TI’s new 300-millimeter wafer fab in Richardson, Texas, begins initial production

Our company’s newest 300-millimeter wafer fab in Richardson, Texas, has started initial production and will ramp over the coming months to support the future growth of semiconductors in electronics. RFAB2 is connected to RFAB1, which opened in 2009 as the world’s first 300-mm analog wafer fab, and is one of six new 300-mm wafer fabs our company is adding to our manufacturing operations.

“We are thrilled to see initial production running through our newest and largest 300-mm wafer fab, which is part of our investment to expand internal manufacturing capacity for the long term,” said Kyle Flessner, senior vice president, Technology and Manufacturing Group. “This milestone is a result of close collaboration between our construction, facilities and manufacturing teams and we’re excited to ramp output over the coming months to support our customers’ demand for years to come.”

Building advanced manufacturing in Richardson, Texas

The new fab is more than 30% larger than RFAB1, offering more than 630,000 square feet of total clean room space between the two fabs. Fifteen miles of automated, overhead delivery systems will seamlessly move wafers between the two fabs once fully built out.

At full production, the Richardson fabs will manufacture more than 100 million analog chips every day that will go into electronics everywhere – from renewable energy sources to electric vehicles.

"Having these two fabs connected within one manufacturing site in Richardson, Texas, provides great operational efficiencies and scale, allowing us to better support our customers," Kyle said. "We’ve been in North Texas for more than 90 years and are proud of the great partnership we have with the Richardson community. This is an exciting time for our employees and all of North Texas as we continue to build semiconductor manufacturing excellence together."

Our company has a long-standing commitment to responsible, sustainable manufacturing. RFAB1 was the world’s first LEED Gold-certified (Leadership in Energy and Environmental Design) analog semiconductor manufacturing facility, designed to meet one of the rating system’s high levels of structural efficiency and sustainability. RFAB2 builds on this commitment and was also designed to meet LEED Gold standards.

Investing in 300-mm manufacturing capacity

RFAB2 complements our existing 300-mm wafer fab footprint, including DMOS6 (Dallas) and RFAB1 (Richardson), and is one of six new 300-mm wafer fabs our company is adding to internally manufacture our broad, diverse portfolio of analog and embedded processing semiconductor devices. LFAB in Utah, which our company purchased in 2021, is preparing for initial production in the coming months. Our company also announced a $30 billion investment in four new fabs in Sherman, Texas, last year. Construction of the first and second fabs is under way, with production from the first fab expected in 2025.

“Our 300-mm wafer fab expansion plays an important role in TI’s future growth and in our ability to support customers’ demand for decades,” said Mohammad Yunus, senior vice president, Manufacturing Operations. “I’m proud of the progress that’s been made and I’m looking forward to continuing to ramp 300-mm production in RFAB2 over the coming months.”