Altium

Design Rule Verification Report

Date: 29-04-2021
Time: 12:23:00
Elapsed Time: 00:00:58
Filename: C:\Users\Karunakaran\Desktop\TS26265AC0_8787-D_MMWCAS-DSP-EVM\WorkingFile\PROC055B_Cascade_Radar_Host(04072021_1107AM)\8787-D_MMWCAS-DSP-EVM_DATABASE\Layout\PROC055B_Cascade_Radar_Host.PcbDoc
Warnings: 0
Rule Violations: 0
Waived Violations: 20

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=20mil) (InNet('GND_CHASSIS')),(All) 0
Clearance Constraint (Gap=20mil) (InPadClass('MH')),(All) 0
Clearance Constraint (Gap=3mil) (InPoly and InLayerClass('GNDs')),(isvia) 0
Clearance Constraint (Gap=20mil) (InPoly and InLayerClass('GNDs')),(InPadClass('MH')) 0
Clearance Constraint (Gap=6mil) (IsThruPin),(InPoly and InLayerClass('GNDs')) 0
Clearance Constraint (Gap=3.3mil) (InAnyDifferentialPair),(InAnyDifferentialPair And Not InComponent('U22')) 0
Clearance Constraint (Gap=3mil) (IsTrack),(IsTrack) 0
Clearance Constraint (Gap=5mil) (((IsTrack Or IsArc) And Not InPoly) And IsFree and IsKeepOut),(((IsTrack Or IsArc) And Not InPoly) And IsFree and IsKeepOut) 0
Clearance Constraint (Gap=4mil) (WithinRoom('FPGA1') or WithinRoom('FPGA_2') or WithinRoom('FPGA_3') or WithinRoom('FPGA_4')),(WithinRoom('FPGA1') or WithinRoom('FPGA_2') or WithinRoom('FPGA_3') or WithinRoom('FPGA_4')) 0
Clearance Constraint (Gap=10mil) (InPolygon),(All) 0
Clearance Constraint (Gap=0mil) (HasFootprint('Fiducial10-20') and IsPad),(IsKeepOut and IsArc) 0
Clearance Constraint (Gap=4mil) (InPoly and InLayerClass('GNDs')),(InPadClass('USB pad')) 0
Clearance Constraint (Gap=3mil) (InNet('TDA_VDD_MPU') And OnLayer('L16 Signal')),(IsVia) 0
Clearance Constraint (Gap=3.5mil) (IsVia or ispad or (InLayerClass('External layers') and (IsTrack or IsArc))),((InLayerClass('External layers') and (IsTrack or IsArc)) or IsVia) 0
Clearance Constraint (Gap=7mil) (IsThruPin),(All and InLayerClass('External layers')) 0
Clearance Constraint (Gap=6mil) ((InDrillLayerPair('L1 Top Layer - L2 GND') or InDrillLayerPair('L2 GND - L3 Signal') or InDrillLayerPair('L20 Signal - L21 GND') or InDrillLayerPair('L21 GND - L22 Bottom')) and isvia),(InPoly and InLayerClass('GNDs')) 0
Clearance Constraint (Gap=30mil) (IsPad and InNet('GND_CHASSIS')),(InPoly and InLayerClass('GNDs')) 0
Clearance Constraint (Gap=10mil) (InPoly and InLayerClass('GNDs')),(InNet('GND_CHASSIS') and isvia) 0
Clearance Constraint (Gap=3mil) (All),(All) 0
Clearance Constraint (Gap=25mil) (InPadClass('MHPTH')),(InPoly and InLayerClass('GNDs')) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Modified Polygon (Allow modified: No), (Allow shelved: No) 0
Width Constraint (Min=4.3mil) (Max=100mil) (Preferred=4.5mil) (All) 0
Width Constraint (Min=3.7mil) (Max=10mil) (Preferred=10mil) (InNetClass('100ohm_Pairs')) 0
Routing Layers(All) 0
Routing Via (MinHoleWidth=7.874mil) (MaxHoleWidth=12.992mil) (PreferredHoleWidth=7.874mil) (MinWidth=19.685mil) (MaxWidth=23.622mil) (PreferedWidth=19.685mil) (IsVia and InAnyComponent) 0
Routing Via (MinHoleWidth=4mil) (MaxHoleWidth=40mil) (PreferredHoleWidth=8mil) (MinWidth=10mil) (MaxWidth=65mil) (PreferedWidth=18mil) (All) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=14.25mil) (Max=17.25mil) (Prefered=17.25mil) and Width Constraints (Min=4.3mil) (Max=5.75mil) (Prefered=4.5mil) (InNetClass('Loosly_Coupled_Pairs')) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=6.4mil) (Max=7.4mil) (Prefered=6.9mil) and Width Constraints (Min=4.6mil) (Max=5.6mil) (Prefered=5.1mil) (InNetClass('90ohm_Pairs')) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=7.4mil) (Max=8.3mil) (Prefered=7.8mil) and Width Constraints (Min=3.7mil) (Max=4.6mil) (Prefered=4mil) (InNetClass('100ohm_Pairs')) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (InPadClass('GND-Plane')) 0
Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (InNet('GND')) 0
Power Plane Connect Rule(Direct Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Minimum Annular Ring (Minimum=0.9mil) (InComponent('MP1')) 0
Minimum Annular Ring (Minimum=7.5mil) (All) 0
Minimum Annular Ring (Minimum=3mil) (InDrillLayerPair('L1 Top Layer - L2 GND') or InDrillLayerPair('L2 GND - L3 Signal') or InDrillLayerPair('L20 Signal - L21 GND') or InDrillLayerPair('L21 GND - L22 Bottom')) 0
Minimum Annular Ring (Minimum=4.45mil) (IsVia) 0
Acute Angle Constraint (Minimum=45.000) (All) 0
