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  • TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP

    • SBOS545D February   2011  – December 2018 TMP103

      PRODUCTION DATA.  

  • CONTENTS
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  • TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP
  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 One-Shot Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1  Temperature Watchdog Function
      2. 7.5.2  Conversion Rate
      3. 7.5.3  Shutdown Mode (M1 = 0, M0 = 0)
      4. 7.5.4  One-Shot (M1 = 0, M0 = 1)
      5. 7.5.5  Continuous Conversion Mode (M1 = 1)
      6. 7.5.6  Bus Overview
      7. 7.5.7  Serial Interface
      8. 7.5.8  Serial Bus Address
      9. 7.5.9  Writing and Reading Operation
      10. 7.5.10 Slave Mode Operations
        1. 7.5.10.1 Slave Receiver Mode
        2. 7.5.10.2 Slave Transmitter Mode
      11. 7.5.11 General Call
      12. 7.5.12 High-Speed (Hs) Mode
      13. 7.5.13 Timeout Function
      14. 7.5.14 Multiple Device Access
        1. 7.5.14.1 Multiple Device Access Write
        2. 7.5.14.2 Multiple Device Access Read
      15. 7.5.15 NOISE
    6. 7.6 Register Maps
      1. 7.6.1 Pointer Register
      2. 7.6.2 Temperature Register
      3. 7.6.3 Configuration Register
      4. 7.6.4 Temperature Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • sbos545d_oa
  • sbos545d_pm
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DATA SHEET

TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP

1 Features

  • Multiple Device Access (MDA):
    • Global Read/Write Operations
  • I2C™ and SMBus™-Compatible Interface
  • Resolution: 8 Bits
  • Accuracy: ±1°C Typical (–10°C to 100°C)
  • Low Quiescent Current:
    • 3-μA Active IQ at 0.25 Hz
    • 1-μA Shutdown
  • Supply Range: 1.4 V to 3.6 V
  • Digital Output
  • 4-Ball WCSP (DSBGA) Package

2 Applications

  • Handsets
  • Notebooks
  • SSDs
  • Servers
  • Telecom
  • Set Top Boxes
  • Low Power Environmental
  • Sensors

 
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