Packaging terminology

Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options.

Common package groups	Defintion
BGA	Ball Grid Array
CFP	Both Formed and Unformed CFP = Ceramic Flat Pack
CGA	Column Grid Array
COF	Chip on Flex
COG	Chip on Glass
DIP	Dual In-Line Package or Dual Row Package
DLP	Digital Light Processing
DSBGA	Die Size Ball Grid Array, also referred to as WCSP = Wafer Chip Scale Package
FCBGA	Flip Chip Ball Grid Array
FCCSP	Flip Chip Chip Scale Package
LCC	Leaded Chip Carrier
LGA	Land Grid Array
Module	Module
nFBGA	New Fine Pitch Ball Grid Array
NFMCA-LID	Substrate Metal Cavity with Lid
OPTO	Light Sensor Package = optical
PBGA	Plastic Ball Grid Array
PFM	Plastic Flange Mount Package
PGA	Pin Grid Array
POS	Package on Substrate
QFN	Quad Flatpack No Lead
QFP	Quad Flat Package
SIP Modules	System in Package Modules
SIPP	Single-In-Line Pin Package
SO	Small Outline
SON	Small Outline No Lead, also referred as DFN = Dual Flatpack No Lead
TO	Transistor Outlines, also referred to as I2PAC or D2PAC
uCSP	Micro Chip Scale Package
WCSP	Wafer Chip Scale Package, also referred to as DSBGA
ZIP	Zig-Zag In-Line

Package family	Definition
CBGA	Ceramic Ball Grid Array
CDIP	Glass-Sealed Ceramic Dual In-Line Package
CDIP SB	Side-Braze Ceramic Dual In-Line Package
CPGA	Ceramic Pin Grid Array
CZIP	Ceramic Zig-Zag Package
DFP	Dual Flat Package
DIMM	Dual-In-Line Memory Module
FC/CSP	Flip Chip / Chip Scale Package
HLQFP	Thermally Enhanced Low Profile Quad Flat Package
HQFP	Thermally Enhanced Quad Flat Package
HSOP	Thermally Enhanced Small-Outline Package
HSSOP	Thermally Enhanced Shrink Small-Outline Package
HTQFP	Thermally Enhanced Thin Quad Flat Pack
HTSSOP	Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP	Thermally Enhanced Very Thin Quad Flat Package
JLCC	J-Leaded Ceramic or Metal Chip Carrier
LCCC	Leadless Ceramic Chip Carrier
LPCC	Leadless Plastic Chip Carrier
LQFP	Low Profile Quad Flat Pack
MCM	Multi-Chip Module
MQFP	Metal Quad Flat Package
PDIP	Plastic Dual-In-Line Package
PLCC	Plastic Leaded Chip Carrier
PPGA	Plastic Pin Grid Array
SDIP	Shrink Dual-In-Line Package
SIMM	Single-In-Line Memory Module
SODIMM	Small Outline Dual-In-Line Memory Module
SOJ	J-Leaded Small-Outline Package
SOP	Small-Outline Package (Japan)
SSOP	Shrink Small-Outline Package
TQFP	Thin Quad Flat Package
TSOP	Thin Small-Outline Package
TSSOP	Thin Shrink Small-Outline Package
TVFLGA	Thin Very-Fine Land Grid Array
TVSOP	Very Thin Small-Outline Package
VQFP	Very Thin Quad Flat Package
VSOP	Very Small Outline Package
VSSOP	Very Thin Shrink Small Outline Package, also referred as MSOP = Micro Small Outline Package
XCEPT	Exceptions - May not be a real Package

Product preference code	Definition
A	Requires department/business unit approval.
N	Not recommended for new designs.
OK	Use if a preferred package is not available.
P	Preferred package. Package is qualified and orderable.
X	Do not use. No longer supported. Not qualified. No longer tooled.

