The TPS40210-EP is a wide-input voltage (4.5 to 52 V), nonsynchronous boost controller. The device is suitable for topologies which require a grounded source N-channel FET including boost, flyback, SEPIC, and various LED driver applications. The device features include programmable soft-start, overcurrent protection with automatic retry, and programmable oscillator frequency. Current mode control provides improved transient response and simplified loop compensation.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS40210-EP | VSON (10) | 3.05 mm × 4.98 mm |
DATE | REVISION | NOTES |
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November 2015 | * | Initial release. |
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
BP | 9 | O | Regulator output pin. Connect a 1.0-μF bypass capacitor from this pin to GND. |
COMP | 4 | O | Error amplifier output. Connect control loop compensation network between COMP pin and FB pin. |
DIS/EN | 3 | I | Disable pin. Pulling this pin high, places the part into a shutdown mode. Shutdown mode is characterized by a very low quiescent current. While in shutdown mode, the functionality of all blocks is disabled and the BP regulator is shut down. This pin has an internal 1 MΩ pull-down resistor to GND. Leaving this pin unconnected enables the device. |
FB | 5 | I | Error amplifier inverting input. Connect a voltage divider from the output to this pin to set output voltage. Compensation network is connected between this pin and COMP. |
GDRV | 8 | O | Connect the gate of the power N channel MOSFET to this pin. |
GND | 6 | — | Device ground. |
ISNS | 7 | I | Current sense pin. Connect an external current sensing resistor between this pin and GND. The voltage on this pin is used to provide current feedback in the control loop and detect an overcurrent condition. An overcurrent condition is declared when ISNS pin voltage exceeds the overcurrent threshold voltage, 150 mV typical. |
RC | 1 | I | Switching frequency setting pin. Connect a resistor from RC pin to VDD of the IC power supply and a capacitor from RC to GND. |
SS | 2 | I | Soft-start time programming pin. Connect capacitor from SS pin to GND to program converter soft-start time. This pin also functions as a timeout timer when the power supply is in an overcurrent condition. |
VDD | 10 | I | System input voltage. Connect a local bypass capacitor from this pin to GND. Depending on the amount of required slope compensation, this pin can be connected to the converter output. See Application Information for additional details. |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
Input voltage | VDD | –0.3 | 52 | V | |
RC, SS, FB, DIS/EN | –0.3 | 10 | |||
ISNS | –0.3 | 8 | |||
Output voltage | COMP, BP, GDRV | –0.3 | 9 | ||
TJ | Operating junction temperature | –55 | 150 | °C | |
Tstg | Storage temperature | –55 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±1500 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VDD | Input voltage | 4.5 | 52 | V |
TJ | Operating junction temperature | –55 | 125 | °C |
THERMAL METRIC(1) | TPS40210-EP | UNIT | |
---|---|---|---|
DRC (VSON) | |||
10 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 67.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 50.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 41.0 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 40.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 15.6 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
---|---|---|---|---|---|---|---|---|
VOLTAGE REFERENCE | ||||||||
VFB | Feedback voltage range | COMP = FB, 4.5 ≤ VDD ≤ 52 V, TJ = 25°C | 693 | 700 | 707 | mV | ||
COMP = FB, 4.5 ≤ VDD ≤ 52 V, –55°C ≤ TJ ≤ 125°C | 686 | 700 | 714 | |||||
INPUT SUPPLY | ||||||||
VDD | Input voltage range | 4.5 | 52 | V | ||||
IDD | Operating current | 4.5 ≤ VDD ≤ 52 V, no switching, VDIS < 0.8 | 1.5 | 2.5 | mA | |||
2.5 ≤ VDIS ≤ 7 V | 10 | 20 | μA | |||||
VDD < VUVLO(on), VDIS < 0.8 | 530 | μA | ||||||
UNDERVOLTAGE LOCKOUT | ||||||||
VUVLO(on) | Turn on threshold voltage | 4.00 | 4.25 | 4.50 | V | |||
VUVLO(hyst) | UVLO hysteresis | 140 | 195 | 240 | mV | |||
OSCILLATOR | ||||||||
ƒOSC | Oscillator frequency range(1) | 35 | 1000 | kHz | ||||
Oscillator frequency | RRC = 182 kΩ, CRC = 330 pF | 260 | 300 | 340 | ||||
Frequency line regulation | 4.5 ≤ VDD ≤ 52 V | -20% | 7% | |||||
