BDE Technology Inc.

Wireless connectivity solution provider

BDE Technology was founded in 2009 in Chicago, Illinois. The company specializes in wireless technologies, particularly Wi-Fi, Bluetooth, Bluetooth Low Energy, Zigbee, Thread, Sub-1 GHz, Wi-SUN, Amazon Sidewalk, Matter, RFID and NB-IoT etc. BDE is committed to providing wireless IoT modules and solutions to OEMs, system integrators, device manufacturers and solution providers worldwide. 

BDE is a Texas Instruments (TI) authorized third party module provider. BDE provides across-the-board TI wireless modules. For every TI wireless IC, BDE builds a series of modules around it. Working closely with TI wireless BU, BDE synchronizes the module development progress with that of the chips. The modules are sampled and released to the market at the same time as the ICs.

BDE is a Bluetooth SIG recommended service provider for Prequalified Components, OEM & ODM Products & Reference Designs and Software Application Development.

Equipped with BDE’s innovative products and outstanding services which include wireless modules, HW/SW custom design services, certification services and world class expertise, customers are able to shorten development cycles, reduce design uncertainty, lower market risk, minimize cost, and release more competitive products into markets quickly. BDE`s flexible, highly integrated products and solutions are able to be customized to the most demanding requirements in numerous IoT devices and applications in the fields of industrial automation, medical and health care, automotive, smart energy, smart building, home automation, sports & fitness and consumer electronics etc.

Wi-Fi 產品
CC2564C 具有基本速率 (BR)、強化數據速率 (EDR)、低功耗 (LE) 的 Bluetooth® 5.1 CC3300 SimpleLink™ Wi-Fi 6 配套 IC CC3301 SimpleLink™ Wi-Fi 6 和 Bluetooth® 低耗能配套 IC CC3350 SimpleLink™ 雙頻 (2.4 和 5 GHz) Wi-Fi 6 配套 IC CC3351 SimpleLink™ 雙頻 (2.4 和 5 GHz) Wi-Fi 6 與 Bluetooth® 低功耗配套 IC WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組

 

低耗電 2.4-GHz 產品
CC2340R2 具有 256kB 快閃記憶體的 SimpleLink™ 32 位元 Arm® Cortex®-M0+ Bluetooth® 低耗能無線 MCU CC2340R5 具 512-kB 快閃記憶體的 SimpleLink™ 32 位元 Arm® Cortex®-M0+ Bluetooth® 低耗能無線 MCU
聯絡
提供的資源
  • 子卡
支援的區域
  • 中國
  • 亞洲其他國家
  • 北美
  • 日本
  • 歐洲
  • 非洲
總部
  • 67 E Madison St
  • #1603A
  • Chicago, Illinois, 60603
  • United States

資源

子卡

BDE-3P-SUB1GHZ — BDE Sub-1Ghz 模組

VDE Technology Inc. 是 TI 認證的第三方模組供應商。BDE 的模組以 TI 的 CC1XXX Sub-1Ghz 無線連線產品為基礎,讓客戶可縮短開發週期、減少設計不確定性、降低產品成本,並能有效推出具競爭力的產品。BDE 專精於提供超低功耗無線通訊技術,例如 Amazon Sidewalk、Wi-SUN、mioty 和無線 M-Bus 給全球的 OEM、系統整合商、裝置製造商和解決方案供應商。

子卡

BDE-3P-WIRELESS-MODULES — BDE SimpleLink MCU modules

BDE Technology, Inc. is a TI-certified third-party module provider. Based on TI's CCXXXX wireless connectivity products, BDE's modules allow customers to shorten development cycles, reduce design uncertainty, lower production cost and release more competitive products into markets quickly (...)

免責聲明

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