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Design Rule Verification Report

Date : 12/2/2014
Time : 9:54:59 PM
Elapsed Time : 00:00:02
Filename : D:\Project Files\TIDA-00400\Design Files\For 3D View PDF\TIDA-00400\TIDA-00400.PcbDoc
Warnings : 0
Rule Violations : 21

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=8.6mil) ((InPadClass('Pad Class'))),((InPadClass('Pad Class'))) 0
Clearance Constraint (Gap=12mil) (IsSMTPin),(IsVia) 13
Clearance Constraint (Gap=10mil) (IsVia),(IsVia) 0
Clearance Constraint (Gap=40mil) (OnCopper and InComponentClass('Mounting Holes')),(IsKeepOut) 8
Clearance Constraint (Gap=25mil) (OnCopper and InPoly),(IsKeepOut) 0
Clearance Constraint (Gap=25mil) (InPolygon),(All) 0
Clearance Constraint (Gap=11mil) (All),(All) 0
Width Constraint (Min=11mil) (Max=100mil) (Preferred=15mil) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Routing Layers(All) 0
Routing Via (MinHoleWidth=16mil) (MaxHoleWidth=16mil) (PreferredHoleWidth=20mil) (MinWidth=32mil) (MaxWidth=32mil) (PreferedWidth=40mil) (IsVia and InAnyComponent) 0
Routing Via (MinHoleWidth=16mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=20mil) (MinWidth=32mil) (MaxWidth=40mil) (PreferedWidth=40mil) (All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Minimum Annular Ring (Minimum=8mil) (All) 0
Hole Size Constraint (Min=8mil) (Max=251mil) (All) 0
Pads and Vias to follow the Drill pairs settings 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=10mil) (Max=100mil) (Preferred=10mil) (All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Net Antennae (Tolerance=0mil) (All) 0
Total 21


Clearance Constraint (Gap=12mil) (IsSMTPin),(IsVia)
Via (1240mil,231.835mil) Top Layer to Bottom Layer Pad U3-21(1240mil,280mil) Top Layer
Via (1240mil,328.165mil) Top Layer to Bottom Layer Pad U3-21(1240mil,280mil) Top Layer
Via (1191.835mil,280mil) Top Layer to Bottom Layer Pad U3-21(1240mil,280mil) Top Layer
Via (1240mil,280mil) Top Layer to Bottom Layer Pad U3-21(1240mil,280mil) Top Layer
Via (1288.165mil,280mil) Top Layer to Bottom Layer Pad U3-21(1240mil,280mil) Top Layer
Via (1480mil,1765mil) Top Layer to Bottom Layer Pad U5-9(1502.4mil,1750mil) Top Layer
Via (1521.1mil,1737.6mil) Top Layer to Bottom Layer Pad U5-9(1502.4mil,1750mil) Top Layer
Via (1430mil,640mil) Top Layer to Bottom Layer Pad U4-9(1407mil,659mil) Top Layer
Via (1385mil,680mil) Top Layer to Bottom Layer Pad U4-9(1407mil,659mil) Top Layer
Via (702.599mil,1346.378mil) Top Layer to Bottom Layer Pad U2-9(678.977mil,1370mil) Top Layer
Via (702.599mil,1393.622mil) Top Layer to Bottom Layer Pad U2-9(678.977mil,1370mil) Top Layer
Via (655.355mil,1346.378mil) Top Layer to Bottom Layer Pad U2-9(678.977mil,1370mil) Top Layer
Via (655.355mil,1393.622mil) Top Layer to Bottom Layer Pad U2-9(678.977mil,1370mil) Top Layer
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Clearance Constraint (Gap=40mil) (OnCopper and InComponentClass('Mounting Holes')),(IsKeepOut)
Track (1965mil,35mil)(1965mil,1965mil) Keep-Out Layer Pad H4-1(1803.15mil,196.85mil) Multi-Layer
Track (35mil,35mil)(1965mil,35mil) Keep-Out Layer Pad H4-1(1803.15mil,196.85mil) Multi-Layer
Track (35mil,35mil)(35mil,1965mil) Keep-Out Layer Pad H2-1(196.85mil,196.85mil) Multi-Layer
Track (35mil,35mil)(1965mil,35mil) Keep-Out Layer Pad H2-1(196.85mil,196.85mil) Multi-Layer
Track (1965mil,35mil)(1965mil,1965mil) Keep-Out Layer Pad H3-1(1803.15mil,1803.15mil) Multi-Layer
Track (35mil,1965mil)(1965mil,1965mil) Keep-Out Layer Pad H3-1(1803.15mil,1803.15mil) Multi-Layer
Track (35mil,35mil)(35mil,1965mil) Keep-Out Layer Pad H1-1(196.85mil,1803.15mil) Multi-Layer
Track (35mil,1965mil)(1965mil,1965mil) Keep-Out Layer Pad H1-1(196.85mil,1803.15mil) Multi-Layer
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