VSLP | Slope compensation ramp | 520 | 620 | 720 | mV | |||
PWM | ||||||||
tON(min) | Minimum pulse width | VDD = 12 V(1) | 275 | 400 | ns | |||
VDD = 30 V | 90 | 200 | ||||||
tOFF(min) | Minimum off time | 170 | 200 | |||||
VVLY | Valley voltage | 1.2 | V | |||||
SOFT-START | ||||||||
VSS(ofst) | Offset voltage from SS pin to error amplifier input | 700 | mV | |||||
RSS(chg) | Soft-start charge resistance | 320 | 430 | 620 | kΩ | |||
RSS(dchg) | Soft-start discharge resistance | 840 | 1200 | 1600 | ||||
ERROR AMPLIFIER | ||||||||
GBWP | Unity gain bandwidth product(1) | 1.5 | 3.0 | MHz | ||||
AOL | Open loop gain(1) | 60 | 80 | dB | ||||
IIB(FB) | Input bias current (current out of FB pin) | 100 | 300 | nA | ||||
ICOMP(src) | Output source current | VFB = 0.6 V, VCOMP = 1 V | 100 | 250 | μA | |||
ICOMP(snk) | Output sink current | VFB = 1.2 V, VCOMP = 1 V | 1.2 | 2.5 | mA | |||
OVERCURRENT PROTECTION | ||||||||
VISNS(oc) | Overcurrent detection threshold (at ISNS pin) | 4.5 ≤ VDD < 52 V, –55°C ≤ TJ ≤ 125°C | 120 | 150 | 180 | mV | ||
DOC | Overcurrent duty cycle(1) | 2% | ||||||
VSS(rst) | Overcurrent reset threshold voltage (at SS pin) | 100 | 150 | 350 | mV | |||
TBLNK | Leading edge blanking(1) | 75 | ns | |||||
CURRENT SENSE AMPLIFIER | ||||||||
ACS | Current sense amplifier gain | 4..2 | 5.6 | 7.4 | V/V | |||
IB(ISNS) | Input bias current | 1 | 3 | μA | ||||
DRIVER | ||||||||
IGDRV(src) | Gate driver source current | VGDRV = 4 V, TJ = 25°C | 375 | 400 | mA | |||
IGDRV(snk) | Gate driver sink current | VGDRV = 4 V, TJ = 25°C | 330 | 400 | ||||
LINEAR REGULATOR | ||||||||
VBP | Bypass voltage output | 0 mA < IBP < 15 mA | 7 | 8 | 9 | V | ||
DISABLE/ENABLE | ||||||||
VDIS(en) | Turn-on voltage | 0.7 | 1.3 | V | ||||
VDIS(hys) | Hysteresis voltage | 25 | 130 | 220 | mV | |||
RDIS | DIS pin pulldown resistance | 0.7 | 1.1 | 1.6 | MΩ |
The TPS40210-EP is a peak current-mode control low-side controller with a built in 400-mA gate driver designed to drive N-channel MOSFETs at a fixed frequency. The frequency is adjustable from 35 kHz to 1000 kHz. Small size combined with complete functionality makes the part both versatile and easy to use.
The controller uses a low-value current-sensing resistor in series with the power MOSFET's source connection to detect switching current. When the voltage drop across this resistor exceeds 150 mV, the part enters an hiccup fault mode with a time period set by the external soft-start capacitor.
The TPS40210-EP uses voltage feedback to an error amplifier that is biased by a precision 700-mV reference. Internal slope compensation eliminates the characteristic sub-harmonic instability of peak current mode control with duty cycles of 50% or greater.
The TPS40210-EP also incorporates a soft-start feature where the output follows a slowly rising soft-start voltage, preventing output-voltage overshoot. The DIS/EN disables the TPS40210-EP putting it in a low quiescent current shutdown mode.
The soft-start feature of the TPS40210-EP is a closed-loop soft-start, meaning that the output voltage follows a linear ramp that is proportional to the ramp generated at the SS pin. This ramp is generated by an internal resistor connected from the BP pin to the SS pin and an external capacitor connected from the SS pin to GND. The SS pin voltage (VSS) is level shifted down by approximately VSS(ofst) (approximately 700 mV) and sent to one of the “+” (the “+” input with the lowest voltage dominates) inputs of the error amplifier. When this level shifted voltage (VSSE) starts to rise at time t1 (see Figure 20), the output voltage the controller expects, rises as well. Since VSSE starts at near 0 V, the controller attempts to regulate the output voltage from a starting point of zero volts. It cannot do this due to the converter architecture. The output voltage starts from the input voltage less the drop across the diode (VIN – VD) and rises from there. The point at which the output voltage starts to rise (t2) is the point where the VSSE ramp passes the point where it is commanding more output voltage than (VIN – VD). This voltage level is labeled VSSE(1). The time required for the output voltage to ramp from a theoretical zero to the final regulated value (from t1 to t3) is determined by the time it takes for the capacitor connected to the SS pin (CSS) to rise through a 700-mV range, beginning at VSS(ofst) above GND.
