)
    • 200-V Machine model (A115-A)
    • 1000-V Charged-device model (C101)
  • Available in the Texas Instruments
    NanoStar™ and NanoFree™ Packages
  • Supports 5-V VCC operation
  • Inputs accept voltages to 5.5 V
  • Supports down translation to VCC
  • Maximum tpd of 4.5 ns at 3.3 V
  • Low power consumption, 10-µA maximum ICC
  • ±24-mA Output drive at 3.3 V
  • Ioff Supports partial-power-down mode and back-drive protection