Hole Size Constraint (Min=7.874mil) (Max=251mil) (All) 0
Hole Size Constraint (Min=4mil) (Max=4mil) (InDrillLayerPair('L1 Top Layer - L2 GND') or InDrillLayerPair('L2 GND - L3 Signal') or InDrillLayerPair('L20 Signal - L21 GND') or InDrillLayerPair('L21 GND - L22 Bottom')) 0
Pads and Vias to follow the Drill pairs settings 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Minimum Solder Mask Sliver (Gap=4mil) (All),(All) 0
Minimum Solder Mask Sliver (Gap=3mil) (InComponentClass('Logo')),(InComponentClass('Logo')) 0
Silk To Solder Mask (Clearance=3mil) (All),(All) 0
Silk To Solder Mask (Clearance=3mil) ((IsPad or IsFill or IsRegion) and InAnycomponent),(All) 0
Silk to Silk (Clearance=4mil) (All),(All) 0
Silk to Silk (Clearance=0mil) ((HasFootprint('Pb-Free_Overlay_Medium') OR HasFootprint('Pb-Free_Overlay_Small'))),((HasFootprint('Pb-Free_Overlay_Medium') OR HasFootprint('Pb-Free_Overlay_Small'))) 0
Net Antennae (Tolerance=0mil) (All) 0
Board Clearance Constraint (Gap=0mil) (OnCopper and Not InComponentClass('Logo') and not InComponentClass('FiducialMark') and not InRegion(1000,500,4000,800) and not InPoly) 0
Board Clearance Constraint (Gap=0mil) (OnCopper and IsPoly) 0
Board Clearance Constraint (Gap=0mil) (OnCopper and InComponentClass('Mounting Holes')) 0
Component Clearance Constraint ( Horizontal Gap = 4mil, Vertical Gap = 10mil ) (InComponent('C200') or InComponent('C226') or InComponent('C220') or InComponent('C216') or InComponent('C217') or InComponent('C230') or InComponent('C545') or InComponent('C559') or InComponent('L42') or InComponent('R393') or InComponent('Q6') or InComponent('R103') or InComponent('U49') or InComponent('C597') or InComponent('U20') or InComponent('R105') or InComponent('U43') or InComponent('R306') or InComponent('R102')),(InComponent('C200') or InComponent('C226') or InComponent('C220') or InComponent('C216') or InComponent('C217') or InComponent('C230') or InComponent('C545') or InComponent('C559') or InComponent('L42') or InComponent('R393') or InComponent('Q6') or InComponent('R103') or InComponent('U49') or InComponent('C597') or InComponent('U20') or InComponent('R105') or InComponent('U43') or InComponent('R306') or InComponent('R102')) 0
Component Clearance Constraint ( Horizontal Gap = 0mil, Vertical Gap = 0mil ) (HasFootprint('TP_SM_1MM')),(All) 0
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (All),(All) 0
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 30mil ) (IsThruComponent),(IsThruComponent) 0
Component Clearance Constraint ( Horizontal Gap = 5mil, Vertical Gap = Infinite ) (InComponentClass('Mounting Holes')),(All) 0
Component Clearance Constraint ( Horizontal Gap = 5mil, Vertical Gap = 5mil ) (IsThruComponent),(IsSMTComponent) 0
Component Clearance Constraint ( Horizontal Gap = 5mil, Vertical Gap = 10mil ) (HasFootprint('0201*') or HasFootprint('0402*') or HasFootprint('0508') or HasFootprint('0603*') or HasFootprint('0612') or HasFootprint('0805*') or HasFootprint('0815*') or HasFootprint('0830*') or HasFootprint('1206*') or HasFootprint('1210*') or HasFootprint('1808*') or HasFootprint('1812*') or HasFootprint('1825*') or HasFootprint('2010*') or HasFootprint('2220*') or HasFootprint('2225*') or HasFootprint('2512*') or HasFootprint('2728*') or HasFootprint('3518*')),(HasFootprint('0201*') or HasFootprint('0402*') or HasFootprint('0508') or HasFootprint('0603*') or HasFootprint('0612') or HasFootprint('0805*') or HasFootprint('0815*') or HasFootprint('0830*') or HasFootprint('1206*') or HasFootprint('1210*') or HasFootprint('1808*') or HasFootprint('1812*') or HasFootprint('1825*') or HasFootprint('2010*') or HasFootprint('2220*') or HasFootprint('2225*') or HasFootprint('2512*') or HasFootprint('2728*') or HasFootprint('3518*')) 0
Component Clearance Constraint ( Horizontal Gap = 0mil, Vertical Gap = 0mil ) (InComponentClass('Header')),(InComponentClass('Shunt')) 0
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (InComponentClass('Mounting Holes')),(InComponentClass('FiducialMark')) 0
Component Clearance Constraint ( Horizontal Gap = 0mil, Vertical Gap = 0mil ) (HasFootprint('Keystone_8418')),(HasFootprint('B-F_PMSSS_632_0038_PH')) 0
Component Clearance Constraint ( Horizontal Gap = 50mil, Vertical Gap = 10mil ) (InComponentClass('Logo')),(All) 0
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All) 0
Total 0

