TPS53679 Dual-Channel (6-Phase +1-Phase) or (5-Phase + 2-Phase) D-CAP+™ Step-Down Multiphase Controller with NVM and PMBus™ for VR13 Server VCORE

1 Device Overview

1.1 Features

Intel VR13 Serial VID (SVID) Compliant
Full VR13 Server Feature Set Including Digital Input Power Monitor
Programmable Loop Compensations
Configurable with Non-Volatile Memory (NVM) for Low External Component Counts
Individual Phase Current Calibrations and Reports
Dynamic Phase Shedding with Programmable Current Threshold for Optimizing Efficiency at Light and Heavy Loads
Fast Phase-Adding for Undershoot Reduction (USR)
Backward VR12.0 and VR12.5 Compatible
8-Bit DAC with Selectable 5 mV or 10 mV Resolution and Output Ranges from 0.25 V to 1.52 V or 0.5 to 2.8125 V for Dual Channels
Driverless Configuration for Efficient High-Frequency Switching
Fully Compatible with TI NextFET™ Power Stage for High-Density Solutions
Accurate, Adjustable Voltage Positioning
Patented AutoBalance™ Phase Balancing
Selectable, 16-level Per-Phase Current Limit
PMBus™ System Interface for Telemetry of Voltage, Current, Power, Temperature, and Fault Conditions
Dynamic Output Voltage Transitions with Programmable Slew Rates via SVID or PMBus Interface
Conversion Voltage Range: 4.5 V to 17 V
Low Quiescent Current

1.2 Applications

ASIC Needs Dual Power Rails
High-Performance Processor Power

1.3 Description

The TPS53679 is a fully VR13 SVID compliant step-down controller with dual channels, built-in non-volatile memory (NVM), and PMBus™ interface, and is fully compatible with TI NexFET ™power stage. Advanced control features such as D-CAP+™ architecture with undershoot reduction (USR) provide fast transient response, low output capacitance, and good current sharing. The device also provides novel phase interleaving strategy and dynamic phase shedding for efficiency improvement at different loads. Adjustable control of V_CORE slew rate and voltage positioning round out the Intel® VR13™ features. In addition, the device supports the PMBus communication interface for reporting the telemetry of voltage, current, power, temperature, and fault conditions to the systems. All programmable parameters can be configured by the PMBus interface and can be stored in NVM as the new default values to minimize the external component count.

The TPS53679 device if offered in a thermally enhanced -pin QFN packaged and is rated to operate from –40°C to 125°C.

Table 1-1 Device Information⁽¹⁾

PART NUMBER	PACKAGE	BODY SIZE
TPS53679	QFN (40)	5 mm × 5 mm

(1) For more information, see, Mechanical, Packaging, and Orderable Information.

2 Revision History

DATE	REVISION	NOTES
November 2016	*	Initial release.

3 Device and Documentation Support

3.1 Receiving Notification of Documentation Updates

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3.2 Community Resources

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3.3 Trademarks

NextFET, AutoBalance, PMBus, NexFET, D-CAP+, E2E are trademarks of Texas Instruments.

VR13 is a trademark of Intel.

Intel is a registered trademark of Intel.

PMBus is a trademark of SMIF, Inc..

3.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

3.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.