The required capacitance for a given soft-start time t3 – t1 in Figure 20 is calculated in Equation 1.
where
Note that tSS is the time it takes for the output voltage to rise from 0 V to the final output voltage. Also note the tolerance on RSS(chg) given in the electrical specifications table. This contributes to some variability in the output voltage rise time and margin must be applied to account for it in design.
Also take note of VBP. Its value varies depending on input conditions. For example, a converter operating from a slowly rising input initializes VBP at a fairly low value and increases during the entire startup sequence. If the controller has a voltage above 8V at the input and the DIS pin is used to stop and then restart the converter, VBP is approximately 8V for the entire startup sequence. The higher the voltage on BP, the shorter the startup time is and conversely, the lower the voltage on BP, the longer the startup time is.
The soft-start time (tSS) must be chosen long enough so that the converter can start up without going into an overcurrent state. Since the over current state is triggered by sensing the peak voltage on the ISNS pin, that voltage must be kept below the overcurrent threshold voltage VISNS(oc). The voltage on the ISNS pin is a function of the load current of the converter, the rate of rise of the output voltage and the output capacitance, and the current sensing resistor. The total output current that must be supported by the converter is the sum of the charging current required by the output capacitor and any external load that must be supplied during startup. This current must be less than the IOUT(oc) value used in Equation 15 or Equation 16 (depending on the operating mode of the converter) to determine the current sense resistor value. In these equations, the actual input voltage at the time that the controller reaches the final output voltage is the important input voltage to use in the calculations. If the input voltage is slowly rising and is at less than the nominal input voltage when the startup time ends, the output current limit is less than IOUT(oc) at the nominal input voltage. The output capacitor charging current must be reduced (decrease COUT or increase the tSS) or IOUT(oc) must be increased and a new value for RISNS calculated.
where
The capacitor on the SS pin (CSS) also plays a role in overcurrent functionality. It is used as the timer between restart attempts. The SS pin is connected to GND through a resistor, RSS(dchg), whenever the controller senses an overcurrent condition. Switching stops and nothing else happens until the SS pin discharges to the soft-start reset threshold, VSS(rst). At this point, the SS pin capacitor is allowed to charge again through the charging resistor RSS(chg), and the controller restarts from that point. The shortest time between restart attempts occurs when the SS pin discharges from VSS(ofst) (approximately 700 mV) to VSS(rst) (150 mV) and then back to VSS(ofst) and switching resumes. In actuality, this is a conservative estimate since switching does not resume until the VSSE ramp rises to a point where it is commanding more output voltage than exists at the output of the controller. This occurs at some SS pin voltage greater than VSS(ofst) and depends on the voltage that remains on the output overvoltage the converter while switching has been halted. The fastest restart time can be calculated by using Equation 4, Equation 5, and Equation 6.
The TPS40210-EP has an on board linear regulator the supplies power for the internal circuitry of the controller, including the gate driver. This regulator has a nominal output voltage of 8 V and must be bypassed with a 1-μF capacitor. If the voltage at the VDD pin is less than 8 V, the voltage on the BP pin will also be less and the gate drive voltage to the external FET is reduced from the nominal 8 V. This should be considered when choosing a FET for the converter.
Connecting external loads to this regulator can be done, but care must be taken to ensure that the thermal rating of the device is observed since there is no thermal shutdown feature in this controller. Exceeding the thermal ratings cause out of specification behavior and can lead to reduced reliability. The controller dissipates more power when there is an external load on the BP pin and is tested for dropout voltage for up to 5mA load. When the controller is in the disabled state, the BP pin regulator also shuts off so loads connected there power down as well. When the controller is disabled with the DIS/EN pin, this regulator is turned off.
The total power dissipation in the controller can be calculated as follows. The total power is the sum of PQ, PG, and PE.
where
The DIS/EN pin is an active high shutdown command for the controller. Pulling this pin above 1.2 V causes the controller to completely shut down and enter a low current consumption state. In this state, the regulator connected to the BP pin is turned off. There is an internal 1.1-MΩ pulldown resistor connected to this pin that keeps the pin at GND level when left floating. If this function is not used in an application, it is best to connect this pin to GND.
The TPS40210-EP has a minimum off-time of approximately 200 ns and a minimum on-time of 300 ns. These two constraints place limitations on the operating frequency that can be used for a given input to output conversion ratio. See Figure 2 for the maximum frequency that can be used for a given duty cycle.
The duty cycle at which the converter operates is dependent on the mode in which the converter is running. If the converter is running in discontinuous conduction mode, the duty cycle varies with changes to the load much more than it does when running in continuous conduction mode.
In continuous conduction mode, the duty cycle is related primarily to the input and output voltages.
In discontinuous mode the duty cycle is a function of the load, input and output voltages, inductance and switching frequency.
