SCES195N April   1999  – August 2015 SN74LVC2G04

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DRL|6
  • YZP|6
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.1 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

2 Applications

  • IP Phones: Wired and Wireless
  • Optical Modules
  • Optical Networking: EPON and Video Over Fiber
  • Point-to-Point Microwave Backhaul
  • Power: Telecom DC/DC Module: Analog and Digital
  • Private Branch Exchanges (PBX)
  • TETRA Base Exchanges
  • Telecom Base Band Units
  • Telecom Shelters: Power Distribution Units (PDU), Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted Amplifiers (TMA)
  • Vector Signal Analyzers and Generators
  • Video Converencing: IP-Based HD
  • WiMAX and Wireless Infrastructure Equipment
  • Wireless Communications Testers and Wireless Repeaters
  • xDSL Modems and DSLAM

3 Description

This dual inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G04 device performs the Boolean function Y = A.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74LVC2G04DBV SOT-23 (6) 2.90 mm × 1.60 mm
SN74LVC2G04DCK SC70 (6) 2.00 mm × 1.25 mm
SN74LVC2G04DRL SOT (6) 1.60 mm × 1.20 mm
SN74LVC2G04YZP DSBGA (6) 1.41 mm × 0.91 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Logic Diagram (Positive Logic)

SN74LVC2G04 ld_ces195.gif

4 Revision History

Changes from M Revision (November 2013) to N Revision

  • Removed the Ordering Information table, added the Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from L Revision (January 2007) to M Revision

  • Updated document to new TI data sheet format.Go
  • Added ESD warning Go
  • Updated operating temperature range.Go