- 20-ns Read, 13.8-ns Write Through Maximum Access Time
- Functionally Compatible With Commercial
512K x 32 SRAM Devices - Built-In EDAC (Error Detection and Correction) to Mitigate Soft Errors
- Built-In Scrub Engine for Autonomous Correction
- CMOS Compatible Input and Output Level, Three State Bidirectional
Data Bus - 3.3 ±0.3-V I/O, 1.8 ±0.15-V CORE
- Radiation Performance(1)
- Uses Both Substrate Engineering and Radiation Hardened by Design (HBD)(2)
- TID Immunity > 3e5 rad (Si)
- SER < 5e-17 Upsets/Bit-Day (Core Using EDAC and Scrub)(3)
- Latch up immunity > LET = 110 MeV (T = 398K)
Available in a 76-Lead Ceramic Quad Flatpack Engineering Evaluation (/EM) Samples are Available(4) (1) Radiation tolerance is a typical value based upon initial device qualification. Radiation Data and Lot Acceptance Testing is available – contact factory for details.
(2) HardSIL™ technology and memory design under a license agreement with Silicon Space Technology (SST).
(3) SER calculated using CREME96 for geosynchronous orbit,
solar minimum.
(4) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (e.g. no burn-in, etc.) and are tested to temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance on full MIL specified temperature range of –55°C to 125°C or operating life.