Product details

Technology family GTL Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
Technology family GTL Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (PW) 28 62.08 mm² 9.7 x 6.4
  • Operates as a GTL-/GTL/GTL+ to LVTTL or LVTTL to GTL-/GTL/GTL+ Translator
  • Series Termination on TTL Output of 30
  • Latch-Up Testing Done to JEDEC Standard JESD 78
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Xeon is a trademark of Intel Corporation.

  • Operates as a GTL-/GTL/GTL+ to LVTTL or LVTTL to GTL-/GTL/GTL+ Translator
  • Series Termination on TTL Output of 30
  • Latch-Up Testing Done to JEDEC Standard JESD 78
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Xeon is a trademark of Intel Corporation.

The SN74GTL2107 is a 12-bit translator that interfaces between the 3.3-V LVTTL chip set I/O and the Xeon™ processor GTL-/GTL/GTL+ I/O. The device is designed for platform health management in dual-processor applications.

The SN74GTL2107 is a 12-bit translator that interfaces between the 3.3-V LVTTL chip set I/O and the Xeon™ processor GTL-/GTL/GTL+ I/O. The device is designed for platform health management in dual-processor applications.

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Technical documentation

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Type Title Date
* Data sheet SN74GTL2107 datasheet 01 Jul 2006
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 Jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 Jul 2024
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
User guide GTLP/GTL Logic High-Performance Backplane Drivers Data Book (Rev. A) 15 Sep 2001
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001
Application note GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A) 01 Mar 1997
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

HSPICE Model for SN74GTL2107

SCLM102.ZIP (109 KB) - HSpice Model
Simulation model

SN74GTL2107 IBIS Model

SLLM075.ZIP (32 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 28 Ultra Librarian

Ordering & quality

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Information included:
  • Fab location
  • Assembly location

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