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  • TPS61291 Low Iq Boost Converter with Bypass Operation

    • SLVSBX9A September   2014  – September 2014 TPS61291

      PRODUCTION DATA.  

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  • TPS61291 Low Iq Boost Converter with Bypass Operation
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bypass / Boost Mode Operation EN/BYP
      2. 7.3.2 Output Voltage Selection VSEL
      3. 7.3.3 Feedback Divider Disconnect
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Overtemperature Protection
      6. 7.3.6 Overvoltage Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Boost Mode Operation
      2. 7.4.2 Bypass Mode Operation
      3. 7.4.3 Controlled Transition into Bypass Mode
      4. 7.4.4 Operation at Output Overload
      5. 7.4.5 Startup
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • DRV|6
    • MPDS216E
Thermal pad, mechanical data (Package|Pins)
  • DRV|6
    • QFND087M
Orderable Information
  • slvsbx9a_oa
  • slvsbx9a_pm
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DATA SHEET

TPS61291 Low Iq Boost Converter with Bypass Operation

1 Features

  • Input Voltage Range 0.9V to 5V
  • Startup Voltage 1.5V at 20mA Load
  • Pin Selectable Output Voltages: 3.3V, 3V, 2.5V
  • 15nA typical Quiescent Current in Bypass Mode
  • 5.7μA typical Quiescent Current in Boost Mode
  • Bypass Switch from VIN to VOUT
  • IOUT > 200mA at 3.3V VOUT, VIN = 1.8V
  • Internal Feedback Divider Disconnect (Bypass Mode)
  • Controlled Bypass Transition Prevents Reverse Current into Battery
  • Power-Save Mode at Light Loads
  • Overtemperature Protection
  • Redundant Overvoltage Protection
  • Small 2mm x 2mm SON 6-pin package

2 Applications

  • Metering (Gas, Water, Smart Meters)
  • Remote Controls
  • Home Security / Home Automation
  • Single 3V Li-MnO2 or 2 x 1.5V Alkaline Cell Powered Applications

3 Description

The TPS61291 is a boost converter with pin selectable output voltages and an integrated bypass mode. In bypass operation, the device provides a direct path from the input to the system and allows a low power micro controller (MCU) such as the MSP430 to operate directly from a single 3V Li-MnO2 battery or dual alkaline battery cells.

In bypass mode the integrated feedback divider network for boost mode operation is disconnected from the output and the quiescent current consumption drops down to only 15nA (typical).

In boost mode the device provides a minimum output current of 200mA at 3.3V VOUT from 1.8V VIN. The boost mode is used for system components which require a regulated supply voltage and cannot directly operate from the input source. The boost converter is based on a current-mode controller using synchronous rectification to obtain maximum efficiency and consumes typically 5.7uA from the output. During startup of the boost converter, the VSEL pin is read out and the integrated feedback network sets the output voltage to 2.5V, 3V or 3.3V.

Bypass mode or boost mode operation is controlled by the system via the EN/BYP pin.

The device integrates an enhanced bypass mode control to prevent charge, stored in the output capacitor during boost mode operation, from flowing back to the input and charging the battery.

The device is packaged in a small 6-pin SON package (DRV) measuring 2.0mm × 2.0mm x 0.75mm.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPS61291 SON (6) 2.00 mm x 2.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Schematic and Efficiency Curves

TPS61291_frontpage_schem_graph.gif

4 Revision History

Changes from * Revision (September 2014) to A Revision

  • Changed "Bypass Mode Operation" description Go
  • Added sub-section "Controlled Transition into Bypass Mode" Go
  • Added NOTE to the "Application and Implementation" section. Go
  • Changed "List of Inductors" table Go

5 Pin Configuration and Functions

DRV Package
6 Pin
Top View
po_TPS61290.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
SW 1 I Switch node of the converter. Connect the inductor between this pin and the input capacitor CIN.
VOUT 2 O Boost converter output. Connect the output capacitor COUT between this pin and GND close to the device.
VIN 3 PWR Input voltage supply pin for the boost converter. Connect the input capacitor CIN between this pin and GND as close as possible to the device.
EN/BYP 4 I Control pin of the device. A high level enables the boost mode operation. A low level disables the boost converter and enables bypass mode operation. EN/BYP must be actively terminated high or low. Usually, this pin is controlled by the MCU in the system.
VSEL 5 I Output voltage selection pin. The logic level of this pin is read out during startup and internally latched. Connect this pin only to GND, VOUT, or leave it floating.
GND 6 PWR Ground pin of the device.
EXPOSED THERMAL PAD NC Not electrically connected to the IC, but must be soldered to achieve specified thermal performance. Connect this pad to the GND pin and use it as a central GND plane.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Pin Voltage Range (2) VIN -0.3 5.5 V
SW -0.3 7
EN/BYP, VOUT -0.3 5.5
VSEL -0.3 VOUT + 0.3V
Output Current In Bypass Operation (EN/BYP = GND) 250 mA
TJ Maximum Junction Temperature -40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal GND.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM) per ANSI/ESDA/JEDEC JS-001, all pins(1) -2 2 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) -0.5 0.5
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Supply voltage for startup 1.5 V
Supply voltage range (once device has started) 0.9 5
Supply voltage range for step up conversion (once device has started) 0.9 VOUT
TA Operating ambient temperature -40 85 °C
TJ Operating junction temperature –40 125