Waived Violations Count
Minimum Solder Mask Sliver (Gap=4mil) (All),(All) 6
Silk To Solder Mask (Clearance=3mil) (All),(All) 2
Silk To Solder Mask (Clearance=3mil) ((IsPad or IsFill or IsRegion) and InAnycomponent),(All) 7
Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (All),(All) 5
Total 20

Rule Violations

Waived Violations

Minimum Solder Mask Sliver (Gap=4mil) (All),(All)
Minimum Solder Mask Sliver Constraint: (3.192mil < 4mil) Between Pad C11-1(2474.456mil,1459.798mil) on L22 Bottom And Pad C14-1(2494.047mil,1459.798mil) on L22 Bottom [Bottom Solder] Mask Sliver [3.192mil]
Waived by at 13-06-2019 16:21:13
Minimum Solder Mask Sliver Constraint: (3.192mil < 4mil) Between Pad C11-2(2474.456mil,1481.846mil) on L22 Bottom And Pad C14-2(2494.047mil,1481.846mil) on L22 Bottom [Bottom Solder] Mask Sliver [3.192mil]
Waived by at 13-06-2019 16:21:13
Minimum Solder Mask Sliver Constraint: (3.192mil < 4mil) Between Pad C46-1(4364.221mil,1468.657mil) on L22 Bottom And Pad C49-1(4383.811mil,1468.657mil) on L22 Bottom [Bottom Solder] Mask Sliver [3.192mil]
Waived by at 13-06-2019 16:21:13
Minimum Solder Mask Sliver Constraint: (3.192mil < 4mil) Between Pad C46-2(4364.221mil,1490.704mil) on L22 Bottom And Pad C49-2(4383.811mil,1490.704mil) on L22 Bottom [Bottom Solder] Mask Sliver [3.192mil]
Waived by at 13-06-2019 16:21:13
Minimum Solder Mask Sliver Constraint: (3.192mil < 4mil) Between Pad C81-1(4265.796mil,4058.224mil) on L22 Bottom And Pad C84-1(4285.386mil,4058.224mil) on L22 Bottom [Bottom Solder] Mask Sliver [3.192mil]
Waived by at 13-06-2019 16:21:13
Minimum Solder Mask Sliver Constraint: (3.192mil < 4mil) Between Pad C81-2(4265.796mil,4080.271mil) on L22 Bottom And Pad C84-2(4285.386mil,4080.271mil) on L22 Bottom [Bottom Solder] Mask Sliver [3.192mil]
Waived by at 13-06-2019 16:21:13
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Silk To Solder Mask (Clearance=3mil) (All),(All)
Silk To Solder Mask Clearance Constraint: (1.33mil < 3mil) Between Pad Free-1(1901.464mil,400.262mil) on Multi-Layer And Track (1735mil,296.732mil)(1885mil,296.732mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [1.33mil]
Waived by at 13-06-2019 16:21:13
Silk To Solder Mask Clearance Constraint: (1.33mil < 3mil) Between Pad Free-1(1901.464mil,400.262mil) on Multi-Layer And Track (1885mil,155mil)(1885mil,296.732mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [1.33mil]
Waived by at 13-06-2019 16:21:13
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Silk To Solder Mask (Clearance=3mil) ((IsPad or IsFill or IsRegion) and InAnycomponent),(All)
Silk To Solder Mask Clearance Constraint: (2.661mil < 3mil) Between Pad C574-1(5112.102mil,352.453mil) on L22 Bottom And Track (5093.504mil,342.52mil)(5093.504mil,397.638mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.661mil]
Waived by at 27-04-2021 14:16:44
Silk To Solder Mask Clearance Constraint: (2.661mil < 3mil) Between Pad C574-2(5112.102mil,387.453mil) on L22 Bottom And Track (5093.504mil,342.52mil)(5093.504mil,397.638mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.661mil]