All converters using a diode as the freewheeling or catch component have a load current level at which they transition from discontinuous conduction to continuous conduction. This is the point where the inductor current just falls to zero. At higher load currents, the inductor current does not fall to zero but remains flowing in a positive direction and assumes a trapezoidal wave shape as opposed to a triangular wave shape. This load boundary between discontinuous conduction and continuous conduction can be found for a set of converter parameters as follows.
For loads higher than the result of Equation 13, the duty cycle is given by Equation 11 and for loads less that the results of Equation 13, the duty cycle is given Equation 12. For Equations 1 through 4, the variable definitions are as follows.
The oscillator frequency is determined by a resistor and capacitor connected to the RC pin of the TPS40210-EP. The capacitor is charged to a level of approximately VDD/20 by current flowing through the resistor and is then discharged by a transistor internal to the TPS40210-EP. The required resistor for a given oscillator frequency is found from either Figure 1 or Equation 14.
where
For most applications a capacitor in the range of 68 pF to 120 pF gives the best results. Resistor values should be limited to between 100 kΩ and 1 MΩ as well. If the resistor value falls below 100 kΩ, decrease the capacitor size and recalculate the resistor value for the desired frequency. As the capacitor size decreases below 47 pF, the accuracy of Equation 14 degrades and empirical means may be needed to fine tune the timing component values to achieve the desired switching frequency.
The TPS40210-EP can be synchronized to an external clock source. Figure 23 shows the functional diagram of the oscillator. When synchronizing the oscillator to an external clock, the RC pin must be pulled below 150 mV for 20 ns or more. The external clock frequency must be higher than the free running frequency of the converter as well. When synchronizing the controller, if the RC pin is held low for an excessive amount of time, erratic operation may occur. The maximum amount of time that the RC pin should be held low is 50% of a nominal output pulse, or 10% of the period of the synchronization frequency. If the external clock signal cannot operate with a low enough duty cycle to limit the amount of time the RC pin is held low, a resistor and capacitor can be added at the gate of the synchronization MOSFET. The capacitor should be added in series with the gate of the MOSFET to AC couple the rising edge of the synchronization signal. The resistor should be added from the gate of the MOSFET to ground to turn off the MOSFET. Typical values for the resistor and capacitor are 220 pF and 1 kΩ.
Under circumstances where the duty cycle is less than 50%, a Schottky diode connected from the RC pin to an external clock may be used to synchronize the oscillator. The cathode of the diode is connected to the RC pin. The trip point of the oscillator is set by an internal voltage divider to be 1/20 of the input voltage. The clock signal must have an amplitude higher than this trip point. When the clock goes low, it allows the reset current to restart the RC ramp, synchronizing the oscillator to the external clock. This provides a simple, single-component method for clock synchronization.
The TPS40210-EP is a current mode controller that uses a resistor in series with the source terminal power FET to sense current for both the current mode control and overcurrent protection. The device enters a current limit state if the voltage on the ISNS pin exceeds the current limit threshold voltage VISNS(oc) from the electrical specifications table. When this happens the controller discharges the SS capacitor through a relatively high impedance and then attempt to restart. The amount of output current that causes this to happen is dependent on several variables in the converter.
The load current overcurrent threshold is set by proper choice of RISNS. If the converter is operating in discontinuous mode the current sense resistor is found in Equation 15.
If the converter is operating in continuous conduction mode RISNS can be found in Equation 16.
where
The TPS40210-EP has a fixed undervoltage lockout (UVLO) that allows the controller to start at a typical input voltage of 4.25 V. If the input voltage is slowly rising, the converter might have less than its designed nominal input voltage available when it has reached regulation. As a result, this may decreases the apparent current limit load current value and must be taken into consideration when selecting RISNS. The value of VIN used to calculate RISNS must be the value at which the converter finishes startup. The total converter output current at startup is the sum of the external load current and the current required to charge the output capacitors. See the Soft-Start for information on calculating the required output capacitor charging current.
The topology of the standard boost converter has no method to limit current from the input to the output in the event of a short circuit fault on the output of the converter. If protection from this type of event is desired, it is necessary to use some secondary protection scheme, such as a fuse, or rely on the current limit of the upstream power source.
A characteristic of peak current mode control results in a condition where the current control loop can exhibit instability. This results in alternating long and short pulses from the pulse width modulator. The voltage loop maintains regulation and does not oscillate, but the output ripple voltage increases. The condition occurs only when the converter is operating in continuous conduction mode and the duty cycle is 50% or greater. The cause of this condition is described in SLUA101, available at www.ti.com. The remedy for this condition is to apply a compensating ramp from the oscillator to the signal going to the pulse width modulator. In the TPS40210-EP the oscillator ramp is applied in a fixed amount to the pulse width modulator. The slope of the ramp is given in Equation 17.