Terms	Definition
Assembly site	The plant location(s) where a TI device is assembled.
Coplanarity	The bottom surface of the package is parallel to the landing surface of the PCB.
Eligibility	The device can be added to the ESL list immediately.
ePOD	Enhanced Package Outline Drawing (Typically includes package outline, land pattern, and stencil design).
Extended shelf life	TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor.
Footprint	The periphery leads and thermal pad of a "no-lead" package.
Green	TI’s full definition of Green is within the TI Low Halogen (Green) Statement found on our Environmental information page. Data flags under the Green field can be: Yes: Fully compliant to TI Green definition. No: Not compliant to TI Green definition.
IEC 62474 DB	The IEC 62474 database (IEC 62474 DB) is the worldwide regulatory list of restricted substances, applications and thresholds as they apply to electronic products maintained by the IEC 62474 Validation Team committee. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time. TI products that are compliant to RoHS requirements are also fully compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide). Data flags under the IEC 62474 DB field can be: Yes: Fully compliant to IEC 62474 DB. Affected: Compliant to IEC 62474 DB with the use of REACH SVHC substance(s) when contained above threshold, REACH SVHCs are not restricted from use but if contained above threshold, further information must be available. No: Not compliant to IEC 62474 DB.
JEDEC	The JEDEC Standard for this package type.
Land pattern	The pattern of solderable area on the PCB where a "no-lead" package may rest.
Lead finish/Ball material	The current metal finish on the leads or solder balls of a device.
Length	The length of the device (in millimeters).
Mass (mg)	Representative device weight (per part) in milligrams.
Maximum height	The maximum height above board surface form (in millimeters).
MSL rating/Peak reflow	The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL rating/Peak reflow are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board.
Package \| Pins	The TI package designator or package name for a device, or the number of pins for a device.
Pins	The number of pins or terminals on the package.
Pitch	The distance between the centers of adjacent pins (in millimeters).
Pkg	Package designator code or package name used in TI part numbers.
PN type	Indicates whether the part number is Pb-Free or standard.
PPM to Mass Percentage conversion table	Parts per million (PPM) to mass % table: 1 ppm = 0.0001 % 10 ppm = 0.001 % 100 ppm = 0.01 % 1000 ppm = 0.1 % 10000ppm = 1.0 %
REACH	The European Union’s Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC) as well as substances under restriction, REACH Annex XVII. The REACH SVHC list is usually updated 2 times per year and the REACH Annex XVII list updated as needed. TI’s latest REACH statement is located on our Environmental information page. Data flags under the REACH field can be: Yes: Fully compliant to EU REACH. Affected: Only used when a REACH SVHC substance(s) is contained above threshold 0.1% REACH Article threshold. Any REACH SVHC above the threshold is not restricted from use but if contained above threshold, further information must be available. No: Not compliant to EU REACH – a restricted substance(s) under REACH Annex XVII is contained outside of allowed application.
Recyclable metals - ppm	The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. TI reports values at the mass (mg) and ppm level. For WEEE, ppm calculations are at the component level. An example for calculating the ppm gold content follows. Example: ppm= 1,000,000 * total amount of gold in component (mg) / total component weight (mg) Gold mass = 0.23mg & Component mass = 128mg 1,000,0000 * 0.23 mg gold / 128mg component = 1,797 ppm
RoHS	On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which became effective July 1, 2006. TI’s latest RoHS statement is found on our Environmental information page. It restricted the following substances at the homogenous (material) level with associated maximum thresholds. 1. Lead (Pb): 0.1% (1000ppm) 2. Mercury (Hg): 0.1% (1000ppm) 3. Hexavalent Chromium (Cr6+): 0.1% (1000ppm) 4. Cadmium (Cd): 0.01% (100ppm) 5. Polybrominated biphenyls (PBB): 0.1% (1000ppm) 6. Polybrominated diphenyl ethers (PBDE): 0.1% (1000ppm) Since then, there have been several updates to the Directive, the major ones being 2011/65/EU on 8 June 2011 that recasted exemptions expiring in 2011 to future dates (most in 2016). Amendment EU 2015/863 released on 4 June 2015 and comes into effect 22 July 2019 that added 4 phthalates to the list of 6 restricted substances: 7. Bis(2-ethylhexyl) phthalate (DEPH): 0.1% (1000ppm) 8. Butyl benzyl phthalate (BBP): 0.1% (1000ppm) 9. Dibutyl phthalate (DBP): 0.1% (1000ppm) 10. Diisobultyl phthalate (DIBP): 0.1% (1000ppm) Further revisions continue to be released and TI will maintain its documentation and requirements as they are released, including information on exemptions that may be required. Data flags under the RoHS field can be: Yes: fully compliant to EU RoHS, no exemption required Exempt: fully compliant to EU RoHS, with an exemption applied No: Not compliant to EU RoHS RoHS restricted substances – ppm calculation The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance. PPM = (mass of substance / mass of material) * 1,000,000 * total amount of each RoHS substance contained in the material. EXAMPLE: Lead (Pb) in leadframe example: (mass of Lead: 0.006273 mg / total mass of leadframe: 62.730001mg) * 1,000,000 = 100 ppm
Search part number	The TI or customer part number entered on the initial Search page.
Thermal pad = Exposed pad = Power pad	The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements.
Thickness	The maximum thickness of the package body (in millimeters).
TI part number	The part number to use when placing orders.
Total device mass (mg)	Weight of the component in milligrams.
Type	The abbreviated acronymn for this type of package, also referred as Package Family.
Width	The width of the device (in millimeters).