TI has selected Richardson, Texas as the location for our next 300mm analog wafer fab

We are pleased to announce TI has selected Richardson, Texas as the location for our next 300mm analog wafer fab. The decision to build a second fab in Richardson furthers our ongoing commitment to North Texas and is an important step in our strategy to invest in more 300mm manufacturing capacity, which is a competitive advantage for our company.

Our first Richardson fab, RFAB, was the world’s first 300mm analog fab when it opened in 2009, and has been instrumental in enabling us to support our customers through an exciting period of industry growth, particularly in markets such as automotive and industrial. A new 300mm factory will enable us to continue to support our customers well into the future by delivering products with both competitive lead times and cost, since larger 300mm wafers produce more than two times the number of analog chips compared to 200mm wafers.

This is exciting news for our employees and a testament to the North Texas communities where so many of us live and work. We selected Richardson because of some unique advantages the city provides including access to talent, an existing supplier base and multiple airports, as well as operational efficiencies due to the close proximity of the new fab to our existing RFAB.

We plan to begin construction of a new parking garage on our Richardson campus soon to support the growing number of employees at that location. We anticipate starting construction in the next few years, but exact timing of factory construction, tool installation and the addition of several hundred jobs to support the new factory will be influenced by market demand and other factors. When completed, this state-of-the-art 300mm analog wafer fab will provide the additional capacity we require to manufacture the innovative products our customers need for decades to come.

Kyle Flessner is senior vice president, Technology and Manufacturing Group.