To ensure that the converter does not enter into sub-harmonic instability, the slope of the compensating ramp signal must be at least half of the down slope of the current ramp signal. Since the compensating ramp is fixed in the TPS40210-EP, this places a constraint on the selection of the current sense resistor.
The down slope of the current sense wave form at the pulse width modulator is described in Equation 18.
Since the slope compensation ramp must be at least half, and preferably equal to the down slope of the current sense waveform seen at the pulse width modulator, a maximum value is placed on the current sense resistor when operating in continuous mode at 50% duty cycle or greater. For design purposes, some margin should be applied to the actual value of the current sense resistor. As a starting point, the actual resistor chosen should be 80% or less that the value calculated in Equation 19. This equation calculates the resistor value that makes the slope compensation ramp equal to one half of the current ramp downslope. Values no more than 80% of this result would be acceptable.
where
It is possible to increase the voltage compensation ramp slope by connecting the VDD pin to the output voltage of the converter instead of the input voltage as shown in Figure 26. This can help in situations where the converter design calls for a large ripple current value in relation to the desired output current limit setting.
NOTE
Connecting the VDD pin to the output voltage of the converter affects the startup voltage of the converter since the controller undervoltage lockout (UVLO) circuit monitors the VDD pin and senses the input voltage less the diode drop before startup. The effect is to increase the startup voltage by the value of the diode voltage drop.
If an acceptable RISNS value is not available, the next higher value can be used and the signal from the resistor divided down to an acceptable level by placing another resistor in parallel with CIFLT.
In most cases, a small filter placed on the ISNS pin improves performance of the converter. These are the components RIFLT and CIFLT in Figure 26. The time constant of this filter should be approximately 10% of the nominal pulse width of the converter. The pulse width can be found using Equation 20.
The suggested time constant is then
The range of RIFLT should be from about 1 kΩ to 5 kΩ for best results. Higher values can be used but this raises the impedance of the ISNS pin connection more than necessary and can lead to noise pickup issues in some layouts. CIFLT should be located as close as possible to the ISNS pin as well to provide noise immunity.
There are two methods to design a suitable control loop for the TPS40210-EP. The first and preferred if equipment is available is to use a frequency response analyzer to measure the open loop modulator and power stage gain and to then design compensation to fit that. The usage of these tools for this purpose is well documented with the literature that accompanies the tool and is not be discussed here.
The second option is to make an initial guess at compensation, and then evaluate the transient response of the system to see if the compensation is acceptable to the application or not. For most systems, an adequate response can be obtained by simply placing a series resistor and capacitor (RFB and CFB) from the COMP pin to the FB pin as shown in Figure 27. The initial compensation selection can be done more accurately with aid of WEBENCH® to select the components or the average Spice model to simulate the open loop modulator and power stage gain.
The natural phase characteristics of most capacitors used for boost outputs combined with the current mode control provide adequate phase margin when using this type of compensation. To determine an initial starting point for the compensation, the desired crossover frequency must be considered when estimating the control to output gain. The model used is a current source into the output capacitor and load.
When using these equations, the loop bandwidth should be no more than 20% of the switching frequency, ƒSW. A more reasonable loop bandwidth would be 10% of the switching frequency. Be sure to evaluate the transient response of the converter over the expected load range to ensure acceptable operation.
where
These equations assume that the operation is discontinuous and that the load is purely resistive. The gain in continuous conduction can be found by evaluating Equation 23 at the resistance that gives the critical conduction current for the converter. Loads that are more like current sources give slightly higher gains than predicted here. To find the gain of the compensation network required for a control loop of bandwidth ƒL, take the reciprocal of Equation 22.
The GBWP of the error amplifier is only guaranteed to be at least 1.5MHz. If KCOMP multiplied by ƒL is greater than 750 kHz, reduce the desired loop crossover frequency until this condition is satisfied. This ensures that the high-frequency pole from the error amplifier response with the compensation network in place does not cause excessive phase lag at ƒL and decreased phase margin in the loop.
The RC network connected from COMP to FB places a zero in the compensation response. That zero should be approximately 1/10th of the desired crossover frequency, ƒL. With that being the case, RFB and CFB can be found from Equation 26 and Equation 27
where
Thought not strictly necessary, it is recommended that a capacitor be added between COMP and FB to provide high-frequency noise attenuation in the control loop circuit. This capacitor introduces another pole in the compensation response. The allowable location of that pole frequency determines the capacitor value. As a starting point, the pole frequency should be 10 × ƒL. The value of CHF can be found from Equation 28.
