Packaging information
| Package | Pins USON (DRY) | 6 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 5,000 | LARGE T&R |
Features for the SN74LVC1G11
- Latch-up performance exceeds 100mA per JESD 78, class II
- ESD protection exceeds JESD 22
- ±2000V human-body model (A114-A)
- ±1000V charged-device model (C101)
- Available in the Texas Instruments NanoFree™ package
- Supports 5V VCC operation
- Inputs accept voltages to 5.5V
- Maximum tpd of 4.1ns at 3.3V
- Low power consumption, 10µA maximum ICC
- ±24mA output drive at 3.3V
- Ioff supports partial-power-down mode operation
Description for the SN74LVC1G11
The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = /A + /B + /C in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.