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The 'BCT8240A scan test devices with octal buffers are members of the Texas Instruments SCOPETM testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.
In the normal mode, these devices are functionally equivalent to the 'F240 and 'BCT240 octal buffers. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device terminals or to perform a self test on the boundary-test cells. Activating the TAP in normal mode does not affect the functional operation of the SCOPETM octal buffers.
In the test mode, the normal operation of the SCOPETM octal buffers is inhibited and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry can perform boundary-scan test operations, as described in IEEE Standard 1149.1-1990.
Four dedicated test terminals control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry performs other testing functions such as parallel-signature analysis (PSA) on data inputs and pseudo-random pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.
The SN54BCT8240A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT8240A is characterized for operation from 0°C to 70°C.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | Scan Test Devices With Octal Inverting Buffers datasheet (Rev. E) | 01 Dec 1996 | |
| * | SMD | SN54BCT8240A SMD 5962-91746 | 21 Jun 2016 | |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 26 Jul 2021 | ||
| Selection guide | Logic Guide (Rev. AB) | 12 Jun 2017 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 Dec 2015 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 Jan 2007 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 Jul 2004 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 29 Aug 2002 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 01 Aug 1997 | ||
| Application note | Designing With Logic (Rev. C) | 01 Jun 1997 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 01 Oct 1996 | ||
| Application note | Live Insertion | 01 Oct 1996 |
For additional terms or required resources, click any title below to view the detail page where available.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| CDIP (JT) | 24 | Ultra Librarian |
| LCCC (FK) | 28 | Ultra Librarian |
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