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  • TMP468 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor

    • SBOS762B November   2016  – June 2017 TMP468

      PRODUCTION DATA.  

  • CONTENTS
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  • TMP468 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Sensor Fault
      5. 7.3.5 THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
          1. 7.5.1.4.1 Single Register Reads
          2. 7.5.1.4.2 Block Register Reads
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 TMP468 Register Reset
      3. 7.5.3 Lock Register
    6. 7.6 Register Maps
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Value Registers
        3. 7.6.1.3  Software Reset Register
        4. 7.6.1.4  THERM Status Register
        5. 7.6.1.5  THERM2 Status Register
        6. 7.6.1.6  Remote Channel Open Status Register
        7. 7.6.1.7  Configuration Register
        8. 7.6.1.8  η-Factor Correction Register
        9. 7.6.1.9  Remote Temperature Offset Register
        10. 7.6.1.10 THERM Hysteresis Register
        11. 7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 7.6.1.12 Block Read - Auto Increment Pointer
        13. 7.6.1.13 Lock Register
        14. 7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • YFF|16
    • MXBG096W
  • RGT|16
    • MPQF119H
Thermal pad, mechanical data (Package|Pins)
  • RGT|16
    • QFND098S
Orderable Information
  • sbos762b_oa
  • sbos762b_pm
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    • Expanded reading width
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DATA SHEET

TMP468 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor

1 Features

  • 8-Channel Remote Diode Temperature Sensor Accuracy: ±0.75°C (Maximum)
  • Local and Remote Diode Accuracy: ±0.75°C (Maximum)
  • Local Temperature Sensor Accuracy for the DSBGA Package: ±0.35°C (Maximum)
  • Temperature Resolution: 0.0625°C
  • Supply and Logic Voltage Range: 1.7 V to 3.6 V
  • 67-µA Operating Current (1 SPS, All Channels Active)
  • 0.3-µA Shutdown Current
  • Remote Diode: Series Resistance Cancellation,
    η-Factor Correction, Offset Correction, and Diode Fault Detection
  • Register Lock Function Secures Key Registers
  • I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address
  • 16-Bump DSBGA and 16-Pin VQFN Packages

2 Applications

  • MCU, GPU, ASIC, FPGA, DSP, and CPU Temperature Monitoring
  • Telecommunication Equipment
  • Servers and Personal Computers
  • Cloud Ethernet Switches
  • Secure Data Centers
  • Highly Integrated Medical Systems
  • Precision Instruments and Test Equipment
  • LED Lighting Thermal Control

3 Description

The TMP468 device is a multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote diode-connected temperature zones can be monitored simultaneously in addition to the local temperature. Aggregating the temperature measurements across a system allows improved performance through tighter guard bands and can reduce board complexity. A typical use case is for monitoring the temperature across different processors, such as MCUs, GPUs, and FPGAs in complex systems such as servers and telecommunications equipment. Advanced features such as series resistance cancellation, programmable non-ideality factor, programmable offset, and programmable temperature limits are included to provide a robust thermal monitoring solution with improved accuracy and noise immunity.

Each of the eight remote channels (and the local channel) can be programmed independently with two thresholds that are triggered when the corresponding temperature is exceeded at the measured location. In addition, there is a programmable hysteresis setting to avoid constant toggling around the threshold.

The TMP468 device provides high accuracy (0.75°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 3.6 V), common two-wire interfaces, and is available in a small, space efficient package (3 mm × 3 mm or 1.6 mm × 1.6 mm) for easy integration into computing systems. The remote junction supports a temperature range from –55°C to +150°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TMP468 DSBGA (16) 1.60 mm × 1.60 mm
VQFN (16) 3.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Typical Application Schematic

TMP468 tmp468_page1_diag_v2.gif
See the Design Requirements section for remote diode recommendations.

4 Revision History

Changes from A Revision (March 2017) to B Revision

  • Updated packaging information Go

Changes from * Revision (November 2016) to A Revision

  • Added 16-pin VQFN package version throughout data sheet.Go
  • Deleted Description (cont.) section and moved text to Description section Go
  • Added VQFN package and body size information to Device Information table Go
  • Added copyright statement to Typical Application SchematicGo
  • Added RGT (VQFN) pinout diagram in the Pin Configuration and Functions section Go
  • Added remote junction temperature parameter and values to Recommended Operating Conditions table Go
  • Changed formatting of Thermal Information table note Go
  • Changed TMP468 Thermal Information table package from "RGT (QFN)" to "RGT (VQFN)"Go
  • Updated formatting of Two-Wire Timing Requirements table Go
  • Changed Timing Requirements table note parameter from tVD;DATA to tVD;DATGo
  • Added 2017 copyright to Functional Block Diagram Go
  • Changed table headers in Continuous Conversion Times table Go
  • Added 2017 copyright to Typical Application schematic in Application Information sectionGo
  • Changed η-factor setting from 1.003674 to 1.0067 in Figure 23 table note in Typical Application sectionGo
  • Changed conversion rate from 16 conversions/second to 1 conversion/second in the Detailed Design Procedure sectionGo
  • Changed units of Equation 7 from "µs" to "µA"Go