6.4 Thermal Information

THERMAL METRIC(1) TPS61291 UNIT
DRV (2x2 SON)
6 PINS
RθJA Junction-to-ambient thermal resistance 71.2 °C/W
RθJCtop Junction-to-case (top) thermal resistance 93.5
RθJB Junction-to-board thermal resistance 46.7
ψJT Junction-to-top characterization parameter 2.5
ψJB Junction-to-board characterization parameter 41.1
RθJCbot Junction-to-case (bottom) thermal resistance 11.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TA = –40°C to 85°C. Typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
VIN Startup voltage VOUT = 3.3V, IOUT = 20mA 1.5 V
Input voltage range Operating voltage range 0.9 5
IQ Quiescent current in boost mode VIN IOUT = 0 mA, VEN/BYP = VIN = 1.8 V, VOUT = 3.3V, device not switching 0.4 1.5 μA
VOUT 5.7 9
Quiescent current in bypass mode VIN VEN/BYP = low, VIN = 3 V, IOUT = 0 mA 0.015 0.5
ILkSW Leakage current into SW VEN/BYP = low, VIN = 1.2 V, VSW = 1.2 V 0.01 0.5 μA
VUVLO Undervoltage lockout threshold VIN decreasing 0.65 0.9 V
Overtemperature protection TJ rising 140 °C
Overtemperature hysteresis 20 °C
INPUTS
IIN EN/BYP, input current EN/BYP = low or EN/BYP = VIN 0.01 0.1 μA
VIL EN/BYP, input low voltage VIN ≤ 1.5 V 0.2 × VIN V
5 V > VIN > 1.5 V 0.3
VIH EN/BYP, input high voltage VIN ≤ 1.5 V 0.8 × VIN V
5 V > VIN > 1.5 V 1.2
VIL VSEL, input low voltage VEN/BYP = high 0.3 V
VIH VSEL, input high voltage VEN/BYP = high VOUT - 0.3 V
IIN VSEL, input current VEN/BYP = high, VSEL = VOUT = 3V 0.01 0.1 μA
POWER SWITCHES
RDS(ON) Rectifying switch on resistance VOUT = 3.3 V 0.6 Ω
Main switch on resistance VOUT = 3.3 V 0.4 Ω
Bypass switch on resistance VIN = 1.8V, IOUT = 50 mA, EN/BYP = low 1.2 Ω
ISW Switch current limit VOUT = 3.3V 700 1000 1300 mA
OUTPUT
VOUT Output voltage accuracy VIN = 1.8V, IOUT = 10 mA, VOUT 3.3V, 3.0V, 2.5V, EN/BYP = high -2 +1 +4 %
Line regulation VOUT = 3.3V, VIN = 2V to 3.0V, IOUT = 50 mA, EN/BYP = high +0.15 %/V
Load regulation VIN = 2V, VOUT = 3.3V, IOUT = 1 mA to 200 mA, EN/BYP = high -0.007 %/mA
VOVP Output overvoltage protection VOUT rising, EN/BYP = high 5.4 V

6.6 Typical Characteristics

ATE_IQ_Bypass_Vs_temp.gif
EN/BYP = low VSEL = low IOUT = 0mA
Figure 1. Quiescent Current IQ into VIN Pin in Bypass Mode
ATE_IQ_VOUT_vs_temp.gif
EN/BYP = high Boost mode operation
IOUT = 0mA Device not switching
Figure 3. Quiescent Current IQ into VOUT Pin in Boost Mode
ATE_RDSON_Main_switch_vs_temp.gif
VOUT = 3.3V
Figure 5. RDSON Main Switch
ATE_IN_vs_temp.gif
EN/BYP = high Boost mode operation
Device not switching
Figure 2. Quiescent Current IQ into VIN Pin in Boost Mode
ATE_RDSON_Byp_vs_temp.gif
Figure 4. RDSON Bypass Switch
ATE_RDSON_rect_switch_vs_temp.gif
VOUT = 3.3V
Figure 6. RDSON Rectifier Switch

 
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