The TPD4E02B04-Q1 is an automotive-qualified bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The TPD4E02B04-Q1 is rated to dissipate ESD strikes up to 10 kV per ISO 10605 (330 pF, 330 Ω) ESD standard. The TPD4E02B04 is also rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).
This device features a 0.25-pF IO capacitance per channel making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.
The TPD4E02B04-Q1 is offered in the industry standard USON-10 (DQA) package. The package features flow-through routing and 0.5-mm pin pitch easing implementation and reducing design time.
This device is also available without automotive qualification: TPD4E02B04.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPD4E02B04-Q1 | USON (10) | 2.50 mm × 1.00 mm |
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
GND | 3 | Ground | Ground. Connect to ground |
GND | 8 | ||
IO1 | 1 | I/O | ESD protected channel |
IO2 | 2 | ||
IO3 | 4 | ||
IO4 | 5 | ||
NC | 6 | NC | Not connected; Used for optional straight-through routing. Can be left floating or grounded |
NC | 7 | ||
NC | 9 | ||
NC | 10 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Electrical fast transient | IEC 61000-4-5 (5/50 ns) at 25°C | 80 | A | |
Peak pulse | IEC 61000-4-5 power (tp - 8/20 µs) at 25°C | 17 | W | |
IEC 61000-4-5 Ccurrent (tp - 8/20 µs) at 25°C | 2 | A | ||
TA | Operating free-air temperature | –40 | 125 | °C |
Tstg | Storage temperature | –65 | 155 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2500 | V |
Charged-device model (CDM), per AEC Q100-011 | ±1000 |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | IEC 61000-4-2 contact discharge | ±12000 | V |
IEC 61000-4-2 air-gap discharge | ±15000 |
VALUE | UNIT | ||||
---|---|---|---|---|---|
V(ESD) | Electrostatic discharge | ISO 10605 330 pF, 330 Ω, IO | Contact discharge | ±10000 | V |
Air-gap discharge | ±10000 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VIO | Input pin voltage | –3.6 | 3.6 | V |
TA | Operating free-air temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TPD4E02B04-Q1 | UNIT | |
---|---|---|---|
DQA (USON) | |||
10 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 348.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 214.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 270.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 81.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 270.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
VRWM | Reverse stand-off voltage | IIO < 10 nA | –3.6 | 3.6 | V | |
VBRF | Breakdown voltage, any IO pin to GND(1) | IIO = 1 mA, TA = 25°C | 5.5 | 6.4 | 7.5 | V |
VBRR | Breakdown voltage, GND to any IO pin(1) | IIO = 1 mA, TA = 25°C | –5.5 | –6.4 | –7.5 | V |
VHOLD | Holding voltage(2) | IIO = 1 mA | 5.8 | V | ||
VCLAMP | Clamping voltage | IPP = 1 A, TLP, from IO to GND | 6.6 | V | ||
IPP = 5 A, TLP, from IO to GND | 8.8 | |||||
IPP = 1 A, TLP, from GND to IO | 6.6 | |||||
IPP = 5 A, TLP, from GND to IO | 8.8 | |||||
ILEAK | Leakage current, any IO to GND | VIO = ±2.5 V | 10 | nA | ||
RDYN | Dynamic resistance | IO to GND | 0.47 | Ω | ||
GND to IO | 0.47 | |||||
CL | Line capacitance | VIO = 0 V, f = 1 MHz, IO to GND, TA = 25°C | 0.25 | 0.33 | pF | |
ΔCL | Variation of line capacitance | Delta of capacitance between any two IO pins, VIO = 0 V, f = 1 MHz, TA = 25°C, GND = 0 V | 0.01 | 0.07 | pF | |
CCROSS | Channel to channel capacitance | Capacitance from one IO to another, VIO = 0 V, f = 1 MHz, GND = 0 V | 0.13 | 0.16 | pF |