While the error amplifier GBWP will usually be higher, it can be as low as 1.5 MHz. If 10 × KComp × ƒL > 1.5 MHz, the error amplifier gain-bandwidth product may limit the high-frequency response below that of the high-frequency capacitor. To maintain a consistent high-frequency gain roll-off, CHF can be calculated by Equation 29.
where
Some applications benefit from the addition of a resistor connected between the GDRV pin and the gate of the switching MOSFET. In applications that have particularly stringent load regulation (under 0.75%) requirements and operate from input voltages above 5 V, or are sensitive to pulse jitter in the discontinuous conduction region, this resistor is recommended. The recommended starting point for the value of this resistor can be calculated from Equation 30.
where
The TPS40210-EP is designed to operate with input voltages above 4.5 V. The typical VDD UVLO threshold is 4.25 V and the device may operate at input voltages down to the UVLO voltage. At input voltages below the actual UVLO voltage, the device will not switch. When VVDD passes the UVLO threshold the device will become active. Switching is enabled and the soft-start sequence is initiated. The TPS40210-EP will ramp up the output voltage at the rate determined by the external capacitor at the SS pin.
The DIS/EN pin has a 1.2-V typical threshold which can be used to disable the TPS40210-EP. With DIS/EN forced above this threshold voltage the device is disabled and switching is inhibited even if VVDD is above its UVLO threshold. Hysteresis on the DIS/EN pin threshold gives a typical turn-on threshold of 1.05 V. If the DIS/EN is left floating or is pulled below the 1.05-V threshold while VVDD is above its UVLO threshold, the device becomes active. Switching is enabled and the soft-start sequence is initiated. The TPS40210-EP will ramp up the output voltage at the rate determined by the external capacitor at the soft-start pin.
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
The TPS40210-EP is a 4.5-V to 52-V low-side controller with an integrated gate driver for a low-side N-channel MOSFET. This device is typically used in a boost topology to convert a lower DC voltage to a higher DC voltage with a peak current limit set by an external current sense resistor. It can also be configured in a SEPIC, Flyback and LED drive applications. In higher current applications, the maximum current can also be limited by the thermal performance of the external MOSFET and rectifying diode switch. Use the following design procedure to select external components for the TPS40210-EP. The design procedure illustrates the design of a typical boost regulator with the TPS40210-EP. Alternatively, use the WEBENCH software to generate a complete design. The WEBENCH software uses an iterative design procedure and accesses a comprehensive database of components when generating a design.
The following example illustrates the design process and component selection for a 12-V to 24-V nonsynchronous boost regulator using the TPS40210-EP controller.
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
INPUT CHARACTERISTICS | ||||||
VIN | Input voltage | 8 | 12 | 14 | V | |
IIN | Input current | 4.4 | A | |||
No load input current | 0.05 | |||||
VIN(UVLO) | Input undervoltage lockout | 4.5 | V | |||
OUTPUT CHARACTERISTICS | ||||||
VOUT | Output voltage | 23.5 | 24.0 | 24.5 | V | |
Line regulation | 1% | |||||
Load regulation | 1% | |||||
VOUT(ripple) | Output voltage ripple | 500 | mVPP | |||
IOUT | Output current | 8 V ≤ VIN ≤ 14 V | 0.1 | 1 | 2.0 | A |
IOCP | Output overcurrent inception point | 3.5 | ||||
Transient response | ||||||
ΔI | Load step | 1 | A | |||
Load slew rate | 1 | A/μs | ||||
Overshoot threshold voltage | 500 | mV | ||||
Settling time | 5 | ms | ||||
SYSTEM CHARACTERISTICS | ||||||
ƒSW | Switching frequency | 600 | kHz | |||
ηPK | Peak efficiency | VIN = 12 V | 95% | |||
η | Full load efficiency | VIN = 12 V, IOUT = 2 A | 94% | |||
TOP | Operating temperature range | 8 V ≤ VIN ≤ 14 V, IOUT ≤ 2 A | 25 | °C | ||
MECHANICAL DIMENSIONS | ||||||
W | Width | 1.5 | inch | |||
L | Length | 1.5 | ||||
h | Height | 0.5 |
The duty cycle of the main switching MOSFET is estimated using Equation 31 and Equation 32.
Using an estimated forward drop (VFD) of 0.5V for a schottky rectifier diode, the approximate duty cycle is 42.9% (minimum) to 67.3% (maximum).
The peak-to-peak ripple is chosen to be 30% of the maximum input current.
The minimum inductor size can be estimated using Equation 34.
The next higher standard inductor value of 10 μH is selected. The ripple current for nominal and minimum VIN is estimated by Equation 35 and Equation 36.
The worst case peak-to-peak ripple current occurs at 50% duty cycle (VIN = 12.25 V) and is estimated as 1.02 A. Worst case RMS current through the inductor is approximated by Equation 37.
The worst case RMS inductor current is 6.13 A. The peak inductor current is estimated by Equation 38.