5 Pin Configuration and Functions

TMP468 YFF Package
16-Pin DSBGA
Bottom View
TMP468 PinOut_01_YFF_SBOS762.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ADD B4 Digital input Address select. Connect to GND, V+, SDA, or SCL.
D1+ A1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D2+ B1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D3+ C1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D4+ D1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D5+ A2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D6+ B2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D7+ C2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D8+ D2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D– A3 Analog input Negative connection to remote temperature sensors. Common for 8 remote channels.
GND A4 Ground Supply ground connection
SCL D4 Digital input Serial clock line for I2C- or SMBus compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven by an open-drain output.
SDA C4 Bidirectional digital input/output Serial data line for I2C or SMBus compatible two-wire interface. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.
THERM B3 Digital output Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
THERM2 C3 Digital output Second THERM output.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
V+ D3 Power supply Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.
TMP468 RGT Package
16-Pin VQFN
Top View
TMP468 TMP468_RTE_pinout.gif
NC - No internal connection

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ADD 9 Digital input Address select. Connect to GND, V+, SDA, or SCL.
D1+ 6 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D2+ 5 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D3+ 4 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D4+ 3 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D5+ 2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D6+ 1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D7+ 16 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D8+ 15 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D– 7 Analog input Negative connection to remote temperature sensors. Common for 8 remote channels.
GND 8 Ground Supply ground connection
SCL 13 Digital input Serial clock line for I2C or SMBus-compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven by an open-drain output.
SDA 12 Bidirectional digital input/output Serial data line for I2C- or SMBus-compatible two-wire interface. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.
THERM 10 Digital output Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
THERM2 11 Digital output Second THERM output.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
V+ 14 Power supply Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply V+ –0.3 6 V
Input voltage THERM, THERM2, SDA, SCL, and ADD only –0.3 6 V
D1+ through D8+ –0.3 ((V+) + 0.3) and ≤ 6
D– only –0.3 0.3
Input current SDA sink –25 mA
All other pins –10 10
Operating temperature –55 150 °C
Junction temperature (TJ, maximum) 150 °C
Storage temperature, Tstg –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V+ Supply voltage 1.7 3.6 V
TA Operating free-air temperature –40 125 °C
TD Remote junction temperature –55 150 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP468 UNIT
RGT (VQFN) YFF (DSBGA)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 46 76 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43 0.7 °C/W
RθJB Junction-to-board thermal resistance 17 13 °C/W
ψJT Junction-to-top characterization parameter 0.8 0.4 °C/W
ψJB Junction-to-board characterization parameter 5 13 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE MEASUREMENT
TLOCAL Local temperature sensor accuracy TA = 20°C to 30°C, V+ = 1.7 V to 2 V (DSBGA) –0.35 ±0.125 0.35 °C
TA = –40°C to 125°C, V+ = 1.7 V to 2 V (DSBGA) –0.75 ±0.125 0.75 °C
TA = –40°C to 100°C, V+ = 1.7 V to 3.6 V (VQFN)
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V –1 ±0.5 1 °C
TREMOTE Remote temperature sensor accuracy (DSBGA):
TA = –10°C to 50°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V		 –0.75 ±0.125 0.75 °C
(VQFN):
TA = –10°C to 85°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
TA = –40°C to 125°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V		 –1 ±0.5 1
Local temperature error supply sensitivity V+ = 1.7 V to 3.6 V –0.15 ±0.05 0.15 °C/V
Remote temperature error supply sensitivity V+ = 1.7 V to 3.6 V –0.25 ±0.1 0.25 °C/V
Temperature resolution
(local and remote)		 0.0625 °C
ADC conversion time One-shot mode, per channel (local or remote) 16 17 ms
ADC resolution 13 Bits
Remote sensor source current High Series resistance 1 kΩ (maximum) 120 µA
Medium 45
Low 7.5
η Remote transistor ideality factor 1.008
SERIAL INTERFACE (SCL, SDA)
VIH High-level input voltage 0.7 × (V+) V
VIL Low-level input voltage 0.3 × (V+) V
Hysteresis 200 mV
SDA output-low sink current 20 mA
VOL Low-level output voltage IO = –20 mA, V+ ≥ 2 V 0.15 0.4 V
IO = –15 mA, V+ < 2 V 0.2 × V+ V
Serial bus input leakage current 0 V ≤ VIN ≤ 3.6 V –1 1 μA
Serial bus input capacitance 4 pF
DIGITAL INPUTS (ADD)
VIH High-level input voltage 0.7 × (V+) V
VIL Low-level input voltage –0.3 0.3 × (V+) V
Input leakage current 0 V ≤ VIN ≤ 3.6 V –1 1 μA
Input capacitance 4 pF
DIGITAL OUTPUTS (THERM, THERM2)
Output-low sink current VOL = 0.4 V 6 mA
VOL Low-level output voltage IO = –6 mA 0.15 0.4 V
IOH High-level output leakage current VO = V+ 1 μA
POWER SUPPLY
V+ Specified supply voltage range 1.7 3.6 V
IQ Quiescent current Active conversion, local sensor 240 375 µA
Active conversion, remote sensors 400 600
Standby mode (between conversions) 15 21
Shutdown mode, serial bus inactive 0.3 4
Shutdown mode, serial bus active, fS = 400 kHz 120 µA
Shutdown mode, serial bus active, fS = 2.56 MHz 300 µA
POR Power-on-reset threshold Rising edge 1.5 1.65 V
Falling edge 1 1.2 1.35
POH Power-on-reset hysteresis 0.2 V

