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Design Rule Verification Report

Date : 3/19/2015
Time : 5:21:05 PM
Elapsed Time : 00:00:05
Filename : D:\Project Files\TIDA-00440T\DESIGN FILES\20150319\TIDA-00440MB\TIDA-00440MB.PcbDoc
Warnings : 0
Rule Violations : 34

Summary

Warnings Count
Total 0

Rule Violations Count
Width Constraint (Min=10mil) (Max=40mil) (Preferred=25mil) (InNetClass('PWR and GND')) 0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=15mil) (All) 0
Clearance Constraint (Gap=15mil) (InPolygon),(All) 0
Clearance Constraint (Gap=8mil) (IsVia),(IsSMTPin) 0
Clearance Constraint (Gap=8mil) (IsVia),(IsVia) 0
Net Antennae (Tolerance=0mil) (All) 0
Silk to Silk (Clearance=0mil) (All),(All) 0
Silkscreen Over Component Pads (Clearance=5mil) (All),(All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=10mil) (Max=100mil) (Preferred=10mil) (All) 0
Hole Size Constraint (Min=7mil) (Max=300mil) (All) 0
Component Clearance Constraint ( Horizontal Gap = 30mil, Vertical Gap = 10mil ) (All),(All) 2
Component Clearance Constraint ( Horizontal Gap = 118.11mil, Vertical Gap = 30mil ) (IsThruComponent),(IsThruComponent) 3
Component Clearance Constraint ( Horizontal Gap = 50mil, Vertical Gap = 30mil ) (IsThruComponent),(IsSMTComponent) 4
Component Clearance Constraint ( Horizontal Gap = 20mil, Vertical Gap = 10mil ) (HasFootprint('0201*') or HasFootprint('0402*') or HasFootprint('0508') or HasFootprint('0603*') or HasFootprint('0612') or HasFootprint('0805*') or HasFootprint('0815*') or HasFootprint('0830*') or HasFootprint('1206*') or HasFootprint('1210*') or HasFootprint('1808*') or HasFootprint('1812*') or HasFootprint('1825*') or HasFootprint('2010*') or HasFootprint('2220*') or HasFootprint('2225*') or HasFootprint('2512*') or HasFootprint('2728*') or HasFootprint('3518*')),(HasFootprint('0201*') or HasFootprint('0402*') or HasFootprint('0508') or HasFootprint('0603*') or HasFootprint('0612') or HasFootprint('0805*') or HasFootprint('0815*') or HasFootprint('0830*') or HasFootprint('1206*') or HasFootprint('1210*') or HasFootprint('1808*') or HasFootprint('1812*') or HasFootprint('1825*') or HasFootprint('2010*') or HasFootprint('2220*') or HasFootprint('2225*') or HasFootprint('2512*') or HasFootprint('2728*') or HasFootprint('3518*')) 0
Component Clearance Constraint ( Horizontal Gap = 250mil, Vertical Gap = Infinite ) (InComponentClass('Mounting Holes')),(All) 3
Component Clearance Constraint ( Horizontal Gap = 5mil, Vertical Gap = 10mil ) ((HasFootprint('NY PMS 440 0025 PH'))),((HasFootprint('Keystone_1902C'))) 0
Component Clearance Constraint ( Horizontal Gap = 50mil, Vertical Gap = 10mil ) (InComponentClass('Logo')),(All) 0
Component Clearance Constraint ( Horizontal Gap = 0mil, Vertical Gap = 0mil ) (InComponentClass('Header')),(InComponentClass('Shunt')) 0
SMD To Corner (Distance=3mil) (All) 10
Acute Angle Constraint (Minimum=45.000) (All) 2
Minimum Annular Ring (Minimum=5.905mil) (All) 0
Minimum Annular Ring (Minimum=5.905mil) (IsVia and InAnyComponent) 0
Un-Routed Net Constraint ( (All) ) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Routing Via (MinHoleWidth=12mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=12mil) (MinWidth=26mil) (MaxWidth=40mil) (PreferedWidth=26mil) (All) 10
Routing Layers(All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=10mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Clearance Constraint (Gap=15mil) (InPolygon),(InPolygon) 0
Clearance Constraint (Gap=8mil) ((InPadClass('Less than 9 Mil Clearance'))),((InPadClass('All Pads'))) 0
Clearance Constraint (Gap=5mil) (All),(All) 0
Total 34