A 10-μH inductor with a minimum RMS current rating of 6.13 A and minimum saturation current rating of 6.57 A must be selected. A TDK RLF12560T-100M-7R5 7.5-A 10-μH inductor is selected.
This inductor power dissipation is estimated by Equation 39.
The TDK RLF12560T-100M-7R5 12.4-mΩ DCR dissipates 466-mW of power.
A low forward voltage drop schottky diode is used as a rectifier diode to reduce its power dissipation and improve efficiency. Using 80% derating on VOUT for ringing on the switch node, the rectifier diode minimum reverse break-down voltage is given by Equation 40.
The diode must have reverse breakdown voltage greater than 30 V. The rectifier diode peak and average currents are estimated by Equation 41 and Equation 42.
The power dissipation in the diode is estimated by Equation 43.
For this design, the maximum power dissipation is estimated as 1 W. Reviewing 30-V and 40-V schottky diodes, the MBRS340T3, 40-V, 3-A diode in an SMC package is selected. This diode has a forward voltage drop of 0.48 V at 6 A, so the conduction power dissipation is approximately 960 mW, less than half its rated power dissipation.
Output capacitors must be selected to meet the required output ripple and transient specifications.
A Panasonic EEEFC1V330P 35-V 33-μF, 120-mΩ bulk capacitor and a 6.8-μF ceramic capacitor are selected to provide the required capacitance and ESR at the switching frequency. The combined capacitance of 39.8 μF and ESR of 60 mΩ are used in compensation calculations.
Since a boost converter has continuous input current, the input capacitor senses only the inductor ripple current. The input capacitor value can be calculated by Equation 46 and Equation 47 .
For this design to meet a maximum input ripple of 60mV (1/2% of VIN nominal), a minimum 7.1-μF input capacitor with ESR less than 29mΩ is needed. A 10-μF, X7R ceramic capacitor is selected.
The maximum allowable current sense resistor value is limited by both the current limit and sub-harmonic stability. These two limitations are given by Equation 48 and Equation 49.
With 10% margin on the current limit trip point (the 1.1 factor) and assuming a maximum gate drive current of 500 mA, the current limit requires a resistor less than 15.4 mΩ and stability requires a sense resistor less than 134 mΩ. A 10-mΩ resistor is selected. Approximately 2 mΩ of routing resistance is added in compensation calculations.
The power dissipation in RISNS is calculated by Equation 50.
At maximum duty cycle, this is 0.253 W.
To remove switching noise from the current sense, an RC filter is placed between the current sense resistor and the ISNS pin. A resistor with a value between 1 kΩ and 5 kΩ is selected and a capacitor value is calculated by Equation 51.
For a 1-kΩ filter resistor, 71pF is calculated and a 100-pF capacitor is selected.
The TPS40210-EP drives a ground referenced N-channel FET. The RDS(on) and gate charge are estimated based on the desired efficiency target.
For a target of 95% efficiency with a 24-V Input voltage at 2 A, maximum power dissipation is limited to 2.526 W. The main power dissipating devices are the MOSFET, inductor, diode, current sense resistor and the integrated circuit, the TPS40210-EP.
This leaves 812 mW of power dissipation for the MOSFET. This can likely cause an SO-8 MOSFET to get too hot, so power dissipation is limited to 500 mW. Allowing half for conduction and half for switching losses, we can determine a target RDS(on) and QGS for the MOSFET by Equation 54 and Equation 55.
A target MOSFET gate-to-source charge of less than 13.0 nC is calculated to limit the switching losses to less than 250 mW.
A target MOSFET RDS(on) of 9.9 mΩ is calculated to limit the conduction losses to less than 250 mW. Reviewing 30-V and 40-V MOSFETs, an Si4386DY 9-mΩ MOSFET is selected. A gate resistor was added per Equation 30. The maximum gate charge at VGS= 8V for the Si4386DY is 33.2 nC, this implies RG = 3.3 Ω.
The primary feedback divider resistor (RFB) from VOUT to FB should be selected between 10 kΩ and 100 kΩ to maintain a balance between power dissipation and noise sensitivity. For a 24-V output a high feedback resistance is desirable to limit power dissipation so RFB = 51.1 kΩ is selected.
RBIAS = 1.50kΩ is selected.
Compensation selection can be done with aid of WEBENCH to select compensation components or with the aid of the average Spice model to simulate the open loop modulator and power stage gain. Alternatively the following procedure gives a good starting point.
While current mode control typically only requires Type II compensation, it is desirable to layout for Type III compensation to increase flexibility during design and development. Current mode control boost converters have higher gain with higher output impedance, so it is necessary to calculate the control loop gain at the maximum output impedance, estimated by Equation 57.
