SLIS117C August   2007  – May 2022 TPIC1021A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Test Circuit
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Local Interconnect Network (LIN) Bus
        1. 10.3.1.1 Transmitter Characteristics
        2. 10.3.1.2 Receiver Characteristics
      2. 10.3.2 Transmit Input (TXD)
        1. 10.3.2.1 TXD Dominant State Time-Out
      3. 10.3.3 Receive Output (RXD)
        1. 10.3.3.1 RXD Wake-up Request
      4. 10.3.4 Supply Voltage (VSUP)
      5. 10.3.5 Ground (GND)
      6. 10.3.6 Enable Input (EN)
      7. 10.3.7 NWake Input (NWake)
      8. 10.3.8 Inhibit Output (INH)
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating States
        1. 10.4.1.1 Normal Mode
        2. 10.4.1.2 Sleep Mode
          1. 10.4.1.2.1 Wake-Up Events
        3. 10.4.1.3 Standby Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • LIN physical layer specification revision 2.0 compliant and conforms to SAEJ2602 recommended practice for LIN
  • LIN bus speed up to 20-kbps LIN specified maximum
  • Sleep mode: ultra-low current consumption, allows wake-up events from LIN bus, wake-up input (external switch), or host MCU
  • high-speed receive capable
  • ESD protection to ±12 kV (human-body model) on LIN pin
  • LIN pin handles voltage from –40 V to 40 V
  • Survives transient damage in automotive environment (ISO 7637)
  • Extended operation with supply from 7 V to 27 V DC (LIN specification 7 V to 18 V)
  • Interfaces to MCU with 5-V or 3.3-V I/O pins
  • Dominant state time-out protection
  • Wake-up request on RXD pin
  • Control of external voltage regulator (INH pin)
  • Integrated pullup resistor and series diode for LIN responder applications
  • Low electromagnetic emission (EME), high electromagnetic immunity (EMI)
  • Bus terminal short-circuit protected for short to battery or short to ground
  • Thermally protected
  • Ground disconnection fail-safe at system level
  • Ground shift operation at system level
  • Unpowered node does not disturb the network
  • Supports ISO9141 (K-Line)-like functions