SLLSF59C July   2020  – March 2022 TLIN2027-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Thermal Information
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Requirements
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN (Local Interconnect Network) Bus
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD (Transmit Input and Output)
      3. 9.3.3  RXD (Receive Output)
      4. 9.3.4  VSUP (Supply Voltage)
      5. 9.3.5  GND (Ground)
      6. 9.3.6  EN (Enable Input)
      7. 9.3.7  Protection Features
      8. 9.3.8  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      9. 9.3.9  Thermal Shutdown
      10. 9.3.10 Under Voltage on VSUP
      11. 9.3.11 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
        2. 9.4.4.2 Mode Transitions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Normal Mode Application Note
        2. 10.2.2.2 Standby Mode Application Note
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 Qualified for automotive applications
    • Temperature grade 1: –40°C to 125°C TA
    • Device HBM certification level: ±8 kV
    • Device CDM certification level: ±1.5 kV
  • Compatible with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2 A and ISO/DIS 17987–4 (See Switching Characteristics)
  • Compatible with SAE J2602 recommended practice for LIN
  • Supports ISO 9141 (K-Line)
  • Supports 24 V applications
  • LIN transmit data rate up to 20-kbps
  • Wide operating ranges
    • 4-V to 48-V Supply voltage
    • ±60-V LIN bus fault protection
  • Sleep mode: ultra-low current consumption allows wake-up event from:
    • LIN bus
    • Local wake-up through EN
  • No dominant state timeout
  • Power up and down glitch free operation
  • Protection features:
    • Under voltage protection on VSUP
    • Thermal shutdown protection
    • Unpowered node or ground disconnection failsafe at system level.
  • Available in SOIC (8) and leadless VSON (8) packages for improved automated optical inspection (AOI) capability