The transconductance of the TPS40210-EP current mode control can be estimated by Equation 58.
The maximum output impedance ZOUT, can be estimated by Equation 59.
At the desired crossover frequency (ƒL) of 30 kHz, ZOUT becomes 0.146 Ω.
The modulator gain at the desired cross-over can be estimated by Equation 61.
The feedback compensation network needs to be designed to provide an inverse gain at the cross-over frequency for unity loop gain. This sets the compensation mid-band gain at a value calculated in Equation 62.
To set the mid-band gain of the error amplifier to KCOMP use Equation 63.
R4 = 18.7 kΩ selected.
Place the zero at 1/10th of the desired cross-over frequency.
C2 = 2200 pF selected.
Place a high-frequency pole at about 5 times the desired cross-over frequency and less than one-half the unity gain bandwidth of the error amplifier:
C4 = 47 pF selected.
The RC oscillator calculation is given as shown in Equation 14 in the datasheet, substituting 100 for CT and 600 for ƒSW. For a 600-kHz switching frequency, a 100pF capacitor is selected and a 262-kΩ resistor is calculated (261-kΩ selected).
Since VDD > 8 V, the soft-start capacitor is selected by using Equation 67 to calculate the value.
For TSS = 12 ms, CSS = 240 nF. A 220-nF capacitor is selected.
A regulator bypass (BP) capacitor of 1.0 μF is selected per the datasheet recommendation.
REFERENCE DESIGNATOR |
DESCRIPTION | SIZE | PART NUMBER |
MANUFAC- TURER |
---|---|---|---|---|
C1 | 100 μF, aluminum capacitor, SM, ± 20%, 35 V | 0.406 x 0.457 | EEEFC1V101P | Panasonic |
C2 | 2200 pF, ceramic capacitor, 25 V, X7R, 20% | 0603 | Std | Std |
C3 | 100 pF, ceramic capacitor, 16 V, C0G, 10% | 0603 | Std | Std |
C4 | 47 pF, ceramic capacitor, 16V, X7R, 20% | 0603 | Std | Std |
C5 | 0.22 μF, ceramic capacitor, 16 V, X7R, 20% | 0603 | Std | Std |
C7 | 1.0 μF, ceramic capacitor, 16 V, X5R, 20% | 0603 | Std | Std |
C8 | 10 μF, ceramic capacitor, 25 V, X7R, 20% | 0805 | C3225X7R1E106M | TDK |
C9 | 0.1 μF, ceramic capacitor, 50 V, X7R, 20% | 0603 | Std | Std |
C10 | 100 pF, ceramic capacitor, 16 V, X7R, 20% | 0603 | Std | Std |
D1 | Schottky diode, 3 A, 40 V | SMC | MBRS340T3 | On Semi |
L1 | 10 μH, inductor, SMT, 7.5 A, 12.4 mΩ | 0.325 x 0.318 inch | RLF12560T-100M-7R5 | TDK |
Q1 | MOSFET, N-channel, 40 V, 14 A, 9mΩ | SO-8 | Si4840DY | Vishay |
R3 | 10 kΩ, chip resistor, 1/16 W, 5% | 0603 | Std | Std |
R4 | 18.7 kΩ, chip resistor, 1/16 W, 1% | 0603 | Std | Std |
R5 | 1.5 kΩ, chip resistor, 1/16 W, 1% | 0603 | Std | Std |
R6 | 261 kΩ, chip resistor, 1/16 W, 1% | 0603 | Std | Std |
R7 | 51.1 kΩ, chip resistor, 1/16 W, 1% | 0603 | Std | Std |
R9 | 3.3 Ω, chip resistor, 1/16 W, 5% | 0603 | Std | Std |
R10 | 1.0 kΩ, chip resistor, 1/16 W, 5% | 0603 | Std | Std |
R11 | 10 mΩ, chip resistor, 1/2 W, 2% | 1812 | Std | Std |
U1 | IC, 4.5 V-52 V I/P, current mode boost controller | DGQ10 | TPS40210-EPDGQ | TI |
The TPS40210-EP is designed to operate from an input voltage supply range between 4.5 V and 52 V. This input supply should remain within the input voltage range of the TPS40210-EP. If the input supply is located more than a few inches from the buck power stage controlled by the TPS40210-EP, additional bulk capacitance may be required in addition to ceramic-bypass capacitors. An electrolytic capacitor with a value of 100 uF is a typical choice.
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
The following devices have characteristics similar to the TPS40210-EP and may be of interest.
DEVICE | DESCRIPTION |
---|---|
TPS6100x | Single- and dual-cell boost converter with start-up into full load |
TPS6101x | High-efficiency 1-cell and 2-cell boost converters |
TPS6300x | High-efficiency single inductor buck-boost converter with 1.8-A switches |
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