6.6 Two-Wire Timing Requirements

at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
The master and the slave have the same V+ value. Values are based on statistical analysis of samples tested during initial release.
MIN MAX UNIT
fSCL SCL operating frequency Fast mode 0.001 0.4 MHz
High-speed mode 0.001 2.56
tBUF Bus free time between stop and start condition Fast mode 1300 ns
High-speed mode 160
tHD;STA Hold time after repeated start condition.
After this period, the first clock is generated.		 Fast mode 600 ns
High-speed mode 160
tSU;STA Repeated start condition setup time Fast mode 600 ns
High-speed mode 160
tSU;STO Stop condition setup time Fast mode 600 ns
High-speed mode 160
tHD;DAT Data hold time when SDA Fast mode 0 (1) ns
High-speed mode 0 130
tVD;DAT Data valid time(2) Fast mode 0 900 ns
High-speed mode — —
tSU;DAT Data setup time Fast mode 100 ns
High-speed mode 20
tLOW SCL clock low period Fast mode 1300 ns
High-speed mode 250
tHIGH SCL clock high period Fast mode 600 ns
High-speed mode 60
tF – SDA Data fall time Fast mode 20 × (V+ / 5.5) 300 ns
High-speed mode 100
tF, tR – SCL Clock fall and rise time Fast mode 300 ns
High-speed mode 40
tR Rise time for SCL ≤ 100 kHz Fast mode 1000 ns
High-speed mode
Serial bus timeout Fast mode 15 20 ms
High-speed mode 15 20
(1) The maximum tHD;DAT can be 0.9 µs for fast mode, and is less than the maximum tVD;DAT by a transition time.
(2) tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH to LOW, depending on which is worse).
TMP468 Tmng_ECTable.gif Figure 1. Two-Wire Timing Diagram

6.7 Typical Characteristics

at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
TMP468 D001_SBOS762.gif
Typical behavior of 95 DSBGA devices over temperature at V+ = 1.8 V
Figure 2. Local Temperature Error vs Ambient Temperature
TMP468 D003_SBOS762_150C_1p8V_Visio.gif
Typical behavior of 30 DSBGA devices over temperature at V+ = 1.8 V with the remote diode junction at 150°C.
Figure 4. Remote Temperature Error vs Device Junction Temperature
TMP468 D005_SBOS762_150C_1p8V-3p6V_Visio.gif
Typical behavior of 30 devices over temperature with V+ from 1.8 V to 3.6 V
Figure 6. Remote Temperature Error Power Supply Sensitivity vs Device Junction Temperature
TMP468 D007_SBOS762.gif
No physical capacitance during measurement
Figure 8. Remote Temperature Error vs Series Resistance
TMP468 D009_SBOS762.gif
Figure 10. Quiescent Current vs Conversion Rate °
TMP468 D011_SBOS762.gif
Figure 12. Quiescent Current vs Supply Voltage
(at Default Conversion Rate of 16 Conversions Per Second)
TMP468 D002_SBOS762.gif
Typical behavior of 75 VQFN devices over temperature at V+ = 1.8 V
Figure 3. Local Temperature Error vs Ambient Temperature
TMP468 D004_SBOS762.gif
Typical behavior of 75 VQFN devices over temperature at V+ = 1.8 V with the remote diode junction at 150°C.
Figure 5. Remote Temperature Error vs Device Junction Temperature
TMP468 D006_SBOS762.gif
Figure 7. Remote Temperature Error vs Leakage Resistance
TMP468 D008_SBOS762.gif
No physical series resistance on D+, D– pins during measurement
Figure 9. Remote Temperature Error vs
Differential Capacitance
TMP468 D010_SBOS762.gif
16 samples per second (default mode)
Figure 11. Shutdown Quiescent Current
vs SCL Clock Frequency
TMP468 D012_SBOS762.gif
Figure 13. Shutdown Quiescent Current vs Supply Voltage

 
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