The TS3A227E is an autonomous audio accessory detection and configuration switch that detects 3-pole or 4-pole audio accessories and configures internal switches to route the signals accordingly.
The internal ground FETS of the TS3A227E have an ultra-low RON of 60 mΩ to minimize crosstalk impact. The ground FETs are also designed to pass FM signals, making it possible to use the ground line of the accessory as an FM antenna in mobile audio applications.
Internal isolation switches allow the TS3A227E to remove the click/pop noise that can be generated during and insertion or removal of an audio accessory. In addition depletion FETs prevent a floating ground while the device is unpowered, removing the humming noise present when leaving accessories plugged into an unpowered system.
A low-power sleep mode is provided which shuts down internal circuitry to achieve very low quiescent current draw when no headset is inserted.
The TS3A227E features integrated key press detection for detecting up to 4 keys with press and release support.
Manual I2C control allows the TS3A227E to adapt to application needs by providing control over de-bounce settings and switch states.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TS3A227E | QFN (16) | 3.50 mm × 3.50 mm |
DSBGA (16) | 1.79 mm × 1.79 mm |
PIN | TYPE | DESCRIPTION | ||
---|---|---|---|---|
NAME | RVA | YFF | ||
DET_TRIGGER | 15 | B1 | I/O | A falling edge from high to low on this pin triggers accessory detection. This pin can be connected the headset jack to allow automatic pull-down to ground after headset insertion to initialize detection. |
GND | 1, 2 | A2, B2 | GND | Primary ground connection for the TS3A227E. Must be connected to system ground. |
GNDA | 11 | D2 | I/O | Ground connection for the internal ground FETs of the TS3A227E. If FM is being supported connect this pin to the FM matching network. If FM is not being support connect this pin to system ground. |
GND_SENSE | 5 | A4 | I/O | Ground sense line for the codec. |
INT | 13 | C2 | GND | Open drain interrupt output from the TS3A227E to notify the host that an event has occurred. If I2C is not used this pin must be grounded. |
MIC_PRESENT | 16 | A1 | I/O | Open drain output to indicate to the host that a headset with a microphone is inserted.. |
MICP | 6 | B4 | I/O | Microphone signal connection to the codec. Microphone bias is applied to this pin. |
RING2 | 12 | D1 | O | Headset current return path if RING2 is ground for the headset. Connect to 3.5 mm jack RING2 connection with low DC resistance trace. |
RING2_SENSE | 7 | C4 | GND | Connected to the RING2 pin of the 3.5 mm jack. If RING2 pin on plug in is MIC signal, this is connected to MICP. If not, this is connected to GND_SENSE and becomes the ground sensing feedback for the accessory |
SCL | 9 | C3 | I | Clock from I2C bus. This can be connected to VDD if I2C is not used. |
SDA | 3 | B3 | I/O | Bidirectional data from/to I2C bus. This can be connected to VDD if I2C is not used. |
SLEEVE | 10 | D3 | O | Headset current return path if SLEEVE is GND for headset. Connect to 3.5 mm jack SLEEVE connection with low DC resistance trace. |
SLEEVE_SENSE | 8 | D4 | GND | Connected to the SLEEVE pin of the 3.5 mm jack. If SLEEVE pin on plug in is MIC signal, this is connected to MICP. If not, this is connected to GND_SENSE and becomes the ground sensing feedback for the accessory |
THERMAL PAD | GND | The THERMAL PAD of the RVA – QFN package must be connected to any internal PCB ground plane using multiple vias for best thermal performance. | ||
TIP | 14 | C1 | I/O | Connect to the TIP pin of the 3.5 mm jack. |
VDD | 4 | A3 | PWR | Power input to the TS3A227E. External de-coupling capacitors are required on this pin. |