Waived by at 27-04-2021 14:16:44
Silk To Solder Mask Clearance Constraint: (2.062mil < 3mil) Between Pad C579-1(4995.35mil,529.882mil) on L22 Bottom And Track (4986.551mil,547.881mil)(5041.669mil,547.881mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.062mil]
Waived by at 27-04-2021 14:16:44
Silk To Solder Mask Clearance Constraint: (2.062mil < 3mil) Between Pad C579-2(5030.35mil,529.882mil) on L22 Bottom And Track (4986.551mil,547.881mil)(5041.669mil,547.881mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.062mil]
Waived by at 27-04-2021 14:16:44
Silk To Solder Mask Clearance Constraint: (1.59mil < 3mil) Between Pad R306-1(5142.102mil,352.453mil) on L22 Bottom And Track (5159.63mil,359.315mil)(5159.63mil,414.433mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [1.59mil]
Waived by at 27-04-2021 14:16:44
Silk To Solder Mask Clearance Constraint: (1.59mil < 3mil) Between Pad R306-2(5142.102mil,387.453mil) on L22 Bottom And Track (5159.63mil,359.315mil)(5159.63mil,414.433mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [1.59mil]
Waived by at 27-04-2021 14:16:44
Silk To Solder Mask Clearance Constraint: (2.817mil < 3mil) Between Pad R520-2(3288.426mil,1976.627mil) on L22 Bottom And Track (3269.672mil,1824.862mil)(3269.672mil,1970.531mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [2.817mil]
Waived by at 27-04-2021 14:16:44
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Component Clearance Constraint ( Horizontal Gap = 10mil, Vertical Gap = 10mil ) (All),(All)
Component Clearance Constraint: (Collision < 10mil) Between BGA Component U22-X5777BXGABC (3237.204mil,2850.394mil) on L22 Bottom And SMT Small Component MP2-BDN10-3CB/A01 (3237.204mil,2850.394mil) on L22 Bottom
Waived by Alec Schott at 19-09-2019 00:36:16
Component Clearance Constraint: (Collision < 10mil) Between SMT Small Component C426-GRM188Z71A475ME15D (2712.598mil,3011.811mil) on L22 Bottom And SMT Small Component MP2-BDN10-3CB/A01 (3237.204mil,2850.394mil) on L22 Bottom
Waived by Alec Schott at 19-09-2019 00:36:40
Component Clearance Constraint: (Collision < 10mil) Between SMT Small Component C501-GRM188Z71A475ME15D (3772.638mil,3284.606mil) on L22 Bottom And SMT Small Component MP2-BDN10-3CB/A01 (3237.204mil,2850.394mil) on L22 Bottom
Waived by Alec Schott at 19-09-2019 00:39:50
Component Clearance Constraint: (Collision < 10mil) Between SMT Small Component C502-GRM188Z71A475ME15D (3772.638mil,3241.299mil) on L22 Bottom And SMT Small Component MP2-BDN10-3CB/A01 (3237.204mil,2850.394mil) on L22 Bottom
Waived by Alec Schott at 19-09-2019 00:37:08
Component Clearance Constraint: (Collision < 10mil) Between SMT Small Component C503-C2012X6S1A226M125AC (3772.638mil,3182.244mil) on L22 Bottom And SMT Small Component MP2-BDN10-3CB/A01 (3237.204mil,2850.394mil) on L22 Bottom
Waived by Alec Schott at 19-09-2019 00:37:22
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