Component Clearance Constraint ( Horizontal Gap = 30mil, Vertical Gap = 10mil ) (All),(All)
Component Q1-TR-CSD13202Q2 (2977.8mil,255mil) on Top Layer Component Q2-TR-CSD13202Q2 (2966mil,465mil) on Top Layer
SMT Small Component ZZ2-These assemblies are ESD sensitive, ESD precautions shall be observed. (180mil,4740mil) on Top Layer SMT Small Component ZZ1-This Assembly Note is for PCB labels only (180mil,4810mil) on Top Layer
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Component Clearance Constraint ( Horizontal Gap = 118.11mil, Vertical Gap = 30mil ) (IsThruComponent),(IsThruComponent)
Small Component J8-282834-2 (4625mil,830mil) on Top Layer DIP Component S1-78B04ST (4606.001mil,374.535mil) on Top Layer
Small Component J3-3267 (3336mil,1265mil) on Top Layer DIP Component K1-G2RL-2 DC5 (2946mil,1770mil) on Top Layer
Small Component J4-3267 (3335mil,2275mil) on Top Layer DIP Component K1-G2RL-2 DC5 (2946mil,1770mil) on Top Layer
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Component Clearance Constraint ( Horizontal Gap = 50mil, Vertical Gap = 30mil ) (IsThruComponent),(IsSMTComponent)
DIP Component K1-G2RL-2 DC5 (2946mil,1770mil) on Top Layer SMT Small Component R36-ERJ-6GEY0R00V (2315mil,1622mil) on Top Layer
Component Q3-2DD1664R-13 (2252mil,1833mil) on Top Layer DIP Component K1-G2RL-2 DC5 (2946mil,1770mil) on Top Layer
Small Component SW-TP-032_RND (3815mil,3550mil) on Top Layer SMT Small Component C22-C2012C0G1E103J (3720mil,3610mil) on Top Layer
Component U6-LM5160ADNTR (3930mil,3680mil) on Top Layer Small Component SW-TP-032_RND (3815mil,3550mil) on Top Layer
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Component Clearance Constraint ( Horizontal Gap = 250mil, Vertical Gap = Infinite ) (InComponentClass('Mounting Holes')),(All)
SMT Small Component FID5-Fiducial (180mil,3700mil) on Bottom Layer Small Component H3-NY PMS 440 0025 PH (206mil,4127mil) on Top Layer
SMT Small Component FID2-Fiducial (180mil,3700mil) on Top Layer Small Component H3-NY PMS 440 0025 PH (206mil,4127mil) on Top Layer
Small Component H4-NY PMS 440 0025 PH (206mil,740mil) on Top Layer Small Component JD1-5-534206-1 (257.756mil,1169mil) on Top Layer
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SMD To Corner (Distance=3mil) (All)
SMD To Corner Constraint (2.5mil < 3mil) : Pad R28-2(4225mil,3041mil) Top Layer
SMD To Corner Constraint (0.132mil < 3mil) : Pad C8-1(4330mil,3131mil) Top Layer
SMD To Corner Constraint (3mil < 3mil) : Pad C2-2(2704mil,2742mil) Top Layer
SMD To Corner Constraint (3mil < 3mil) : Pad C6-1(2486mil,773mil) Top Layer
SMD To Corner Constraint (1.514mil < 3mil) : Pad C5-1(4326mil,870mil) Top Layer
SMD To Corner Constraint (2.913mil < 3mil) : Pad U6-5(4004.803mil,3709.528mil) Top Layer
SMD To Corner Constraint (2.913mil < 3mil) : Pad U6-8(3855.197mil,3709.528mil) Top Layer
SMD To Corner Constraint (2.3mil < 3mil) : Pad U10-2(2796mil,856.3mil) Top Layer
SMD To Corner Constraint (2.034mil < 3mil) : Pad C36-2(3540mil,3055mil) Bottom Layer
SMD To Corner Constraint (2.139mil < 3mil) : Pad C36-1(3540mil,3135mil) Bottom Layer
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Acute Angle Constraint (Minimum=45.000) (All)
Acute Angle Constraint Between Pad on TopLayer And Track on TopLayer
Acute Angle Constraint Between Pad on TopLayer And Track on TopLayer
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Routing Via (MinHoleWidth=12mil) (MaxHoleWidth=20mil) (PreferredHoleWidth=12mil) (MinWidth=26mil) (MaxWidth=40mil) (PreferedWidth=26mil) (All)
Routing Via Style: Via (1381.535mil,4135mil) Top Layer to Bottom Layer
Routing Via Style: Via (1415mil,4135mil) Top Layer to Bottom Layer
Routing Via Style: Via (1415mil,4085.787mil) Top Layer to Bottom Layer
Routing Via Style: Via (1415mil,4184.213mil) Top Layer to Bottom Layer
Routing Via Style: Via (1448.465mil,4135mil) Top Layer to Bottom Layer
Routing Via Style: Via (3930mil,3680mil) Top Layer to Bottom Layer
Routing Via Style: Via (3890.63mil,3680mil) Top Layer to Bottom Layer
Routing Via Style: Via (3969.37mil,3680mil) Top Layer to Bottom Layer
Routing Via Style: Via (3930mil,3727.244mil) Top Layer to Bottom Layer
Routing Via Style: Via (3930mil,3632.756mil) Top Layer to Bottom Layer
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